Electronic component
    21.
    发明授权

    公开(公告)号:US10600570B2

    公开(公告)日:2020-03-24

    申请号:US16166902

    申请日:2018-10-22

    Abstract: An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed at an end portion of the element body in the third direction. The external electrode includes a conductive resin layer. The external electrode includes a plating layer including a first portion covering the first principal surface and a pair of second portions covering the pair of side surfaces. A thickness of the first portion is smaller than each thickness of the pair of second portions.

Patent Agency Ranking