公开(公告)号：US20050171967A1

公开(公告)日：2005-08-04

申请号：US10768522

申请日：2004-01-30

Applicant: Paul Yuknewicz ,  Michael Harsh ,  Simon Calvert ,  Donna Wallace ,  Antoine Cote ,  Fred Balsiger ,  Nikhil Kothari ,  Brian Pepin ,  Jeffrey Chrisope ,  Graeme Mott ,  Christopher Dias ,  Bulusu Mohan ,  Andrew Lin ,  Joseph Kubiniec ,  James Schmelzer ,  Corrina Barber ,  Anson Horton ,  Meghan Perez

Inventor： Paul Yuknewicz ,  Michael Harsh ,  Simon Calvert ,  Donna Wallace ,  Antoine Cote ,  Fred Balsiger ,  Nikhil Kothari ,  Brian Pepin ,  Jeffrey Chrisope ,  Graeme Mott ,  Christopher Dias ,  Bulusu Mohan ,  Andrew Lin ,  Joseph Kubiniec ,  James Schmelzer ,  Corrina Barber ,  Anson Horton ,  Meghan Perez

IPC: G06F9/44 ,  G06F17/00

CPC classification number: G06F8/00

Abstract: A user interface is provided that exposes items such as developer tasks, commands, property settings, and other related information to a user. The user interface may be invoked in a number of development interfaces such as, for example, a designer or an editor. The user interface may be either an object bound interface or an action triggered interface. An object bound interface exposes a set of items that are associated with a corresponding object. An action triggered interface exposes a set of items that are associated with a corresponding triggering action. In addition to enumerating developer tasks, the user interface may provide a direct link to other interfaces that facilitate task execution.

Abstract translation: 提供了向用户公开诸如开发者任务，命令，属性设置和其他相关信息的用户界面。 可以在许多开发接口中调用用户界面，例如设计者或编辑器。 用户界面可以是对象绑定界面或动作触发界面。 对象绑定界面暴露与对应对象相关联的一组项目。 动作触发界面公开了与相应的触发动作相关联的一组项目。 除了枚举开发者任务之外，用户界面还可以提供直接链接到促进任务执行的其他接口。

公开(公告)号：US06187692B1

公开(公告)日：2001-02-13

申请号：US09187112

申请日：1998-11-05

Applicant: Shih-Ming Lan ,  Chun-Liang Liu ,  Andrew Lin ,  Hsien-Liang Meng

Inventor： Shih-Ming Lan ,  Chun-Liang Liu ,  Andrew Lin ,  Hsien-Liang Meng

IPC: H01L2131

CPC classification number: H01L21/02164 ,  C23C16/401 ,  C23C16/45557 ,  H01L21/022 ,  H01L21/02271 ,  H01L21/31612

Abstract: A method for forming an insulating layer to solve a problem of non-uniform thickness of the insulating layer is provided. The method includes forming a first insulating layer over a substrate preferably by chemical vapor deposition (CVD) at an operation temperature of about 200° C.-350° C. The thickness of the first insulating layer is about 500 Å-5000 Å. A second insulating layer is formed over the first insulating layer preferably by CVD at a temperature of about 350° C.-500° C. The thickness of the second insulating layer is about 1000 Å-10000 Å. The first and the second insulating layers form together as an insulating layer to insulate transistors and isolation structures from the interconnect metal layer.

Abstract translation: 提供一种用于形成绝缘层以解决绝缘层的不均匀厚度的问题的方法。 该方法包括在约200℃-350℃的操作温度下优选通过化学气相沉积（CVD）在衬底上形成第一绝缘层。第一绝缘层的厚度为约500至5000。 优选通过CVD在约350℃-500℃的温度下在第一绝缘层上形成第二绝缘层。第二绝缘层的厚度为约1000埃。 第一和第二绝缘层一起形成绝缘层，以使晶体管和隔离结构与互连金属层绝缘。