公开(公告)号：US08172969B2

公开(公告)日：2012-05-08

申请号：US13013318

申请日：2011-01-25

申请人： Edward W. Lee ,  Avraham Benatar ,  David Grewell

发明人： Edward W. Lee ,  Avraham Benatar ,  David Grewell

IPC分类号： B32B37/00

CPC分类号： B29C65/081 ,  B23K20/10 ,  B29C65/08 ,  B29C66/1122 ,  B29C66/342 ,  B29C66/41 ,  B29C66/43 ,  B29C66/45 ,  B29C66/721 ,  B29C66/723 ,  B29C66/72321 ,  B29C66/73754 ,  B29C66/7392 ,  B29C66/73921 ,  B29C66/7394 ,  B29C66/73941 ,  B29C66/81422 ,  B29C66/8242 ,  B29C66/8322 ,  B29C66/836 ,  B29C66/91216 ,  B29C66/91221 ,  B29C66/91411 ,  B29C66/91443 ,  B29C66/919 ,  B29C66/9192 ,  B29C66/91951 ,  B29C66/92211 ,  B29C66/9241 ,  B29C66/929 ,  B29C66/934 ,  B29C66/93431 ,  B29C66/939 ,  B29C66/949 ,  B29C66/9516 ,  B29C66/9517 ,  B29C66/954 ,  B29C66/9592 ,  B29C66/961 ,  B29C66/962 ,  B29C66/965 ,  B29C66/966 ,  B29K2101/10 ,  B29K2101/12 ,  B29K2105/06 ,  B29L2009/00

摘要： A method for ultrasonic debulking a composite laminate includes the steps of defining a path across the laminate, the path having a starting location and an ending location and applying a force to and transmitting ultrasonic vibration into the laminate along the path, beginning at the starting location and ending at the ending location. The method further includes determining a temperature of a surface of the laminate proximate to the path and varying at least one of an amplitude of the ultrasonic vibration, the applied force, a feed rate at which the force and the ultrasonic vibration are applied along the path, an angle at which the ultrasonic vibration is applied to the laminate, and an interval at which plies of the laminate are processed, based upon the determined temperature of the surface of the laminate.

摘要翻译： 一种用于复合层压板的超声降解的方法包括以下步骤：限定穿过层压体的路径，该路径具有起始位置和终止位置，并且沿着该路径向起始位置开始施加力并将超声振动传递到层压板中 并结束于结束位置。 所述方法还包括确定靠近路径的层压体的表面的温度，并且改变超声波振动的振幅，所施加的力，施加力和超声波振动的进给速率中的至少一个沿路径 基于所确定的层压体表面的温度，对层叠体施加超声波振动的角度以及层压体的层的处理间隔。

公开(公告)号：US20080314498A1

公开(公告)日：2008-12-25

申请号：US11663752

申请日：2005-10-11

申请人： Edward W. Lee ,  Avraham Benatar ,  David Grewell

发明人： Edward W. Lee ,  Avraham Benatar ,  David Grewell

IPC分类号： B29C65/08

CPC分类号： B29C65/081 ,  B23K20/10 ,  B29C65/08 ,  B29C66/1122 ,  B29C66/342 ,  B29C66/41 ,  B29C66/43 ,  B29C66/45 ,  B29C66/721 ,  B29C66/723 ,  B29C66/72321 ,  B29C66/73754 ,  B29C66/7392 ,  B29C66/73921 ,  B29C66/7394 ,  B29C66/73941 ,  B29C66/81422 ,  B29C66/8242 ,  B29C66/8322 ,  B29C66/836 ,  B29C66/91216 ,  B29C66/91221 ,  B29C66/91411 ,  B29C66/91443 ,  B29C66/919 ,  B29C66/9192 ,  B29C66/91951 ,  B29C66/92211 ,  B29C66/9241 ,  B29C66/929 ,  B29C66/934 ,  B29C66/93431 ,  B29C66/939 ,  B29C66/949 ,  B29C66/9516 ,  B29C66/9517 ,  B29C66/954 ,  B29C66/9592 ,  B29C66/961 ,  B29C66/962 ,  B29C66/965 ,  B29C66/966 ,  B29K2101/10 ,  B29K2101/12 ,  B29K2105/06 ,  B29L2009/00

摘要： A method for ultrasonic debulking a composite laminate (105) includes the steps of defining a path (115) across the laminate, the path having a starting location and an ending location and applying a force (109) to and transmitting ultrasonic vibration (111) into the laminate along the path, beginning at the starting location and ending at the ending location. The method further includes determining a temperature of a surface (103, 123) of the laminate proximate to the path and varying at least one of an amplitude of the ultrasonic vibration, the applied force, a feed rate at which the force and the ultrasonic vibration are applied along the path, an angle at which the ultrasonic vibration is applied to the laminate, and an interval at which plies of the laminate are processed, based upon the determined temperature of the surface of the laminate.

