公开(公告)号：US20140089871A1

公开(公告)日：2014-03-27

申请号：US14099997

申请日：2013-12-08

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Hsin-Ming Hou ,  Ji-Fu Kung

IPC: G06F17/50

CPC classification number: G01R31/2642 ,  G06F17/50 ,  H01L22/14 ,  H01L22/20

Abstract: For improving wafer fabrication, yield and lifetime of wafers are predicted by determining coefficients of a yield domain for wafer yield prediction and a lifetime domain for a wafer lifetime prediction, an integral domain, an electric/layout domain, a metrology/defect domain, and a machine sensor domain in a hierarchical manner. With the aid of the hierarchically-determined coefficients, noises in prediction can be reduced so that precision of prediction results of the yields or the lifetimes of wafers can be raised.

Abstract translation: 为了改善晶片制造，通过确定晶片产量预测的屈服域的系数和晶片寿命预测的寿命域，整合域，电/布局域，计量/缺陷域和 机器传感器域以分层方式。 借助于层次确定的系数，可以减少预测中的噪声，从而可以提高晶片的产量或寿命的预测结果的精度。