公开(公告)号：US11644697B2

公开(公告)日：2023-05-09

申请号：US16988480

申请日：2020-08-07

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Sébastien Cremer ,  Frédéric Boeuf ,  Stephane Monfray

IPC: G02F1/01 ,  G02F1/035 ,  G02B6/12

CPC classification number: G02F1/035 ,  G02B6/12004 ,  G02F1/0147 ,  G02F2201/063

Abstract: The present disclosure relates to a method comprising the following steps: a) forming a waveguide from a first material, the waveguide being configured to guide an optical signal; b) forming a layer made of a second material that is electrically conductive and transparent to a wavelength of the optical signal, steps a) and b) being implemented such that the layer made of the second material is in contact with at least one of the faces of the waveguide, or is separated from the at least one of the faces by a distance of less than half, preferably less than a quarter, of the wavelength of the optical signal. The application further relates to a phase modulator, in particular obtained by such a method.

公开(公告)号：US20210055579A1

公开(公告)日：2021-02-25

申请号：US16988480

申请日：2020-08-07

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Sébastien Cremer ,  Frédéric Boeuf ,  Stephane Monfray

IPC: G02F1/035

Abstract: The present disclosure relates to a method comprising the following steps: a) forming a waveguide from a first material, the waveguide being configured to guide an optical signal; b) forming a layer made of a second material that is electrically conductive and transparent to a wavelength of the optical signal, steps a) and b) being implemented such that the layer made of the second material is in contact with at least one of the faces of the waveguide, or is separated from the at least one of the faces by a distance of less than half, preferably less than a quarter, of the wavelength of the optical signal. The application further relates to a phase modulator, in particular obtained by such a method.

公开(公告)号：US20200310027A1

公开(公告)日：2020-10-01

申请号：US16821370

申请日：2020-03-17

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics (Crolles 2) SAS

Inventor： Frédéric Boeuf ,  Luca Maggi

IPC: G02B6/124 ,  G02B6/34 ,  G02B6/43

Abstract: A photonic integrated circuit chip includes vertical grating couplers defined in a first layer. Second insulating layers overlie the vertical grating coupler and an interconnection structure with metal levels is embedded in the second insulating layers. A cavity extends in depth through the second insulating layers all the way to an intermediate level between the couplers and the metal level closest to the couplers. The cavity has lateral dimensions such that the cavity is capable of receiving a block for holding an array of optical fibers intended to be optically coupled to the couplers.

公开(公告)号：US10393958B2

公开(公告)日：2019-08-27

申请号：US16029365

申请日：2018-07-06

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Frédéric Boeuf ,  Charles Baudot

IPC: G02B6/12 ,  H01L23/48 ,  H01L23/00 ,  H01L21/768 ,  H02S40/44 ,  H01L25/04

Abstract: A method for making an electro-optic device includes forming a first photonic device having a first material in a first photonic layer over a substrate layer. A second photonic layer with a second photonic device is formed over the first photonic layer and includes a second material different than the first material. A dielectric layer is formed over the second photonic layer. A first electrically conductive via extending through the dielectric layer and the second photonic layer is formed so as to couple to the first photonic device. A second electrically conductive via extending through the dielectric layer and coupling to the second photonic device is formed. A third electrically conductive via extending through the dielectric layer, the second photonic layer, and the first photonic layer is formed so as to couple to the substrate layer.