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21.发明授权公开(公告)号：US06590784B2
公开(公告)日：2003-07-08
申请号：US10053419
申请日：2001-11-02
IPC分类号： H05K900
CPC分类号： H05K9/0073
摘要： A combination of EMI-shield-retention features molded onto a bezel for an equipment enclosure. The features collectively fasten a notched and cutout EMI shield to the inner surface of the bezel without requiring any tools or fasteners. Several −Z-retention features provide surfaces for the EMI shield to lie flat against the inner surface of the bezel, while several X, Y-retention features protrude through holes and notches cut in the EMI shield to further retain the EMI shield. Finally, +Z-retention features along one edge of the bezel provide flanges for the EMI shield to slide under, while +Z-retention features, on the opposite edge of the bezel from the flanges, snap over top of the EMI shield.
摘要翻译： 将EMI屏蔽保持功能模制到设备外壳的挡板上的组合。 这些特征将一个切口和切口的EMI屏蔽件一起固定在边框的内表面上，而不需要任何工具或紧固件。 几个-Z保持功能为EMI屏蔽层提供了平面靠在挡板内表面的表面，而几个X，Y保留特征突出穿过EMI屏蔽中的孔和凹口，以进一步保持EMI屏蔽。 最后，边框的一个边缘上的+ Z-保持特征提供了用于EMI屏蔽件向下滑动的法兰，而边框的相对边缘上的+ Z保留特征则与法兰紧贴在EMI屏蔽的顶部。
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公开(公告)号：US07859847B2
公开(公告)日：2010-12-28
申请号：US11027337
申请日：2004-12-29
申请人： Stephan Karl Barsun
发明人： Stephan Karl Barsun
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： An assembly comprises a frame adapted to mount an electronic device having a thickness within a range of thicknesses. The frame is adapted to assemble to a heat sink assembly after the electronic device is mounted. The assembly further comprises at least one spring adapted to secure the electronic device to the frame.
摘要翻译： 组件包括适于安装厚度在厚度范围内的电子设备的框架。 该框架适于在安装电子装置之后组装到散热器组件。 组件还包括适于将电子设备固定到框架的至少一个弹簧。
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公开(公告)号：US07434743B2
公开(公告)日：2008-10-14
申请号：US11045249
申请日：2005-01-28
申请人： Stephan Karl Barsun , Jeff Evans , Glenn C. Simon , Robert William Dobbs , Andrew Michael Cherniski
发明人： Stephan Karl Barsun , Jeff Evans , Glenn C. Simon , Robert William Dobbs , Andrew Michael Cherniski
CPC分类号： G06F1/20 , H05K7/20727 , H05K7/20836
摘要： An apparatus in one example comprises a reversible fan of an electronic module that rotates in a clockwise direction if the electronic module is communicatively coupled in a first position and a counterclockwise direction if the electronic module is communicatively coupled in a second position.
摘要翻译： 一个示例中的装置包括电子模块的可逆风扇，如果电子模块在第二位置通信耦合，则如果电子模块以第一位置和逆时针方向通信耦合，则顺时针方向旋转。
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公开(公告)号：US07280371B2
公开(公告)日：2007-10-09
申请号：US10758982
申请日：2004-01-16
CPC分类号： H05K7/142 , H05K7/1409
摘要： A multi stage mounting printed circuit board system and method is presented. In one embodiment, a multi stage mounting printed circuit board system includes a first printed circuit board for mounting electrical components on. A first printed circuit board interface component is coupled to the first printed circuit board. The first printed circuit board interface component communicatively couples the first printed board to a second printed board via a second printed circuit board interface component. A plurality of printed circuit board extractors are coupled to the first printed circuit board. The plurality of printed circuit board extractors couple the first printed circuit board to card guides (e.g., a single pair of card guides in which the second printed circuit board is mounted).
摘要翻译： 提出了一种多级安装印刷电路板系统和方法。 在一个实施例中，多级安装印刷电路板系统包括用于将电气部件安装在其上的第一印刷电路板。 第一印刷电路板接口部件耦合到第一印刷电路板。 第一印刷电路板接口组件经由第二印刷电路板接口部件将第一印刷电路板通信地耦合到第二印刷电路板。 多个印刷电路板提取器耦合到第一印刷电路板。 多个印刷电路板提取器将第一印刷电路板耦合到卡引导件（例如，安装第二印刷电路板的单对卡引导件）。
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公开(公告)号：US07277292B2
公开(公告)日：2007-10-02
申请号：US10834517
申请日：2004-04-28
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A bracing apparatus is disclosed that has a component located within an opening in a cantilevered end of a heatsink. The component has a form factor that is expandable for stabilizing the heatsink at a given elevation relative to a printed circuit board. The bracing apparatus includes a tensioning device located within an opening in the component. When deployed, the tensioning device causes the component to expand. Also included in the bracing apparatus is a coupling medium for coupling the component to the printed circuit board.
