Control of transistor performance through adjustment of spacer oxide profile with a wet etch
    21.
    发明授权
    Control of transistor performance through adjustment of spacer oxide profile with a wet etch 有权
    通过湿蚀刻调整间隔物氧化物轮廓来控制晶体管性能

    公开(公告)号:US06492275B2

    公开(公告)日:2002-12-10

    申请号:US09488870

    申请日:2000-01-21

    IPC分类号: H01L21311

    CPC分类号: H01L29/6659 H01L21/31111

    摘要: Methods of patterning sidewall spacers are provided. In one aspect, a method of fabricating a circuit device includes forming a gate on a substrate and forming a first oxide spacer and a second oxide spacer adjacent to the gate. The width of the gate and the first and second oxide spacers is measured. The widths of the first and second oxide spacers are trimmed if the width of the gate and the first and second oxide spacers exceeds a preselected maximum value by exposing the first and second oxide spacers to a solution of ammonium hydroxide, hydrogen peroxide and water for a preselected like and rinsing with deionized water. Spacer width may be finely tuned to reduce the risk of weak overlap and to improve device characteristics through shorter channels.

    摘要翻译: 提供图案化侧壁间隔物的方法。 一方面,一种制造电路器件的方法包括在衬底上形成栅极,并形成邻近栅极的第一氧化物间隔物和第二氧化物间隔物。 测量栅极和第一和第二氧化物间隔物的宽度。 如果通过将第一和第二氧化物间隔物暴露于氢氧化铵,过氧化氢和水的溶液中,如果栅极和第一和第二氧化物间隔物的宽度超过预选的最大值,则第一和第二氧化物间隔物的宽度被修整 预先选择和用去离子水冲洗。 间隔宽度可以被微调,以减少弱重叠的风险,并通过较短的通道改善设备特性。