摘要:
A conductor layer 10 is provided so as to prevent pyroelectric destruction occurring in the steps of manufacturing a surface acoustic wave element 1 on the other surface opposite to an IDT electrode formation surface of a piezoelectric substrate 2. At this time, the conductor layer 10 is formed, except for a region 5a opposed to an input electrode section 5 in a filter region 9 and/or a region 6a opposed to an output electrode section 6. This allows a coupling amount between the input electrode section 5 and the output electrode section 6 due to a parasitic capacitance formed between the input electrode section 5 and the output electrode section 6 in the filter region 9 to be reduced, thereby allowing the out-of-band attenuation characteristics of a surface acoustic wave device to be improved.
摘要:
A variable capacitance capacitor has a plurality of variable capacitance elements, using a thin-film dielectric layer whose dielectric constant varies with voltage application, connected in series with one another between the high-frequency signal input and output terminals. The first bias lines belonging to a high-potential side and the second bias lines belonging to a low-potential side, in terms of voltage application, are connected, alternately, to electrodes of the variable capacitance elements connected one another and electrodes in the array of the series-connected variable capacitance elements connected respectively to the input terminal and the output terminal.
摘要:
A dielectric filter comprises a filtering member made up of resonators, intercoupled through a laminated substrate joined to the filtering member and containing interlaminal patterned conductive platings constituting capacitive and inductive elements. Electric field leakage arising among the conductive platings is reduced, improving the effective dielectric constant of the substrate. The extent of the conductive platings providing desired capacitance and selected electrical length is reducible, to decrease the size of the substrate. Furthermore, the substrate construction prevents foreign matter from becoming lodged on, or even from being brought into contact with, the conductive platings, stabilizing capacitive coupling.