公开(公告)号：US20240107784A1

公开(公告)日：2024-03-28

申请号：US17954917

申请日：2022-09-28

申请人： Intel Corporation

发明人： Shayan Kaviani ,  Benjamin Duong ,  Miranda Ngan ,  Mahdi Mohammadighaleni

IPC分类号： H01L51/44

CPC分类号： H01L51/448

摘要： Methods, apparatus, systems, and articles of manufacture utilizing conjugated polymers in integrated circuit packages with glass substrates are disclosed. A disclosed integrated circuit (IC) package includes: a glass substrate; a first electrode; an organic material; and a second electrode. The first electrode is between the glass substrate and the organic material. The organic material includes at least one of a conjugated polymer or a metal-organic supramolecule. The organic material is between the first electrode and the second electrode.

公开(公告)号：US20230255108A1

公开(公告)日：2023-08-10

申请号：US18080738

申请日：2022-12-13

申请人： GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY

发明人： Kwang Hee LEE ,  Hee Joo KIM ,  Young Ryun KIM

IPC分类号： H10K85/60 ,  H10K30/88 ,  H10K50/84 ,  H01G9/20 ,  C07D471/04 ,  H10K85/30

CPC分类号： H01L51/0072 ,  H01L51/448 ,  H01L51/5237 ,  H01G9/20 ,  C07D471/04 ,  H01L51/0077

摘要： The present invention relates to a novel compound for improving the photostability of an optoelectronic device, and more particularly, to a novel phenanthroline-based compound, a preparation method thereof, and an optoelectronic device including the same as a passivation layer. According to the present invention, the novel phenanthroline-based compound of Formula 1 is a novel compound in which an amine group side chain is introduced into the parent nucleus of phenanthroline, and is capable of being used in a solution process due to excellent solubility in a polar solvent, and simple introduction on an n-type semiconductor organic layer (e.g., an organic photoactive layer or an electron transport layer) as a passivation layer may bring about not only an increase in stability, but also an additional increase in efficiency such as an increase in open-circuit voltage or photocurrent.

公开(公告)号：US11696457B2

公开(公告)日：2023-07-04

申请号：US17275114

申请日：2019-09-13

申请人： Epishine AB

发明人： Jonas Bergqvist ,  Thomas Österberg

IPC分类号： H01L31/00 ,  H01L51/44 ,  H01L27/30 ,  H01L51/00

CPC分类号： H01L51/448 ,  H01L27/301 ,  H01L51/0024 ,  H01L51/0097

摘要： The present invention relates to a solar cell sheet comprising a first and a second substrate, which first and second substrates are flexible and suitable for roll to roll printing, and the solar cell sheet further comprises one or more self-contained solar cell units, wherein each self-contained solar cell unit comprises one or more solar cell modules, and each solar cell module comprises a plurality of serially connected solar cells, wherein each of the solar cell modules comprises: a first substrate portion of the first flexible substrate and a second substrate portion of the second substrate, a plurality of first electrodes and a plurality of second electrodes arranged between the first and second substrate portions; and at least one organic active layer arranged between the plurality of first electrodes and the plurality of second electrodes; wherein, a continuous or discontinuous portion of a first adhesive material encircles each of the solar cell units. The present invention further relates to a method for producing the solar cell sheet comprising one or more self-contained solar units.

公开(公告)号：US20230142134A1

公开(公告)日：2023-05-11

申请号：US17974564

申请日：2022-10-27

申请人： Masato TANAKA ,  Yuuji TANAKA ,  Nozomu TAMOTO ,  Naomichi KANEI

发明人： Masato TANAKA ,  Yuuji TANAKA ,  Nozomu TAMOTO ,  Naomichi KANEI

IPC分类号： H01L51/44

CPC分类号： H01L51/448 ,  H01L51/445

摘要： [Summary] The present invention is to provide a photoelectric conversion element with excellent productivity, initial output performance and durability.
[Tasks] A photoelectric conversion element in which a first substrate, a first electrode, a photoelectric conversion layer, a second electrode, and a second substrate are sequentially laminated, includes an adhesive layer surrounding at least the photoelectric conversion layer, wherein a clearance surrounding an outer edge of the adhesive layer is formed between the outer edge of the adhesive layer and an outer edge of the first substrate in a plan view.

