Variable capacitance capacitor, circuit module, and communications apparatus

    公开(公告)号:US20060018082A1

    公开(公告)日:2006-01-26

    申请号:US11169227

    申请日:2005-06-27

    IPC分类号: H01G4/06

    CPC分类号: H01G5/38

    摘要: A variable capacitance capacitor has a plurality of variable capacitance elements, using a thin-film dielectric layer whose dielectric constant varies with voltage application, connected in series with one another between the high-frequency signal input and output terminals. The first bias lines belonging to a high-potential side and the second bias lines belonging to a low-potential side, in terms of voltage application, are connected, alternately, to electrodes of the variable capacitance elements connected one another and electrodes in the array of the series-connected variable capacitance elements connected respectively to the input terminal and the output terminal.

    Dielectric filter having coupling means disposed on a laminated substrate
    23.
    发明授权
    Dielectric filter having coupling means disposed on a laminated substrate 失效
    具有设置在层压基板上的耦合装置的介质滤波器

    公开(公告)号:US5374910A

    公开(公告)日:1994-12-20

    申请号:US982788

    申请日:1992-11-30

    IPC分类号: H01P1/205 H01P1/202

    CPC分类号: H01P1/2053

    摘要: A dielectric filter comprises a filtering member made up of resonators, intercoupled through a laminated substrate joined to the filtering member and containing interlaminal patterned conductive platings constituting capacitive and inductive elements. Electric field leakage arising among the conductive platings is reduced, improving the effective dielectric constant of the substrate. The extent of the conductive platings providing desired capacitance and selected electrical length is reducible, to decrease the size of the substrate. Furthermore, the substrate construction prevents foreign matter from becoming lodged on, or even from being brought into contact with, the conductive platings, stabilizing capacitive coupling.

    摘要翻译: 介质滤波器包括由谐振器构成的滤波构件,通过与滤波构件连接的层叠基板相互耦合并且包含构成电容和电感元件的层间导电电镀层。 在导电电镀中产生的电场泄漏减少,提高了衬底的有效介电常数。 提供所需电容和所选电长度的导电电镀的程度可以减小,以减小基片的尺寸。 此外,基板结构防止异物与导电性电镀层接触,甚至与导体电镀接触,稳定电容耦合。