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32 条记录 (耗时 0.021 秒)

    Self-shearing stencil
    1.
    发明授权
    Self-shearing stencil 失效
    自剪模板

    公开(公告)号：US5878661A

    公开(公告)日：1999-03-09

    申请号：US114118

    申请日：1998-07-13

    申请人： Andrew Zachary Glovatsky ,  Vivek Amir Jairazbhoy ,  Jeff Lin ,  John Trublowski

    发明人： Andrew Zachary Glovatsky ,  Vivek Amir Jairazbhoy ,  Jeff Lin ,  John Trublowski

    IPC分类号： B41N1/24 ,  H05K3/12 ,  B05C17/06

    CPC分类号： H05K3/1225 ,  B41N1/24 ,  Y10T29/49169

    摘要： There is disclosed herein a self-shearing stencil for use in applying solder paste or other bonding material atop a printed circuit board (PCB) in a predefined pattern. The stencil 50 has a top surface 12, a bottom surface 14, a first surface cavity 16 in the top surface, and a second surface cavity 18 in the bottom surface proximate the first surface. The cavities 16/18 overlap in a predefined manner so as to be in open communication with each other. When the stencil is placed on the PCB, the cavities are filled with solder paste and the PCB is then lowered away from the stencil, whereupon a bottom ledge 26 (defined by the stencil material underneath the first cavity) shears off the solder paste in the first cavity from the paste in the second cavity.

    摘要翻译： 这里公开了一种自剪切模板，用于以预定图案在印刷电路板（PCB）的顶部上施加焊膏或其它粘合材料。 模板50具有顶表面12，底表面14，顶表面中的第一表面空腔16和靠近第一表面的底表面中的第二表面腔18。 空腔16/18以预定的方式重叠，以便彼此开放连通。 当模板放置在PCB上时，空穴填充有焊膏，然后将PCB从模板上降下，然后将底部凸缘26（由第一腔下方的模板材料限定）在该模具中剪切出焊膏 第一腔从第二腔中的糊状物。

    Method and apparatus for dispensing viscous material
    2.
    发明授权
    Method and apparatus for dispensing viscous material 失效
    用于分配粘性材料的方法和装置

    公开(公告)号：US06395087B1

    公开(公告)日：2002-05-28

    申请号：US09359625

    申请日：1999-07-22

    申请人： Vivek Amir Jairazbhoy ,  Jeff (Jin Her) Lin ,  John Trublowski ,  Vinh Van Ha ,  Zhaoji Yang

    发明人： Vivek Amir Jairazbhoy ,  Jeff (Jin Her) Lin ,  John Trublowski ,  Vinh Van Ha ,  Zhaoji Yang

    IPC分类号： B05C502

    CPC分类号： B23K3/0607 ,  B23K2101/42 ,  B41F15/42 ,  H05K3/1233 ,  H05K2203/0126

    摘要： A novel apparatus for compressing viscous material through openings in a stencil is disclosed. The novel apparatus has a compress on head cap which provides a contained environment to direct and to aid the flow of pressurized viscous material through the openings in the stencil. In another embodiment of the invention, the compression head includes a viscous material reception chamber which has a certain shape which is effective to cause said received viscous material to be selectively dispensed while having a substantially uniform velocity profile and which further provides for the creation of a substantially uniform pressure profile.

    摘要翻译： 公开了一种通过模板中的开口压缩粘性材料的新颖设备。 新颖的装置具有头盖上的压缩，其提供容纳的环境以引导和帮助加压的粘性材料通过模板中的开口的流动。 在本发明的另一个实施例中，压缩头包括粘性材料接收室，其具有一定形状，其有效地使所述接收的粘性材料选择性地分配，同时具有基本上均匀的速度分布，并且进一步提供了一种 基本均匀的压力分布。

    Anti-bridging solder ball collection zones
    9.
    发明授权
    Anti-bridging solder ball collection zones 失效
    抗桥接焊球收集区

    公开(公告)号：US06316736B1

    公开(公告)日：2001-11-13

    申请号：US09092821

    申请日：1998-06-08

    申请人： Vivek Amir Jairazbhoy ,  Richard Keith McMillan

    发明人： Vivek Amir Jairazbhoy ,  Richard Keith McMillan

    IPC分类号： H01R909

    CPC分类号： H05K3/3442 ,  H01L2224/10175 ,  H01L2924/384 ,  H01L2924/3841 ,  H05K1/111 ,  H05K3/3452 ,  H05K2201/0939 ,  H05K2201/0989 ,  H05K2201/10636 ,  H05K2201/10689 ,  Y02P70/611 ,  Y02P70/613

