公开(公告)号：US20040231877A1

公开(公告)日：2004-11-25

申请号：US10444488

申请日：2003-05-23

Inventor： William D. Wolf ,  Joseph F. Lessar ,  Lynn M. Seifried ,  Lea A. Nygren

IPC: H01J005/00

CPC classification number: H01M2/06 ,  H01M2/08 ,  H01M2/30

Abstract: A feed-through assembly for an IMD and a method for fabricating the same are provided. The feed-through assembly has a ferrule having a first aperture disposed therethrough. An insulating member is disposed at least partially within the first aperture. The insulating member has a second aperture, an inside surface and an outside surface. A metallization region overlies at least a portion of the inside surface and at least a portion of the outside surface of the insulating member. The metallization region is formed of a first layer of titanium and a second layer of niobium. A portion of a terminal pin of platinum is disposed through the second aperture. A first brazing seal is disposed between the insulating member and the ferrule and a second brazing seal is disposed between the insulating member and the terminal pin. The first and second brazing seals are formed of gold.

Abstract translation: 提供了一种用于IMD的馈通组件及其制造方法。 馈通组件具有套圈，其具有穿过其设置的第一孔。 绝缘构件至少部分地设置在第一孔内。 绝缘构件具有第二孔，内表面和外表面。 金属化区域覆盖绝缘构件的内表面的至少一部分和外表面的至少一部分。 金属化区域由第一层钛和第二层铌形成。 铂的端子针的一部分设置穿过第二孔。 第一钎焊密封件设置在绝缘构件和套圈之间，并且第二钎焊密封件设置在绝缘构件和端子销之间。 第一和第二钎焊密封由金形成。

公开(公告)号：US20040182590A1

公开(公告)日：2004-09-23

申请号：US10775020

申请日：2004-02-09

Inventor： Thaddeus E. Nordquist ,  Eric Lawrence Nordquist ,  Kevin T. Luce

IPC: H01J005/00

CPC classification number: H01B17/305 ,  H01J5/50

Abstract: A soldered feed-through device that is inserted into a bulkhead opening has one or more sets of laterally protruding and symmetrically distributed teeth that cut through the bulkhead material as the feed-through is inserted into the bulkhead opening. The teeth automatically center the feed-through device within the bulkhead opening and resist tilting of the feed-through and its through-hole conductor so that application of solder to the area between the feed-through and the inner periphery of the opening produces a solder joint having uniform radial thickness of preferably about 0.14 mm (0.0055 in.).

Abstract translation: 插入隔板开口中的焊接的馈通装置具有一组或多组侧向突出和对称分布的齿，当穿过插入隔板开口时，切割穿过隔板材料的一组。 牙齿自动将进料装置中心在隔板开口内，并抵抗通孔及其通孔导体的倾斜，使得将焊料施加到开口的馈通和内周之间的区域产生焊料 接头具有优选约0.14mm（0.0055英寸）的均匀径向厚度。

公开(公告)号：US20040173370A1

公开(公告)日：2004-09-09

申请号：US10805515

申请日：2004-03-19

Inventor： Zhijian Deng ,  Tariq Quadir

IPC: H01J005/00

CPC classification number: H01R13/521 ,  H01B17/30 ,  H01R4/56

Abstract: A hermetically sealed current conducting terminal assembly for installation in an opening in the wall of a housing. The terminal assembly includes a current conducting pin assembly comprising a first pin member electrically connected to a second pin member at a conductive core and a first and second seal that electrically isolate the pin assembly from the housing.

Abstract translation: 一种用于安装在壳体壁上的开口中的密封电流导电端子组件。 端子组件包括电流导电销组件，其包括在导电芯处电连接到第二引脚构件的第一引脚构件和将引脚组件与壳体电隔离的第一和第二密封件。

公开(公告)号：US20040083658A1

公开(公告)日：2004-05-06

申请号：US10689889

申请日：2003-10-21

Inventor： Gregg E. Laukuf ,  Mark E. Ramsey

IPC: H01J015/00 ,  H05K005/00 ,  H01J005/00 ,  H02G003/08 ,  E04F019/00

CPC classification number: E04B2/7416 ,  E04B2002/7483 ,  E04B2002/7488 ,  E04F19/00 ,  H02G3/123

Abstract: An office furniture system including at least one modular wall panel, a work surface attached to the at least one modular wall panel and a spill tolerant outlet coupled with the work surface. The spill tolerant outlet including a housing having a side and an opposite side, a plurality of electrical terminals accessible through the side and at least one fluid drain opening in the opposite side.

