公开(公告)号：US20220108964A1

公开(公告)日：2022-04-07

申请号：US17493264

申请日：2021-10-04

Applicant: Rambus Inc.

Inventor： Dongyun Lee ,  Ming Li

IPC: H01L23/00 ,  H01L25/065 ,  H01L21/66 ,  G11C29/12

Abstract: Semiconductor devices, packaging architectures and associated methods are disclosed. In one embodiment, a semiconductor device is disclosed. The semiconductor device includes a first semiconductor die having a first bonding surface that is formed with a first set of contacts patterned with a first connection pitch. A second semiconductor die has a second bonding surface that is formed with a second set of contacts patterned with a second connection pitch. The second set of contacts are further patterned with a paired offset. The second semiconductor die is bonded to the first semiconductor die such that the first set of contacts is disposed in opposed electrical engagement with at least a portion of the second set of contacts.