公开(公告)号：US20180294771A1

公开(公告)日：2018-10-11

申请号：US15944706

申请日：2018-04-03

申请人： Epic Battery Inc.

发明人： Melvin James BULLEN

IPC分类号： H02S40/38 ,  H02J7/35 ,  H01M10/46 ,  H01L31/02 ,  H01L31/0224 ,  H01L31/05 ,  H01M2/04 ,  H01M2/02 ,  H01L31/0203

CPC分类号： H02S40/38 ,  H01L31/02008 ,  H01L31/0203 ,  H01L31/022425 ,  H01L31/035281 ,  H01L31/05 ,  H01L51/0045 ,  H01L51/42 ,  H01L51/441 ,  H01L51/448 ,  H01M2/022 ,  H01M2/0267 ,  H01M2/04 ,  H01M10/465 ,  H02J7/35 ,  H02J7/355 ,  Y02E10/566

摘要： Described herein are apparatuses, systems, and methods for a modular solar battery (MSB). The MSB may include a solar shell that includes a solar cell, a rechargeable battery that is charged by the solar cell, and control circuitry coupled to the solar cell and/or the rechargeable battery. The MSB may be in the form of a commercial battery. The control circuitry may include circuitry for solar power optimization, information sharing, battery charging, and/or battery health monitoring. The control circuitry may include a communication circuit to communicate information about the MSB to an external device. Other embodiments may be described and claimed.

公开(公告)号：US20180277606A1

公开(公告)日：2018-09-27

申请号：US15994054

申请日：2018-05-31

申请人： SONY SEMICONDUCTOR SOLUTIONS CORPORATION

发明人： Keisuke Hatano ,  Tetsuji Yamaguchi ,  Shintarou Hirata

IPC分类号： H01L27/30 ,  H01L27/146 ,  H01L51/44 ,  H01L31/12 ,  H01L51/00 ,  H01L51/42

CPC分类号： H01L27/307 ,  H01L27/14601 ,  H01L27/1463 ,  H01L27/14636 ,  H01L31/12 ,  H01L51/0001 ,  H01L51/42 ,  H01L51/441 ,  H01L51/442 ,  H01L51/447 ,  H01L51/448

摘要： There is provided a solid-state image pickup device that includes a functional region provided with an organic film, and a guard ring surrounding the functional region

公开(公告)号：US20180248133A1

公开(公告)日：2018-08-30

申请号：US15966994

申请日：2018-04-30

申请人： HEE Solar, L.L.C.

发明人： Michael D. Irwin ,  Vivek V. Dhas

IPC分类号： H01L51/00 ,  H01L51/42 ,  H01G9/20 ,  H01L31/18 ,  H01L31/0256

CPC分类号： H01L51/0077 ,  H01G9/2009 ,  H01G9/2027 ,  H01G9/2031 ,  H01G9/2045 ,  H01G9/2059 ,  H01L31/053 ,  H01L31/18 ,  H01L51/006 ,  H01L51/0061 ,  H01L51/42 ,  H01L51/422 ,  H01L51/4226 ,  H01L51/4253 ,  H01L51/4266 ,  H01L51/448 ,  H01L2031/0344 ,  Y02E10/542 ,  Y02E10/549

摘要： Photovoltaic devices such as solar cells, hybrid solar cell-batteries, and other such devices may include an active layer disposed between two electrodes, the active layer having perovskite material and other material such as mesoporous material, interfacial layers, thin-coat interfacial layers, and combinations thereof. The perovskite material may be photoactive. The perovskite material may be disposed between two or more other materials in the photovoltaic device. Inclusion of these materials in various arrangements within an active layer of a photovoltaic device may improve device performance. Other materials may be included to further improve device performance, such as, for example: additional perovskites, and additional interfacial layers.

