公开(公告)号：US08341896B2

公开(公告)日：2013-01-01

申请号：US13356475

申请日：2012-01-23

Applicant: Jorgen J. Moller, Jr. ,  Jeremiah D. Shapiro

Inventor： Jorgen J. Moller, Jr. ,  Jeremiah D. Shapiro

IPC: E04F15/02

CPC classification number: E04F15/225 ,  E01C5/20 ,  E01C11/24 ,  E01C13/045 ,  E01C2201/12 ,  E01C2201/16 ,  E04F15/02022 ,  E04F15/022 ,  E04F15/10 ,  E04F15/105 ,  E04F15/22 ,  E04F2201/0146 ,  E04F2201/091 ,  E04F2201/095 ,  E04F2203/00 ,  Y10T29/49844

Abstract: Modular floor tiles and modular floors are described herein. A modular floor tile may include a top surface layer, a plurality of edge surfaces, an interlocking mechanism for attachment to adjacent tiles, and a support system. The support system may additionally include a first rigid level and at least one resilient support member disposed under the top surface layer, the at least one resilient support member extending to a distance further from the top surface layer than the first rigid level. The at least one resilient support member may be compressible toward the top surface layer. A modular floor may include a plurality of interlocking tiles connected to one another. A method of forming a modular floor that includes an interlocking modular tile is also disclosed.

公开(公告)号：US20110056158A1

公开(公告)日：2011-03-10

申请号：US12945195

申请日：2010-11-12

Applicant: Jorgen J. Moller, JR. ,  Jeremiah D. Shapiro

Inventor： Jorgen J. Moller, JR. ,  Jeremiah D. Shapiro

IPC: E04F15/22

CPC classification number: E04F15/225 ,  E01C5/20 ,  E01C11/24 ,  E01C13/045 ,  E01C2201/12 ,  E01C2201/16 ,  E04F15/02022 ,  E04F15/022 ,  E04F15/10 ,  E04F15/105 ,  E04F15/22 ,  E04F2201/0146 ,  E04F2201/091 ,  E04F2201/095 ,  E04F2203/00 ,  Y10T29/49844

Abstract: Modular floor tiles and modular floors are described herein. A modular floor tile may include a top surface layer, a plurality of edge surfaces, an interlocking mechanism for attachment to adjacent tiles, and a support system. The support system may additionally include a first rigid level and at least one resilient support member disposed under the top surface layer, the at least one resilient support member extending to a distance further from the top surface layer than the first rigid level. The at least one resilient support member may be compressible toward the top surface layer. A modular floor may include a plurality of interlocking tiles connected to one another. A method of forming a modular floor that includes an interlocking modular tile is also disclosed.

Abstract translation: 本文描述了模块化地板砖和模块化地板。 模块化地板瓦可以包括顶表面层，多个边缘表面，用于附接到相邻瓦片的互锁机构和支撑系统。 支撑系统可以另外包括第一刚性水平和设置在顶表面层下方的至少一个弹性支撑构件，所述至少一个弹性支撑构件延伸到远离顶表面层比第一刚性水平更远的距离。 所述至少一个弹性支撑构件可朝向顶表面层压缩。 模块化地板可以包括彼此连接的多个互锁瓦片。 还公开了一种形成包括互锁模块瓦的模块化地板的方法。