    摘要： There is disclosed herein a printed circuit board (PCB) having improved resistance against solder bridging and component decentering/tombstoning. The printed circuit board (PCB) includes a substrate 10 having a top surface 12; at least two mounting pads 14 disposed on the top surface in matched relation with terminations 26 of an electronic component 24; and a solder mask 16 disposed on the top surface and having at least two apertures 18 therethrough, wherein each aperture generally conforms in shape with and is arranged about a respective one of the mounting pads 14. Each aperture 18 has at least one inner aperture edge 22i generally within a projected footprint F of the electronic component and at least one outer aperture edge 22o generally outside the footprint F. Each aperture 18 includes a notch 20 in one or more of the at least one outer aperture edge 22o, wherein each notch 20 extends generally outward from its respective mounting pad 14. The notch 20 provides a reservoir in the solder mask aperture 18 about each pad 14, into which flux, other solder paste effluents, and solder balls may be channeled and remain contained.

    摘要翻译： 这里公开了具有改进的抗焊料桥接和元件偏心/墓碑的电阻的印刷电路板（PCB）。 印刷电路板（PCB）包括具有顶面12的基板10; 至少两个安装焊盘14，其配置在与电子部件24的端子26相匹配的顶表面上; 以及设置在顶表面上并且具有穿过其中的至少两个孔18的焊接掩模16，其中每个孔基本上与形状相配合并围绕相应的一个安装焊盘14布置。每个孔18具有至少一个内孔边缘 22i通常在电子部件的投影占地面积F内和通常在封面F外部的至少一个外部孔边缘22o中。每个孔口18包括位于至少一个外部孔口边缘22o中的一个或多个中的凹口20，其中每个凹口20 凹槽20围绕每个焊盘14在焊料掩模孔18中提供储存器，焊剂，其它焊膏流出物和焊球可以被引导并保持在其中。

    Pneumatically-actuated throttle valve for molten solder dispenser
    10.
    发明授权
    Pneumatically-actuated throttle valve for molten solder dispenser 失效
    用于熔融焊料分配器的气动致动节流阀

    公开(公告)号：US6073817A

    公开(公告)日：2000-06-13

    申请号：US148532

    申请日：1998-09-04

    申请人： Vivek Amir Jairazbhoy

    发明人： Vivek Amir Jairazbhoy

    IPC分类号： B22D39/02

    CPC分类号： B22D39/02

    摘要： A pneumatic actuator for use with a pump for dispensing molten solder on a surface, such as an integrated circuit substrate. The pump has a reservoir for containing molten solder, a nozzle for dispensing molten solder on the substrate, a diaphragm pump with a pump cavity situated in fluid communication with the reservoir and with a flow intake portion of the nozzle, and an adjustable throttle for controlling the flow of molten solder from the reservoir to the diaphragm pump. The throttle defines an annular throttle gap between the reservoir and the pump cavity to vary the effective throttle area. A spring-loaded diaphragm for adjusting the throttle defines in part a pneumatic chamber. A solenoid valve is situated in a compressed gas feed passage extending to the pneumatic chamber. The spring-loaded diaphragm is effective to control the throttle opening with a controlled delay following activation of the solenoid valve so that optimum throttle resistance can be achieved at the beginning of a solder-dispensing pulse, while providing optimum throttle resistance during the remainder of the pulse such that instantaneous cutoff of the flow through the nozzle is achieved without effecting a reverse flow of air through the nozzle into the pump chamber at the end of the solder dispensing pulse.

    摘要翻译： 一种气动致动器，用于与用于在诸如集成电路基板的表面上分配熔融焊料的泵。 泵具有用于容纳熔融焊料的储存器，用于在衬底上分配熔融焊料的喷嘴，具有与储存器流体连通并具有喷嘴的流动进入部分的泵腔的隔膜泵，以及用于控制的可调节节气门 熔融焊料从储存器流向隔膜泵。 节气门限定了储存器和泵腔之间的环形节流间隙，以改变有效节流面积。 用于调节节气门的弹簧加载隔膜部分地限定了气动室。 电磁阀位于延伸到气动室的压缩气体供给通道中。 弹簧加载的隔膜有效地在电磁阀激活之后以受控的延迟来控制节气门开度，使得在焊剂分配脉冲开始时可以实现最佳的节流阻力，同时在剩余的时间内提供最佳的节流阻力 脉冲，使得通过喷嘴的流动的瞬时截止被实现，而不会在焊料分配脉冲的末端不影响通过喷嘴的反向空气流入泵室。