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28 条记录 (耗时 0.017 秒)

    CHIP ANTENNA MODULE
    1.
    发明申请
    CHIP ANTENNA MODULE 有权

    公开(公告)号：US20210376490A1

    公开(公告)日：2021-12-02

    申请号：US17399572

    申请日：2021-08-11

    申请人： Samsung Electro-Mechanics Co., Ltd.

    发明人： Jae Yeong KIM ,  Sung Nam CHO ,  Ju Hyoung PARK ,  Jeong Ki RYOO ,  Kyu Bum HAN ,  Sung Yong AN

    IPC分类号： H01Q21/06 ,  H01Q19/10 ,  H01Q1/48 ,  H01Q1/22

    摘要： A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.

    CHIP ANTENNA
    6.
    发明申请
    CHIP ANTENNA 有权

    公开(公告)号：US20210384633A1

    公开(公告)日：2021-12-09

    申请号：US17405286

    申请日：2021-09-01

    申请人： Samsung Electro-Mechanics Co., Ltd.

    发明人： Jae Yeong KIM ,  Chin Mo KIM ,  Ji Hyung JUNG ,  Sung Nam CHO ,  Sung Yong AN

    IPC分类号： H01Q9/04 ,  H01Q1/48 ,  H01Q1/38

    摘要： A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.

    CHIP ANTENNA
    7.
    发明申请
    CHIP ANTENNA 有权

    公开(公告)号：US20210143527A1

    公开(公告)日：2021-05-13

    申请号：US17151952

    申请日：2021-01-19

    申请人： Samsung Electro-Mechanics Co., Ltd.

    发明人： Sung Nam CHO ,  Sung Yong AN ,  Jae Yeong KIM ,  Ju Hyoung PARK

    IPC分类号： H01Q1/22 ,  H01Q9/04 ,  H01Q1/24

    摘要： A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.

    CHIP ANTENNA
    8.
    发明申请
    CHIP ANTENNA 有权

    公开(公告)号：US20210111478A1

    公开(公告)日：2021-04-15

    申请号：US16788585

    申请日：2020-02-12

    申请人： Samsung Electro-Mechanics Co., Ltd.

    发明人： Chin Mo KIM ,  Jae Yeong KIM ,  Sung Yong AN ,  Sung Nam CHO ,  Ji Hyung JUNG

    IPC分类号： H01Q1/22 ,  H01Q21/06 ,  H01Q1/42 ,  H01Q9/04

    摘要： A chip antenna includes a first dielectric substrate, a second dielectric substrate spaced apart from and opposing the first dielectric substrate, a first patch disposed on the first dielectric substrate, a second patch disposed on the second dielectric substrate, and a mounting pad and a feed pad disposed on a mounting surface of the first dielectric substrate. The first dielectric substrate, mounted on a mounting substrate through the mounting pad, is electrically connected to the mounting substrate through the feed pad. One of the first dielectric substrate and the second dielectric substrate is formed of ceramic and another is formed of polytetrafluoroethylene (PTFE).

    CHIP ANTENNA MODULE
    9.
    发明申请
    CHIP ANTENNA MODULE 审中-公开

    公开(公告)号：US20200259269A1

    公开(公告)日：2020-08-13

    申请号：US16725377

    申请日：2019-12-23

    申请人： Samsung Electro-Mechanics Co., Ltd.

    发明人： Jae Yeong KIM ,  Sung Nam CHO ,  Ju Hyoung PARK ,  Jeong Ki RYOO ,  Kyu Bum HAN ,  Sung Yong AN

    IPC分类号： H01Q21/06 ,  H01Q1/22 ,  H01Q1/48 ,  H01Q19/10

    摘要： A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.