公开(公告)号：US09786530B2

公开(公告)日：2017-10-10

申请号：US14518373

申请日：2014-10-20

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/68

CPC classification number: H01L21/67259 ,  H01L21/67265 ,  H01L21/67778 ,  H01L21/68

Abstract: A wafer transfer method includes the following steps. An initial position of a first wafer in a wafer cassette is detected. A picking entry position in the wafer cassette is determined based on the initial position of the first wafer, in which the picking entry position is spaced apart from the initial position of the first wafer. A wafer transfer blade is moved to the picking entry position.