公开(公告)号：US5878661A

公开(公告)日：1999-03-09

申请号：US114118

申请日：1998-07-13

Applicant: Andrew Zachary Glovatsky ,  Vivek Amir Jairazbhoy ,  Jeff Lin ,  John Trublowski

Inventor： Andrew Zachary Glovatsky ,  Vivek Amir Jairazbhoy ,  Jeff Lin ,  John Trublowski

IPC: B41N1/24 ,  H05K3/12 ,  B05C17/06

CPC classification number: H05K3/1225 ,  B41N1/24 ,  Y10T29/49169

Abstract: There is disclosed herein a self-shearing stencil for use in applying solder paste or other bonding material atop a printed circuit board (PCB) in a predefined pattern. The stencil 50 has a top surface 12, a bottom surface 14, a first surface cavity 16 in the top surface, and a second surface cavity 18 in the bottom surface proximate the first surface. The cavities 16/18 overlap in a predefined manner so as to be in open communication with each other. When the stencil is placed on the PCB, the cavities are filled with solder paste and the PCB is then lowered away from the stencil, whereupon a bottom ledge 26 (defined by the stencil material underneath the first cavity) shears off the solder paste in the first cavity from the paste in the second cavity.

Abstract translation: 这里公开了一种自剪切模板，用于以预定图案在印刷电路板（PCB）的顶部上施加焊膏或其它粘合材料。 模板50具有顶表面12，底表面14，顶表面中的第一表面空腔16和靠近第一表面的底表面中的第二表面腔18。 空腔16/18以预定的方式重叠，以便彼此开放连通。 当模板放置在PCB上时，空穴填充有焊膏，然后将PCB从模板上降下，然后将底部凸缘26（由第一腔下方的模板材料限定）在该模具中剪切出焊膏 第一腔从第二腔中的糊状物。