公开(公告)号：US20020072201A1

公开(公告)日：2002-06-13

申请号：US10016782

申请日：2001-12-10

Applicant: Rochester Institute of Technology

Inventor： Michael D. Potter

IPC: H01L021/30 ,  H01L021/46

CPC classification number: B81C3/002 ,  Y10T156/10 ,  Y10T428/31692

Abstract: A method for electrostatic bonding includes placing a first region of a first unit at least adjacent to a first region of a second unit. The first region of the first unit has trapped charge. A bond between the first region of the first unit and the first region of the second unit is formed by the electrostatic forces between the trapped charge and induced charge in the first region of the second unit. A system for electrostatic bonding includes a first unit having a first region with trapped charge and a second unit with a first region with induced charge. Electrostatic forces between the trapped charge in the first region of the first unit and the induced charge in the first region of the second unit bond the first and second units together.

Abstract translation: 一种用于静电接合的方法包括将第一单元的第一区域至少邻近第二单元的第一区域放置。 第一个单位的第一个地区被困了。 第一单元的第一区域和第二单元的第一区域之间的结合是由第二单元的第一区域中的捕获的电荷和感应电荷之间的静电力形成的。 用于静电接合的系统包括具有被俘获电荷的第一区域的第一单元和具有诱发电荷的第一区域的第二单元。 第一单元的第一区域中的捕获的电荷与第二单元的第一区域中的感应电荷之间的静电力将第一和第二单元结合在一起。