公开(公告)号：US5276398A

公开(公告)日：1994-01-04

申请号：US929900

申请日：1992-08-11

申请人： Richard S. Withers ,  Guo-Chun Liang

发明人： Richard S. Withers ,  Guo-Chun Liang

IPC分类号： G01R33/341 ,  A61B5/055 ,  G01R33/34 ,  G01R33/36 ,  H01F5/00 ,  H01F6/00 ,  G01V3/00

CPC分类号： G01R33/3628 ,  G01R33/34 ,  G01R33/34007 ,  G01R33/34023 ,  G01R33/34092 ,  Y10S505/844

摘要： A magnetic resonance probe coil is fabricated using a superconductive material for the coil. Three distinct embodiments are described: a single-layer coil with no crossovers; a dual-film coil wherein the capacitors are formed through an intermediate dielectric layer; a single-layer coil incorporating a superconducting crossover. All of the embodiments are designed to take advantage of the properties of the superconducting material to achieve very high quality factors (Q) of tens of thousands to over a million. The superconductor is patterned into a spiral design to achieve self-resonance at a desired frequency in the range of 1 to 1000 MHz and the device operates at temperatures higher than 30 K. A broadband matching network is also disclosed which, when operated in conjunction with the superconducting magnetic resonance probe coil, allows operation over a wide range of frequencies while maintaining extremely low loss.

摘要翻译： 使用用于线圈的超导材料制造磁共振探针线圈。 描述了三个不同的实施例：没有交叉的单层线圈; 一种双电影线圈，其中电容器通过中间介质层形成; 包含超导交叉的单层线圈。 所有实施例被设计为利用超导材料的性质来实现数万到超过一百万的非常高的质量因子（Q）。 将超导体图案化为螺旋设计，以在1至1000MHz的范围内以期望的频率实现自谐振，并且器件在高于30K的温度下工作。还公开了宽带匹配网络，其与 超导磁共振探针线圈允许在宽范围的频率下工作，同时保持极低的损耗。

公开(公告)号：US5233500A

公开(公告)日：1993-08-03

申请号：US893416

申请日：1992-06-01

申请人： Guo-Chun Liang ,  Richard S. Withers

发明人： Guo-Chun Liang ,  Richard S. Withers

IPC分类号： H01L23/66

CPC分类号： H01L23/66 ,  H01L2924/0002 ,  H01L2924/3011

摘要： A lobed package for the protection and electrical connection of microwave devices is presented. The distinctive shape of the package allows several large devices to be connected in series in a coplanar arrangement. In the preferred embodiment, a base layer is formed into a trefoil shape with a central raised pedestal. Three wafer sized modules are cut to fit together at 120.degree. angles and are placed on the pedestal and electrically interconnected. A retaining shim is placed around the outside of the modules. An intermediate spring retaining plate with a recessed three-lobed well is placed atop the modules. Springs are placed in holes in the retaining plate. The springs are compressed by a cover plate placed on top of the retaining plate. Electrical connections are made to the cascaded device through the base or edge of the package. One application is to packaging three delay lines in series, each device occupying most of the space of a standard wafer.

摘要翻译： 提出了一种用于微波器件保护和电气连接的裂纹封装。 封装的独特形状允许几个大型器件以共面布置串联连接。 在优选实施例中，基底层形成为具有中央凸台的三叶形状。 将三个晶片尺寸的模块切割成120度角配合在一起并放置在基座上并进行电互连。 保持垫片放置在模块外侧。 具有凹陷的三裂孔的中间弹簧保持板放置在模块的顶部。 弹簧放置在固定板上的孔中。 弹簧被放置在保持板顶部的盖板压缩。 通过封装的基座或边缘对级联器件进行电气连接。 一个应用是串联三个延迟线，每个器件占据标准晶片的大部分空间。