摘要翻译： 一种用于复合层压板（105）的超声降解方法包括以下步骤：跨越层叠体限定路径（115），该路径具有起始位置和终止位置，并向其施加力（109）并传递超声波振动（111） 沿着路径进入层压板，从起始位置开始并在结束位置结束。 该方法还包括确定接近该路径的层压板的表面（103,123）的温度，并且改变超声波振动的幅度，所施加的力，力和超声波振动的进给速率中的至少一个 基于层压体的表面的确定的温度沿着路径施加超声波振动施加到层压体的角度以及层压体的层的处理间隔。

公开(公告)号：US07104807B1

公开(公告)日：2006-09-12

申请号：US10888105

申请日：2004-07-09

申请人： Kuang-Yu Wang ,  Ren-Kang Chiou ,  Edward W. Lee

发明人： Kuang-Yu Wang ,  Ren-Kang Chiou ,  Edward W. Lee

IPC分类号： H01R12/00 ,  H05K5/14

CPC分类号： H01R12/57 ,  H01R12/714 ,  H01R12/721 ,  H01R12/87

摘要： A plug for coupling with an industry-standard EXPRESSCARD™ receptacle is described. The plug includes a plurality of plug-side metal contacts disposed on a bottom substrate. The plurality of plug-side metal contacts is configured to electrically couple with receptacle-side metal contacts in the industry-standard EXPRESSCARD™ receptacle. When the plug is disconnected from the industry-standard EXPRESSCARD™ receptacle, the surfaces of the plurality plug-side metal contacts are exposed by not being covered by a top housing.

摘要翻译： 描述了用于与行业标准EXPRESSCARD（TM）插座连接的插头。 插头包括设置在底部基板上的多个插头侧金属触点。 多个插塞侧金属触点被配置为与工业标准EXPRESSCARD TM插座中的插座侧金属触点电耦合。 当插头与行业标准的EXPRESSCARD TM插座断开连接时，多个插头侧金属触头的表面不被顶部外壳覆盖。

公开(公告)号：US07004794B2

公开(公告)日：2006-02-28

申请号：US10917672

申请日：2004-08-13

申请人： Kuang-Yu Wang ,  Jim Ni ,  Ren-Kang Chiou ,  Edward W. Lee ,  Tzu-Yih Chu

发明人： Kuang-Yu Wang ,  Jim Ni ,  Ren-Kang Chiou ,  Edward W. Lee ,  Tzu-Yih Chu

IPC分类号： H01R33/00

CPC分类号： G06K19/07732 ,  G06K19/07733 ,  H01R24/62

摘要： A low-profile Universal-Serial-Bus (USB) connector includes a substantially flat base structure that is received in the lower section of a conventional female USB connector, and includes metal contacts formed on an upper surface of the base structure. Wobble or vertical play is reduced by rails extending along side edges of the base structure that are partially inserted into gaps formed between the metal case and base structure of the female USB connector. Between metal contacts on the low-profile USB connector are raised ribs (dividers) that prevent undesirable damage or contamination to the metal contacts. The connector base structure of the low-profile USB connector can be separate or can be integrated with a circuit board that holds a flash memory chip and a USB controller chip.

摘要翻译： 一种低调的通用串行总线（USB）连接器包括基本上平坦的基座结构，其被接收在传统的母USB连接器的下部，并且包括形成在基座结构的上表面上的金属触点。 摇摆或垂直播放通过沿底座结构的侧边缘延伸的轨道减少，该轨道部分地插入形成在母壳式USB连接器的金属外壳和基座结构之间的间隙中。 在薄型USB连接器上的金属触点之间是凸肋（分隔线），可防止不必要的金属触点损坏或污染。 低调USB连接器的连接器基座结构可以是独立的，也可以与保存闪存芯片和USB控制器芯片的电路板集成。