摘要翻译： 公开了一种支撑装置，其具有位于散热器的悬臂端部中的开口内的部件。 该组件具有可膨胀的形状因子，用于在相对于印刷电路板的给定高度处稳定散热器。 支撑装置包括位于部件中的开口内的张紧装置。 部署时，张紧装置使部件膨胀。 支撑装置中还包括用于将部件耦合到印刷电路板的耦合介质。
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公开(公告)号：US07082032B1
公开(公告)日：2006-07-25
申请号：US10648532
申请日：2003-08-25
IPC分类号： H05K7/20
CPC分类号： H01L23/367 , G06F1/185 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation apparatus comprising a base and a plurality of fins connected to the base and extending out from the base at a non-orthogonal angle to the base.
摘要翻译： 一种散热装置，包括基座和连接到基座的多个翼片，并且以与基座不正交的角度从基座延伸出来。
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27.发明授权Pivot component coupled with first circuit board for control of relative alignment of first circuit board connection component with second circuit board connection component 有权与第一电路板耦合的枢轴组件，用于控制第一电路板连接部件与第二电路板连接部件的相对对准公开(公告)号：US06896539B2
公开(公告)日：2005-05-24
申请号：US10610144
申请日：2003-06-30
CPC分类号： H05K1/144 , H05K7/1417 , H05K7/142
摘要： A pivot component of an apparatus in one example is coupled with a first circuit board that comprises a first connection component. The pivot component controls a relative alignment of the first connection component with a second connection component of a second circuit board for an engagement of the first connection component with the second connection component.
摘要翻译： 一个示例中的装置的枢轴部件与包括第一连接部件的第一电路板耦合。 枢轴部件控制第一连接部件与第二电路板的第二连接部件的相对对准，用于使第一连接部件与第二连接部件接合。
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公开(公告)号：US06483700B1
公开(公告)日：2002-11-19
申请号：US09932035
申请日：2001-08-17
IPC分类号： H05K720
CPC分类号： H05K7/20563
摘要： A method and apparatus to provide air-flow balancing with a card guide frame. One embodiment of the invention involves a method to assemble an air-flow balancing card guide frame and one or more substrates. A second embodiment of the invention involves a method to design an air-flow balancing card guide frame. A third embodiment of the invention involves an assembled air-flow balancing card guide frame and one or more substrates.
摘要翻译： 一种用卡引导框提供气流平衡的方法和装置。 本发明的一个实施例涉及一种组装气流平衡卡引导框架和一个或多个基板的方法。 本发明的第二实施例涉及一种设计气流平衡卡引导框架的方法。 本发明的第三实施例涉及组装的气流平衡卡引导框架和一个或多个基板。
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公开(公告)号：US07826229B2
公开(公告)日：2010-11-02
申请号：US11588817
申请日：2006-10-27
CPC分类号： H05K7/2049 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A retention assembly comprises a hinged load plate configured for rotational closure over a component and compression of a pre-compressed spring that distributes force of the spring across the component in tool-less retention of the component.
摘要翻译： 保持组件包括铰链式负载板，其被配置为在部件上旋转闭合并压缩预压缩弹簧，其以无工具的部件保持力将弹簧的力分布在部件上。
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公开(公告)号：US07239520B2
公开(公告)日：2007-07-03
申请号：US11026367
申请日：2004-12-29
申请人： Stephan Karl Barsun
发明人： Stephan Karl Barsun
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/309 , Y10T24/42 , H01L2924/00
摘要： An assembly comprises a frame configured to mount an electronic device and assemble to a heat sink. The assembly further comprises at least one self-locking fastener adapted to lock into place and secure the heat sink to the frame on aligned compression of the heat sink toward the framed.
摘要翻译： 组件包括构造成安装电子设备并组装到散热器的框架。 该组件还包括至少一个自锁紧固件，其适于锁定到位，并且将散热器朝向框架的对准压缩固定到框架上。
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