Polyamide molding compound with low dielectric loss factor

    公开(公告)号:US12084573B2

    公开(公告)日:2024-09-10

    申请号:US17348481

    申请日:2021-06-15

    申请人: EMS-CHEMIE AG

    IPC分类号: C08L71/12 C08K3/40 C08K7/14

    摘要: The present invention relates to a thermoplastic molding composition comprising:

    A mixture of at least one polyamide A1, at least one polyphenylene ether A2 and optionally a compatibilizer A3 and optionally an olefinic and/or vinylaromatic polymer A4;
    B 10 to 60% by weight of glass filler, the glass composition of which comprises at least 10% by weight of boron oxide and at most 15% by weight for the sum of magnesium oxide and calcium oxide;
    C 1 to 8% by weight of LDS additive;
    D 0 to 5% by weight of additives other than components A, B and C;

    wherein 80 to 100% by weight of mixture A consists of a mixture M of components A1, A2 and A3 and 0 to 20% by weight of component A4, in each case based on the sum of components M and A4, and wherein the sum of components M and A4 gives 100% by weight of mixture A, and wherein 36 to 92% by weight of mixture M is of component A2, from 8 to 60% by weight of component A1 and from 0 to 4% by weight of component A3, based in each case on the sum of components A1 to A3, and the sum of components A1 to A3 being 100% by weight of the mixture M, and the sum of components A to D being 100% by weight of the molding composition.