公开(公告)号：US20050191914A1

公开(公告)日：2005-09-01

申请号：US10896907

申请日：2004-07-23

Applicant: Shao-Hwa Wang ,  Chi-Sheng Lin

Inventor： Shao-Hwa Wang ,  Chi-Sheng Lin

IPC: H01R13/64 ,  H05K7/14

CPC classification number: H05K7/142 ,  Y10T29/49128 ,  Y10T29/49718

Abstract: A method for repairing and assembling contact image sensor module and structure thereof are provided. The method includes following steps: (1) making a sensor housing; (2) providing a PCB; (3) assembling the PCB into the sensor housing; (4) melting an end of a securing post located on the sensor housing and forming fastening means for fixing the PCB to the sensor housing; (5) testing the assembled CIS, if it can't pass the test, then cut off the fastening means and take away the PCB for repairing or replacing it; (6) cutting off the securing post located on the housing; (7) making an adapted post with a securing tip and fixing said adapted post to a corresponding position of the sensor housing on which the former securing post being located; (8) assembling the repaired or replaced PCB into the sensor housing, and make the securing tip of the adapted post passing through the securing hole and extending outwardly from the PCB; (9) melting the tip of the adapted post by the manner of hot-press and forming a new fastening means for fixing the repaired or replaced PCB to the sensor housing again.

Abstract translation: 提供了一种修复和组装接触式图像传感器模块及其结构的方法。 该方法包括以下步骤：（1）制作传感器外壳; （2）提供PCB; （3）将PCB组装到传感器外壳中; （4）熔化位于传感器壳体上的固定杆的端部，并形成用于将PCB固定到传感器壳体的紧固装置; （5）测试组装的CIS，如果不能通过测试，则切断紧固装置并取出PCB进行修理或更换; （6）切断位于壳体上的固定柱; （7）制成具有固定尖端的适配柱，并将所述适配柱固定到位于所述前固定柱的所述传感器壳体的对应位置; （8）将修理或更换的PCB组装到传感器壳体中，并使适配柱的固定尖端穿过固定孔并从PCB向外延伸; （9）通过热压方式熔化适配柱的末端，并形成用于将修复或更换的PCB再次固定到传感器壳体的新的紧固装置。