Abstract translation: 一种办公家具系统，包括至少一个模块化墙板，连接到所述至少一个模块化墙板的工作表面和与所述工作表面相连接的溢出容限出口。 泄漏容限出口包括具有侧面和相对侧的壳体，可通过侧面接近的多个电气端子和相对侧中的至少一个流体排放开口。

公开(公告)号：US20030221853A1

公开(公告)日：2003-12-04

申请号：US10394476

申请日：2003-03-21

Inventor： Masakuni Shiozawa

IPC: H02G003/08 ,  H01J005/00

CPC classification number: B23K3/085 ,  B23K1/008 ,  B23K2101/40 ,  H01L21/67109 ,  H01L2924/0002 ,  H05K1/189 ,  H05K3/3494 ,  H05K2203/1545 ,  H01L2924/00

Abstract: Quality control of product manufacturing is performed with a simple structure and, in addition, damage of a product when a production line is stopped is avoided. A preheating block approaches a circuit substrate having a predetermined length along a tape substrate from a predetermined position by gradual upward movements to carry out preheating and is then returned to the predetermined position, a main heating block arranged close to the preheating block is made to contact the circuit substrate on which the preheating has been carried out and which is transported in a predetermined tact to apply peak heating and is then restored to the predetermined position, and a cooling block accesses the circuit substrate to which the peak heating has been applied to cool the circuit substrate and is then returned to the predetermined position.

Abstract translation: 以简单的结构进行产品制造的质量控制，并且避免了生产线停止时产品的损坏。 预热块通过逐渐向上移动从预定位置通过带基板沿着带基板接近预定长度的电路基板，以进行预热，然后返回到预定位置，使靠近预热块布置的主加热块接触 已经进行了预热的电路基板，以预定的方式输送以施加峰值加热，然后恢复到预定位置，并且冷却块访问已经施加了峰值加热的电路基板以冷却 电路基板，然后返回到预定位置。

公开(公告)号：US20020139556A1

公开(公告)日：2002-10-03

申请号：US09823464

申请日：2001-03-30

Inventor： Jerry Ok ,  Robert J. Greenberg

IPC: H01J005/00

CPC classification number: H05K3/4046 ,  H01L21/486 ,  H01L23/10 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/10287 ,  H05K2201/10416 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49162 ,  Y10T29/49163 ,  Y10T428/24926 ,  H01L2924/00

Abstract: A method and apparatus suitable for forming hermetic electrical feedthroughs in a ceramic sheet having a thickness of null40 mils. More particularly, the method yields an apparatus including a hermetic electrical feedthrough which is both biocompatible and electrochemically stable and suitable for implantation in a patient's body. The method involves: (a) providing an unfired, ceramic sheet having a thickness of null40 mils and preferably comprising >99% aluminum oxide; (b) forming multiple blind holes in said sheet; (c) inserting solid wires, preferably of platinum, in said holes; (d) firing the assembly of sheet and wires to a temperature sufficient to sinter the sheet material but insufficient to melt the wires; and (e) removing sufficient material from the sheet lower surface so that the lower ends of said wires are flush with the finished sheet lower surface.

Abstract translation: 一种适于在厚度<40密耳的陶瓷片中形成气密电馈通件的方法和装置。 更具体地，该方法产生一种包括生物相容性和电化学稳定性并且适于植入患者体内的气密电馈通装置。 该方法包括：（a）提供厚度<40密耳，优选包含> 99％氧化铝的未烧制的陶瓷片; （b）在所述片材中形成多个盲孔; （c）将优选铂的实心线插入所述孔中; （d）将片材和电线的组件烧制到足以烧结片材但不足以熔化电线的温度; 以及（e）从片材下表面去除足够的材料，使得所述电线的下端与成品片材下表面齐平。

公开(公告)号：US20020096347A1

公开(公告)日：2002-07-25

申请号：US10043084

申请日：2002-01-09

Applicant: Thomas & Betts International, Inc.

Inventor： Roger Pyron

IPC: H02G003/08 ,  H01J005/00

CPC classification number: H02G1/08 ,  H02G1/085 ,  H02G3/00

Abstract: A conduit body assembly includes an elongate sidewall, at least one hub and a glide member. The conduit body has an open upper end, a closed lower end, and a conduit body interior. The hub extends from the body in communication with the body interior and defines an access port for passage of wire therethrough. The glide member is arranged within the body interior adjacent to the access port for providing reduced frictional engagement with wire passing through the access port.

