公开(公告)号：US20140160327A1

公开(公告)日：2014-06-12

申请号：US14087430

申请日：2013-11-22

Applicant: Sony Corporation

Inventor： Osamu Enoki ,  Toru Udaka ,  Masaki Murata ,  Rui Morimoto

IPC: H01L27/30 ,  H04N5/369 ,  H01L51/44

CPC classification number: H01L27/307 ,  H01L51/003 ,  H01L51/448 ,  H04N5/2253 ,  H04N5/369 ,  Y02E10/549 ,  Y02P70/521

Abstract: Image sensors, electronic apparatuses, and methods of manufacturing an image sensor are provided. More particularly, an image sensor having a plurality of photoelectric conversion elements included in a laminated body is provided. At least one of the photoelectric conversion elements includes organic photoelectric conversion elements. In addition, at least a first surface of the laminated body includes a curved light incident surface, which further includes a concave surface. The plurality of photoelectric conversion elements receive light through the concave light incident surface. The laminated body can be connected to a support structure.

Abstract translation: 提供图像传感器，电子设备和图像传感器的制造方法。 更具体地说，提供一种具有包括在层叠体中的多个光电转换元件的图像传感器。 至少一个光电转换元件包括有机光电转换元件。 此外，层压体的至少第一表面包括还包括凹面的弯曲光入射表面。 多个光电转换元件通过凹入光入射面接收光。 层压体可以连接到支撑结构。