Method for fabricating locally reinforced metallic microfeature
    21.
    发明授权
    Method for fabricating locally reinforced metallic microfeature 有权
    制造局部强化金属微特征的方法

    公开(公告)号:US06362083B1

    公开(公告)日:2002-03-26

    申请号:US09449369

    申请日:1999-11-24

    IPC分类号: H01L2128

    摘要: A method for fabricating a locally reinforced metallic microfeature on a substrate provided preferably with an electrical contacting or a driving circuit, and on an organic, patterned sacrificial layer, which is removed after the metallic microfeature is applied, is described. In fabricating the local reinforcement of the microfeature, at least one further organic layer, formed as a mask, is deposited, which is likewise removed following pattern delineation of the metallic layer.

    摘要翻译: 描述了一种用于在衬底上制造局部增强的金属微特征的方法,其优选地具有电接触或驱动电路,以及在施加金属微特征之后被去除的有机图案化牺牲层上。 在制造微特征的局部加强时,沉积形成为掩模的至少一个另外的有机层,其在金属层的图案描绘之后同样被去除。

    Optical fiber amplifier
    22.
    发明授权
    Optical fiber amplifier 失效
    光纤放大器

    公开(公告)号:US5579154A

    公开(公告)日:1996-11-26

    申请号:US537243

    申请日:1995-09-29

    CPC分类号: G02B6/4214 H01S3/06754

    摘要: The invention relates to an optical fiber amplifier having an amplification waveguide, having a pump source and having a wavelength-selective coupler. The pump light from the pump source is coupled into the amplification waveguide via the coupler. A carrier substrate (GS) is provided, on which passive (eg. couplers, dividers) and active components (eg. amplification waveguides) of the fiber amplifier are integrated. In addition, a silicon carrier (ST1) is provided, which is fitted to one end of the carrier substrate (GS). The silicon carrier (ST1) has anisotropically etched grooves with optical components. The pump source is fixed on the silicon carrier (ST1).The optical components on silicon carrier (ST1) and carrier substrate (GS) are adjusted in relation to one another.

    摘要翻译: 本发明涉及一种具有放大波导的光纤放大器,具有泵浦源并具有波长选择耦合器。 来自泵浦源的泵浦光通过耦合器耦合到放大波导中。 提供载体衬底(GS),其上集成了光纤放大器的无源(例如耦合器,分频器)和有源部件(例如放大波导)。 另外,提供了与载体基板(GS)的一端嵌合的硅载体(ST1)。 硅载体(ST1)具有各向异性蚀刻的具有光学部件的凹槽。 泵浦源固定在硅载体(ST1)上。 硅载体(ST1)和载体衬底(GS)上的光学组件相对于彼此调节。