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公开(公告)号:US20210036407A1
公开(公告)日:2021-02-04
申请号:US16828788
申请日:2020-03-24
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor: Chin Mo KIM , Sung Yong AN , Ji Hyung JUNG , Jae Yeong KIM , Ju Hyoung PARK , Sung Nam CHO
Abstract: A chip antenna comprises a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate a second patch, provided on the second substrate, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a bonding pad provided on a second surface of the first substrate. The first substrate comprises a dielectric substance and a magnetic substance.
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公开(公告)号:US20200176191A1
公开(公告)日:2020-06-04
申请号:US16782586
申请日:2020-02-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Chang Hwa PARK , Jin Woo KIM , Min Gi SIN , Byung Hyun PARK , Chin Mo KIM
Abstract: A dielectric powder includes a core-shell structure including a core region formed in an inner portion thereof and a shell region covering the core region. The core region includes barium titanate (BaTiO3) doped with a metal oxide, and the shell region is formed of a ferroelectric material.
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