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公开(公告)号:US08029685B2
公开(公告)日:2011-10-04
申请号:US11849683
申请日:2007-09-04
IPC分类号: G01D15/00
CPC分类号: B41J2/1642 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , Y10T29/49128 , Y10T29/4913 , Y10T29/49401
摘要: A method of manufacturing a liquid ejection head and a liquid ejection head capable of preventing corrosion of electrodes are provided. The method of manufacturing a liquid ejection head includes: a step of forming porous silicon areas in portions of a silicon substrate where the liquid paths are to be formed; a step of forming in layers in the porous silicon areas a protective layer, a heating resistor layer, an electrode layer and a heat accumulation layer; a step of forming ink ejection openings in the silicon substrate; and a step of removing the porous silicon areas.
摘要翻译: 提供一种能够防止电极腐蚀的液体喷射头和液体喷射头的制造方法。 制造液体喷射头的方法包括:在要形成液体路径的硅衬底的部分中形成多孔硅区域的步骤; 在多孔硅区域中形成保护层,加热电阻层,电极层和蓄热层的步骤; 在硅衬底中形成喷墨口的步骤; 以及去除多孔硅区域的步骤。
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公开(公告)号:US20100225712A1
公开(公告)日:2010-09-09
申请号:US12781218
申请日:2010-05-17
IPC分类号: B41J2/045
CPC分类号: B41J2/161 , B41J2/1623 , B41J2/1626 , Y10T29/42 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49401
摘要: A method for manufacturing an inkjet head includes providing a piezoelectric substrate having a porous structure, a diaphragm on the porous structure, and a piezoelectric substance layer on the diaphragm, and forming a cavity by etching out the porous structure from the piezoelectric substrate.
摘要翻译: 一种制造喷墨头的方法包括:提供具有多孔结构的压电基片,多孔结构上的光阑以及隔膜上的压电物质层,通过从压电基片上蚀刻出多孔结构而形成空腔。
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公开(公告)号:US20060049135A1
公开(公告)日:2006-03-09
申请号:US11215974
申请日:2005-09-01
CPC分类号: B41J2/161 , B41J2/1623 , B41J2/1626 , Y10T29/42 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49401
摘要: A method for manufacturing an inkjet head includes providing a piezoelectric substrate having a porous structure, a diaphragm on the porous structure, and a piezoelectric substance layer on the diaphragm, and forming a cavity by etching out the porous structure from the piezoelectric substrate.
摘要翻译: 一种制造喷墨头的方法包括:提供具有多孔结构的压电基片,多孔结构上的光阑以及隔膜上的压电物质层,通过从压电基片上蚀刻出多孔结构而形成空腔。
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