公开(公告)号：US20020062968A1

公开(公告)日：2002-05-30

申请号：US10039678

申请日：2001-11-09

Applicant: HARTING Automotive GmbH & Co. KG

Inventor： Jens Krause ,  Thomas Heimann

IPC: H01J005/00

CPC classification number: H05K5/063

Abstract: A hermetically sealed housing for power electronics comprises a tank consisting of sheet metal, and a cover consisting of an aluminum material. The tank has a surrounding edge which is provided with a plurality of bending lugs, and the edge of the cover has a shoulder at which the bending lug rests, so that the cover is pressed against the edge of the tank and a hermetic sealing is obtained.

Abstract translation: 用于电力电子器件的气密密封壳体包括由金属片组成的罐和由铝材料组成的盖。 该罐具有周边边缘，该边缘设置有多个弯曲凸耳，并且该盖的边缘具有一个肩部，弯曲凸耳位于该肩部处，使得该盖被压靠在该罐的边缘上并获得气密密封 。

公开(公告)号：US20020056560A1

公开(公告)日：2002-05-16

申请号：US09991446

申请日：2001-11-09

Inventor： Jwei Wien Liu

IPC: H01J005/00

CPC classification number: B81B7/0067 ,  G02B26/0841 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A low-cost, high-performance, reliable micromirror package (300) that replaces the ceramic substrate in conventional packages with a printed circuit board substrate (30) and a molded plastic case (33), and the cover glass with a window (36), preferably an optically clear plastic window. The printed circuit board substrate (30) allows for either external bond pads or flex cable connection of the micromirror package to the projector's motherboard. These packages support flexible snap-in, screw-in, ultrasonic plastic welding, or adhesive welding processes to overcome the high cost seam welding process of many conventional packages.

Abstract translation: 一种低成本，高性能，可靠的微镜封装（300），其用印刷电路板基板（30）和模制塑料外壳（33）代替传统封装中的陶瓷基板，并且具有窗口的玻璃（36 ），优选为光学透明的塑料窗。 印刷电路板基板（30）允许将微镜组件的外部接合焊盘或柔性电缆连接到投影仪的主板。 这些封装支持灵活的插入式，螺旋式，超声波塑料焊接或粘合剂焊接工艺，以克服许多常规封装的高成本缝焊工艺。

公开(公告)号：US20020046853A1

公开(公告)日：2002-04-25

申请号：US09471045

申请日：1999-12-22

Inventor： RICHARD J. STENDARDO ,  WILLIAM W. KERR JR. ,  MELANIE A. LEWIS ,  THOMAS F. VRNAK ,  GENARO FLORES ALBA

IPC: H01J005/00 ,  H01J015/00

CPC classification number: H01F27/02 ,  H02B1/28 ,  H05K7/20009

Abstract: A waterproof enclosure (100) for electrical devices includes a front frame (114), a base plate (116), and a roof assembly (118) attached to a component mounting section (120). Front frame (114) extends from the front of component mounting section (120), and includes doors (122) for protecting electrical components mounted within the component mounting section (120). Roof assembly (118) is attached to the top of front frame (114) and component mounting section (120) for preventing the ingress moisture into front frame (114) and component mounting section (120). Roof assembly (118) includes ventilation channels (124, 126, 128, 130) disposed along the length of caps (132, 134, 136) to increase air flow through the enclosure (100) for cooling the electrical components mounted therein.

Abstract translation: 用于电气设备的防水外壳（100）包括前框架（114），基板（116）和附接到部件安装部分（120）的顶盖组件（118）。 前框架（114）从部件安装部分（120）的前部延伸，并且包括用于保护安装在部件安装部分（120）内的电气部件的门（122）。 屋顶组件（118）附接到前框架（114）的顶部和部件安装部分（120），用于防止湿气进入前框架（114）和部件安装部分（120）。 屋顶组件（118）包括沿着盖子（132,134,136）的长度设置的通风通道（124,126,128,130），以增加通过外壳（100）的空气流，用于冷却安装在其中的电气部件。