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    Plating apparatus having conductive liquid and plating method
    21.
    发明授权
    Plating apparatus having conductive liquid and plating method 有权

    公开(公告)号：US12104266B2

    公开(公告)日：2024-10-01

    申请号：US17974239

    申请日：2022-10-26

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jaewon Choi ,  Jaesik Chung

    IPC: C25D17/00

    CPC classification number: C25D17/004 ,  C25D17/001 ,  C25D17/007

    Abstract: A plating apparatus may include a body, a lip seal structure connected to the body, and a conductive liquid. The body may include a cathode. The lip seal structure may be configured to hold a wafer. The lip seal structure may include a bottom portion, a contact portion connected to the bottom portion and contacting the wafer, and at least one partition structure protruding from an upper surface of the bottom portion. The conductive liquid may cover the upper surface of the bottom portion and may be configured to electrically connect the cathode and the wafer.

    Accessory storage box for vacuum cleaner
    22.
    外观设计
    Accessory storage box for vacuum cleaner 有权

    公开(公告)号：USD1009467S1

    公开(公告)日：2024-01-02

    申请号：US29840631

    申请日：2022-05-31

    Applicant: Samsung Electronics Co., Ltd.

    Designer： Kyuseok Kim ,  Kang-Doo Kim ,  Jaewon Choi ,  Hyunwoo Yoon ,  Sewook Oh

    Abstract: FIG. 1 is a front perspective view of an accessory storage box for vacuum cleaner, showing our new design;
    FIG. 2 is a front view thereof;
    FIG. 3 is a rear view thereof;
    FIG. 4 is a left-side view thereof;
    FIG. 5 is a right-side view thereof;
    FIG. 6 is a top view thereof;
    FIG. 7 is a bottom view thereof;
    FIG. 8 is a rear perspective view thereof; and,
    FIG. 9 is a perspective view thereof in an alternate position.
    The even-dash broken lines illustrating portions of the accessory storage box form no part of the claimed design.

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