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公开(公告)号：US11410954B2
公开(公告)日：2022-08-09
申请号：US16922169
申请日：2020-07-07
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Yu-Lung Huang , Chee-Key Chung , Chang-Fu Lin , Yuan-Hung Hsu
IPC: H01L23/00
Abstract: Provided is an electronic package, including a first substrate of a first conductive structure and a second substrate of a second conductive structure, where a first conductive layer, a bump body and a metal auxiliary layer of the first conductive structure are sequentially formed on the first substrate, and a metal pillar, a second conductive layer, a metal layer and a solder layer of the second conductive structure are sequentially formed on the second substrate, such that the solder layer is combined with the bump body and the metal auxiliary layer to stack the first substrate and the second substrate.
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公开(公告)号：US20220068663A1
公开(公告)日：2022-03-03
申请号：US17068988
申请日：2020-10-13
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Yu-Lung Huang , Chih-Ming Huang , Kuo-Hua Yu , Chang-Fu Lin
IPC: H01L21/48 , H01L23/498
Abstract: An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures. The circuit block and the circuit board embedded in the encapsulating layer are spaced apart from each other to allow to separate current conduction paths. As such, the circuit board will not overheat, and issues associated with warpage of the circuit board can be eliminated. Moreover, by embedding the circuit block and the circuit board in the encapsulating layer at a distance to each other, the structural strength of the encapsulating layer can be improved.
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公开(公告)号：US20210287962A1
公开(公告)日：2021-09-16
申请号：US16872740
申请日：2020-05-12
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Yu-Lung Huang , Chee-Key Chung , Chang-Fu Lin , Yuan-Hung Hsu
IPC: H01L23/433 , H01L21/48 , H01L23/00
Abstract: An electronic package is provided and includes an electronic element, an intermediary structure disposed on the electronic element, and a heat dissipation element bonded to the electronic element through the intermediary structure. The intermediary structure has a flow guide portion and a permanent fluid combined with the flow guide portion so as to be in contact with the electronic element, thereby achieving a preferred heat dissipation effect and preventing excessive warping of the electronic element or the heat dissipation element due to stress concentration.
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公开(公告)号：US20240162169A1
公开(公告)日：2024-05-16
申请号：US18537638
申请日：2023-12-12
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Yu-Lung Huang , Chee-Key Chung , Yuan-Hung Hsu , Chi-Jen Chen
IPC: H01L23/00 , H01L21/768 , H01L23/538
CPC classification number: H01L23/562 , H01L21/76804 , H01L23/5384 , H01L23/5386
Abstract: An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts. The spacing structure has a recess to enhance the flexibility of the electronic elements after the electronic elements are connected to one another, thereby preventing the problem of warpage. A method for fabricating the electronic package is also provided.
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公开(公告)号：US11984379B2
公开(公告)日：2024-05-14
申请号：US17370207
申请日：2021-07-08
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Yu-Lung Huang , Chih-Ming Huang , Kuo-Hua Yu , Chang-Fu Lin
IPC: H01L23/367 , H01L21/48 , H01L23/373 , H01L23/42 , H01L23/00
CPC classification number: H01L23/3675 , H01L21/4871 , H01L23/3736 , H01L23/42 , H01L24/73 , H01L2224/73204
Abstract: Provided is an electronic package, in which a heat dissipating body is formed on an electronic device and is combined with a heat sink so that the electronic device, the heat dissipating body and the heat sink form a receiving space, and a heat dissipating material is formed in the receiving space and in contact with the heat sink and the electronic device, where a fluid regulating space is formed between the heat dissipating material and the heat dissipating body and is used as a volume regulating space for the heat dissipating material during thermal expansion and contraction.
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Patent Agency Ranking
公开(公告)号：US11881459B2
公开(公告)日：2024-01-23
申请号：US16867937
申请日：2020-05-06
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Yu-Lung Huang , Chee-Key Chung , Yuan-Hung Hsu , Chi-Jen Chen
IPC: H01L23/00 , H01L21/768 , H01L23/538
CPC classification number: H01L23/562 , H01L21/76804 , H01L23/5384 , H01L23/5386
Abstract: An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts. The spacing structure has a recess to enhance the flexibility of the electronic elements after the electronic elements are connected to one another, thereby preventing the problem of warpage. A method for fabricating the electronic package is also provided.
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公开(公告)号：US20230381996A1
公开(公告)日：2023-11-30
申请号：US17863794
申请日：2022-07-13
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Yu-Lung Huang , Chih-Hui Huang , Cheng-Ying Hsieh , Sin-Cyuan Lin , Men-Yeh Chiang , Chao-Lin Chang , Ting-Hsu Lu
CPC classification number: B26D7/086 , H01L21/67092
Abstract: An ultrasonic device is provided and includes an action member, a driving member and a rotating shaft connected to the driving member. The action member provides ultrasonic vibration and vibrates the driving member, so that the driving member oscillates to make the rotating shaft and a cutter oscillate in the same direction together, so the cutter can remove scrap by oscillating during the cutting operation.
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公开(公告)号：US11792938B2
公开(公告)日：2023-10-17
申请号：US17086888
申请日：2020-11-02
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Yu-Lung Huang , Chee-Key Chung , Chang-Fu Lin , Yuan-Hung Hsu
CPC classification number: H05K1/184 , H05K1/0271 , H05K3/303 , H05K3/4697 , H05K2201/10568
Abstract: A carrier structure is provided. A spacer is formed in an insulation board body provided with a circuit layer, and is not electrically connected to the circuit layer. The spacer breaks the insulation board body, and a structural stress of the insulation board body will not be continuously concentrated on a hard material of the insulation board body, thereby preventing warpage from occurring to the insulation board body.
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公开(公告)号：US20220399245A1
公开(公告)日：2022-12-15
申请号：US17370207
申请日：2021-07-08
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Yu-Lung Huang , Chih-Ming Huang , Kuo-Hua Yu , Chang-Fu Lin
IPC: H01L23/367 , H01L23/373 , H01L23/42 , H01L21/48
Abstract: Provided is an electronic package, in which a heat dissipating body is formed on an electronic device and is combined with a heat sink so that the electronic device, the heat dissipating body and the heat sink form a receiving space, and a heat dissipating material is formed in the receiving space and in contact with the heat sink and the electronic device, where a fluid regulating space is formed between the heat dissipating material and the heat dissipating body and is used as a volume regulating space for the heat dissipating material during thermal expansion and contraction.
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公开(公告)号：US20220336323A1
公开(公告)日：2022-10-20
申请号：US17854241
申请日：2022-06-30
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Yu-Lung Huang , Chee-Key Chung , Chang-Fu Lin , Yuan-Hung Hsu
IPC: H01L23/433 , H01L21/48 , H01L23/00
Abstract: An electronic package is provided and includes an electronic element, an intermediary structure disposed on the electronic element, and a heat dissipation element bonded to the electronic element through the intermediary structure. The intermediary structure has a flow guide portion and a permanent fluid combined with the flow guide portion so as to be in contact with the electronic element, thereby achieving a preferred heat dissipation effect and preventing excessive warping of the electronic element or the heat dissipation element due to stress concentration.
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