公开(公告)号：US20200381359A1

公开(公告)日：2020-12-03

申请号：US16430365

申请日：2019-06-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun-Jun ZHUANG ,  Hsu-Nan FANG

IPC: H01L23/528 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L25/065

Abstract: A semiconductor package includes a redistribution layer (RDL) structure, a first die, a molding compound and an interconnect structure. The first die is disposed on the RDL structure. The molding compound is disposed on the RDL structure. The interconnect structure electrically connects the first die to the RDL structure.

公开(公告)号：US20200185286A1

公开(公告)日：2020-06-11

申请号：US16215372

申请日：2018-12-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsu-Nan FANG

IPC: H01L23/053 ,  H01L23/31 ,  H01L23/42 ,  H01L21/52 ,  H01L21/56

Abstract: A semiconductor package device includes a substrate, an electronic component, a ring frame, an encapsulant, a thermal conducting material and a lid. The electronic component is disposed on the substrate. The ring frame is disposed on the substrate and surrounds the electronic component. The encapsulant encapsulates the electronic component and a first portion of the ring frame. The encapsulant exposes a second portion of the ring frame. The encapsulant and the second portion of the ring frame define a space. The thermal conducting material is disposed in the space. The lid is disposed on the thermal conducting material and connects with the second portion of the ring frame.