Abstract translation: 导管本体组件包括细长侧壁，至少一个毂和滑动构件。 导管本体具有敞开的上端，封闭的下端和导管本体内部。 轮毂从身体与身体内部连通延伸，并且限定了用于使线穿过的通道。 滑动构件布置在邻近进入端口的主体内部中，用于与通过进入端口的线材提供减小的摩擦接合。

公开(公告)号：US20020092663A1

公开(公告)日：2002-07-18

申请号：US09765252

申请日：2001-01-18

Inventor： Daniel A. Gilmour

IPC: H01J005/00

CPC classification number: B60K15/03 ,  B60K2015/03453 ,  Y10S439/935

Abstract: A glass-sealed electrical fitting for an automotive fuel tank is mounted on a flange which supports an internal fuel pump and fuel level sensor within the fuel tank. In one form, the glass seal surrounds a plurality of pins longitudinally disposed within an elongated housing which penetrates a fuel tank wall. An outer surface of the housing engages rigidly to the flange, and an inner surface of the housing engages to the glass seal. In another form each pin is sealed to a housing by a separate glass seal.

Abstract translation: 用于汽车燃料箱的玻璃密封电气配件安装在支撑燃料箱内的内部燃料泵和燃料液位传感器的凸缘上。 在一种形式中，玻璃密封件围绕纵向设置在穿过燃料箱壁的细长壳体内的多个销。 壳体的外表面刚性地接合到凸缘，并且壳体的内表面接合玻璃密封件。 在另一种形式中，每个销通过单独的玻璃密封件密封到壳体。

公开(公告)号：US20040151505A1

公开(公告)日：2004-08-05

申请号：US10748051

申请日：2003-12-30

Applicant: Finisar Corporation

Inventor： Lewis B. Aronson ,  Giorgio Giaretta ,  Stefano Schiaffino ,  Dev E. Kumar ,  T.G. Beck Mason

IPC: H02G003/08 ,  H01J005/00 ,  H05K005/00 ,  H01J015/00

CPC classification number: H01S5/02212 ,  H01L23/055 ,  H01L23/10 ,  H01L2924/0002 ,  H01S5/02415 ,  H01L2924/00

Abstract: A small form factor transceiver module that incorporates an externally modulated laser (EML). The transceiver module has a transmitter optical subassembly with a header assembly having a base with a platform extending through. The platform has a plurality of conductive traces extending through the platform for making connections on both sides of the base. A thermoelectric cooler (TEC) is used to dissipate heat from a laser within the header assembly. The TEC dissipates heat sufficiently to allow the EML to be used in the header assembly. In this manner, EMLs can be used in relatively small optical devices, including small form factor transceivers that comply with the XFP standard. The XFP modules with EMLs can be used for longer links than XFPs without EMLs. In addition, EMLs can be stabilized using TECs so that XFP modules can be used for DWDM-type applications.

Abstract translation: 采用外部调制激光器（EML）的小尺寸收发模块。 收发器模块具有发射器光学子组件，其具有头部组件，该头部组件具有带有延伸穿过的平台的底座。 平台具有延伸穿过平台的多个导电迹线，用于在基底的两侧进行连接。 热电冷却器（TEC）用于从头部组件内的激光器散热。 TEC充分散热，使EML能够用于头部组件。 以这种方式，EML可用于相对较小的光学装置，包括符合XFP标准的小尺寸收发器。 具有EML的XFP模块可用于比没有EML的XFP更长的链路。 此外，EML可以使用TEC进行稳定，以便XFP模块可用于DWDM型应用。

公开(公告)号：US20040094320A1

公开(公告)日：2004-05-20

申请号：US10614350

申请日：2003-07-08

Inventor： Masaaki Goto ,  Fumiaki Nishiuchi ,  Misao Nakajima ,  Mitsuo Zen ,  Sanae Taniguchi ,  Takenori Azuma

IPC: H01J005/00

CPC classification number: H03H9/1071 ,  H01L23/04 ,  H01L23/10 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2224/0401

Abstract: A lid for use with a plate-shaped base to seal an electronic device such as a SAW device includes a top portion, a wall structure extending from the top portion, and a lip connected to the lower end of the wall structure. The lip extends outwards from an outer surface of the wall structure by 10-500 nullm and has solder on an inner surface thereof. The lid can be soldered to a plate-shaped base to form a package. The lid can be conveniently formed by performing drawing of a metal strip coated with solder to define a recessed shape, and then severing a flange of the recessed shape to define the lip.

Abstract translation: 用于与诸如SAW器件的电子设备密封的板状基座的盖子包括顶部，从顶部延伸的壁结构和连接到壁结构的下端的唇缘。 唇缘从墙壁结构的外表面向外延伸10-500毫米，并在其内表面上具有焊料。 盖可以焊接到板状基底以形成包装。 可以通过对涂覆有焊料的金属带进行拉伸以限定凹陷形状，然后切断凹陷形状的凸缘以限定唇缘，可以方便地形成盖。