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公开(公告)号:US20080002324A1
公开(公告)日:2008-01-03
申请号:US11732129
申请日:2007-04-02
IPC分类号: H02H9/04
CPC分类号: H03K17/122 , H03K17/0822 , H03K17/567 , H03K17/687
摘要: A circuit arrangement includes plural semiconductor switches, at least one overvoltage protection arrangement and a coupling circuit. Each of a first semiconductor switch and a second semiconductor switch has a control terminal and first and second load terminals. The at least one overvoltage protection arrangement provides overvoltage protection to the semiconductor switches. The coupling circuit is operable to selectively couple the control terminals of at least two of the at least two semiconductor switches.
摘要翻译: 电路装置包括多个半导体开关,至少一个过电压保护装置和耦合电路。 第一半导体开关和第二半导体开关中的每一个具有控制端子和第一和第二负载端子。 至少一个过电压保护装置为半导体开关提供过电压保护。 耦合电路可操作以选择性地耦合至少两个半导体开关中的至少两个的控制端子。