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公开(公告)号:US2293177A
公开(公告)日:1942-08-18
申请号:US32185240
申请日:1940-03-02
Applicant: BEIL TELEPHONE LAB INC
Inventor: SKELLETT ALBERT M
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公开(公告)号:US2272232A
公开(公告)日:1942-02-10
申请号:US34871140
申请日:1940-07-31
Applicant: RCA CORP
Inventor: WAGNER HERBERT M
IPC: H01J43/02
CPC classification number: H01J43/02
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公开(公告)号:US2270405A
公开(公告)日:1942-01-20
申请号:US28893539
申请日:1939-08-08
Applicant: INT STANDARD ELECTRIC CORP
Inventor: HARRISON BLACK DONALD
CPC classification number: H01J43/025 , H03K4/12 , H03K4/18
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公开(公告)号:US2235190A
公开(公告)日:1941-03-18
申请号:US19478838
申请日:1938-03-09
Applicant: RCA CORP
CPC classification number: G05F1/52 , H01J43/025
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公开(公告)号:US2212645A
公开(公告)日:1940-08-27
申请号:US14541337
申请日:1937-05-29
Applicant: RCA CORP
Inventor: MORTON GEORGE A
IPC: H01J43/02
CPC classification number: H01J43/02
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公开(公告)号:US2191903A
公开(公告)日:1940-02-27
申请号:US22407138
申请日:1938-08-10
Applicant: MO VALVE COMPANY LTD
Inventor: HERBERT ALDOUS WILLIAM
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公开(公告)号:US2168165A
公开(公告)日:1939-08-01
申请号:US19833938
申请日:1938-03-26
Applicant: GEN ELECTRIC
Inventor: KOLLER LEWIS R , JOHNSON RALPH P
IPC: H01J43/02
CPC classification number: H01J43/025 , Y10T307/773
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30.
公开(公告)号:US20230386810A1
公开(公告)日:2023-11-30
申请号:US17752151
申请日:2022-05-24
Applicant: Elbit Systems of America, LLC
Inventor: Stephen Carroll , William J. Baney , Cooper Gray Temple , Matthew Robert Curtis
IPC: H01J43/28 , G02B23/12 , H01J43/02 , H01J43/12 , C23C14/04 , C23C14/14 , C23C14/24 , C23C14/50 , C03C15/00
CPC classification number: H01J43/28 , G02B23/125 , H01J43/02 , H01J43/12 , C23C14/042 , C23C14/14 , C23C14/24 , C23C14/505 , C03C15/00
Abstract: A night vision system, a microchannel plate (MCP), and a planetary deposition system and methodology are provided for selectively depositing an electrode contact metal on one side of MCP channel openings. One or more MCPs can be releasably secured to a face of a platter that rotates about its central platter axis. The rotating platter can be tilted on a rotating ring fixture surrounding an evaporative source of contact metal. Therefore, the rotating platter further rotates so that it orbits around the evaporative source of contact metal. A mask with a variable size mask opening is arranged between the rotating platter and the evaporative source. While the mask orbits around the evaporative source with the rotating platter, the mask does not rotate along its own axis as does the rotating platter.
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