公开(公告)号：US10044003B2

公开(公告)日：2018-08-07

申请号：US15102847

申请日：2014-12-19

申请人： POSCO

发明人： Young-Jun Park ,  Kyoung-Bo Kim ,  Moo-Jin Kim ,  Soo-Cherl Lee ,  Jae-Ryung Lee

IPC分类号： H01L51/52 ,  B32B9/00 ,  B32B9/04 ,  B32B15/08 ,  B32B27/28 ,  B32B27/30 ,  B32B27/32 ,  B32B27/40 ,  H01L51/44

CPC分类号： H01L51/529 ,  B32B9/007 ,  B32B9/041 ,  B32B15/08 ,  B32B27/283 ,  B32B27/302 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/322 ,  B32B27/40 ,  B32B2307/306 ,  B32B2307/7265 ,  B32B2439/00 ,  B32B2457/00 ,  H01L51/0097 ,  H01L51/448 ,  H01L51/524 ,  H01L51/5243 ,  Y02E10/549

摘要： The present invention relates to a metal encapsulant having good heat dissipation properties, a method of manufacturing same, and a flexible electronic device encapsulated in said metal encapsulant, and particularly, to a metal encapsulant having excellent flexibility, moisture resistance, workability, and heat dissipation properties by forming a coating layer including a metal graphite composite on one surface thereof, to a method of manufacturing same, and a flexible electronic device encapsulated in said metal encapsulant.

公开(公告)号：US10026923B2

公开(公告)日：2018-07-17

申请号：US15635893

申请日：2017-06-28

申请人： Hitachi Chemical Company, Ltd.

发明人： Takashi Naito ,  Shinichi Tachizono ,  Kei Yoshimura ,  Yuji Hashiba ,  Motomune Kodama ,  Masanori Miyagi ,  Takuya Aoyagi ,  Yuichi Sawai ,  Tadashi Fujieda ,  Takeshi Tsukamoto ,  Hajime Murakami

IPC分类号： H01L51/52 ,  H01L23/29 ,  H01G9/20 ,  C03C8/24 ,  H01L51/44 ,  C09J101/18 ,  C09J11/04 ,  C09J101/28 ,  H01L51/00 ,  C08K3/00 ,  C08K3/013

CPC分类号： H01L51/5246 ,  B32B3/06 ,  B32B7/14 ,  B32B17/06 ,  B32B17/10018 ,  B32B17/10119 ,  B32B17/10788 ,  B32B37/12 ,  B32B37/18 ,  B32B38/0008 ,  B32B38/0036 ,  B32B38/164 ,  B32B2038/168 ,  B32B2250/03 ,  B32B2255/20 ,  B32B2255/26 ,  B32B2307/412 ,  B32B2457/12 ,  B32B2457/206 ,  C08K3/013 ,  C08K3/22 ,  C08K2003/2258 ,  C08K2003/2265 ,  C08K2201/008 ,  C09J11/04 ,  C09J101/18 ,  C09J101/28 ,  H01G9/20 ,  H01G9/2077 ,  H01L23/295 ,  H01L51/0034 ,  H01L51/0096 ,  H01L51/448 ,  H01L2924/0002 ,  H01M14/00 ,  H05B33/04 ,  Y02E10/542 ,  Y02E10/549 ,  Y02P70/521 ,  Y10T428/239 ,  H01L2924/00

摘要： An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing low melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently. V2O5+TeO2+Fe2O3+P2O5≥90 (mass %)  (1) V2O5>TeO2>Fe2O3>P2O5 (mass %)  (2)

公开(公告)号：US20180102500A1

公开(公告)日：2018-04-12

申请号：US15560664

申请日：2016-03-25

申请人： ZEON CORPORATION

发明人： Kenichi HARAI

IPC分类号： H01L51/52 ,  H05B33/04 ,  H01L51/44 ,  C08L53/02 ,  H01L51/00 ,  C08F297/04

CPC分类号： H01L51/5246 ,  C08F297/04 ,  C08L53/025 ,  C09K3/10 ,  C09K2200/0645 ,  H01L51/0043 ,  H01L51/448 ,  H01L51/5256 ,  H01L51/5259 ,  H05B33/04

摘要： A sealing material for sealing a light-emitting element, wherein: the sealing material has a bonding surface capable of being in contact with the light-emitting element; and the bonding surface has an arithmetic average roughness of 10 nm or more and 1,000 nm or less. The sealing material preferably has a storage elastic modulus at 90° C. of 10 MPa or more. The sealing material preferably contains a metal compound. A method for producing a light-emitting device, including the steps of: bonding a bonding surface of the sealing material to a light-emitting element; and bonding a barrier member to a surface of the sealing material on a side opposite to the bonding surface.