Thermoplastics molding materials based on polyphenylene ethers and
polyesters
    21.
    发明授权
    Thermoplastics molding materials based on polyphenylene ethers and polyesters 失效
    基于聚苯醚和聚酯的热塑性塑料成型材料

    公开(公告)号:US4962157A

    公开(公告)日:1990-10-09

    申请号:US209210

    申请日:1988-06-20

    IPC分类号: C08L67/00 C08L67/02 C08L71/12

    摘要: Thermoplastic molding materials contain(A) not less than 5% by weight of a polymer component consisting of from 50 to 10 % by weight by polyphenylene ethers and from 0 to 50% by weight of a styrene polymer differing from component (C),(B) not less than 5% by weight of a polyester,(C) not less than 0.1% by weight of a copolymer consisting of(C.sub.1) not less than 20% by weight of .alpha.-olefins of 2 to 8 carbon atoms, styrene or substituted styrenes of the general formula I ##STR1## where R and R.sup.1 is alkyl of 1 to 8 carbon atoms, hydrogen and/or halogen and n is 0, 1 or 2, or a mixture of these monomers,(C.sub.2) not less than 0.5% by weight of a polymerizable monomer containing epoxide groups,and/or(C.sub.3) not less than 0.05% by weight of a halobenzyl-containing polymerizable monomer having the structural unit (II) ##STR2## where X is halogen and R.sup.2 and R.sup.3 are each alkyl of 1 to 8 carbon atoms or hydrogen and n is 1, 2 or 3,and/or(C.sub.4) not less than 0.05% by weight of a polymerizable monomer containing oxazoline groups,and(C.sub.5) from 0 to 65% by weight of acrylonitrile, methacrylonitrile and further nonionic comonomers, and(D) from 0 to 40% by weight of a rubber impact modifier.

    摘要翻译: 热塑性成型材料含有(A)不少于5重量%的由聚苯醚组成的聚合物组分50至10重量%和0至50重量%不同于组分(C)的苯乙烯聚合物,(C) B)不小于5重量%的聚酯,(C)不小于0.1重量%的由(C1)不低于20重量%的2-8个碳原子的α-烯烃组成的共聚物,苯乙烯 或通式I的取代苯乙烯(I)其中R和R 1是1至8个碳原子的烷基,氢和/或卤素和n是0,1或2,或这些单体的混合物(C2 )不小于0.5重量%的含有环氧基的可聚合单体,和/或(C3)不小于0.05重量%的具有结构单元(II)的卤代苄基的可聚合单体(II)其中 X是卤素,R 2和R 3各自是1至8个碳原子的烷基或氢,n是1,2或3,和/或(C 4)不小于0.05重量%的聚合物 包含恶唑啉基的单体,和(C5)0至65重量%的丙烯腈,甲基丙烯腈和其它非离子共聚单体,和(D)0至40重量%的橡胶抗冲改性剂。