公开(公告)号：US20180086662A1

公开(公告)日：2018-03-29

申请号：US15712746

申请日：2017-09-22

Applicant: Apple Inc.

Inventor： Victor Luzzato ,  Jeffrey C. Mylvaganam ,  Christopher C. Bartlow

IPC: C03C15/00 ,  C03C21/00 ,  C03C19/00 ,  C03B25/02

CPC classification number: C03C15/00 ,  C03B25/025 ,  C03C19/00 ,  C03C21/002 ,  C03C2218/34

Abstract: A method of processing a glass substrate including texturing the glass substrate to form a textured surface that includes a plurality of micro fractures extending from the textured surface into the substrate. And, thereafter, chemically etching the textured surface of the glass substrate to a depth sufficient to remove the micro fractures. The glass substrate can then be chemically strengthened after the etching step.

公开(公告)号：US20170089818A1

公开(公告)日：2017-03-30

申请号：US15280514

申请日：2016-09-29

Applicant: Apple Inc.

Inventor： Christopher C. Bartlow ,  Dale N. Memering

IPC: G01N3/20

CPC classification number: G01N3/20

Abstract: Methods and a system for proof testing brittle components of electronic devices are disclosed. The method may include positioning the brittle component relative to a probe of a testing system, contacting the probe to a surface of the brittle component at a first location, and applying a first force at the first location using the probe to create a first localized tensile band below the surface of the brittle component. The method may also include contacting the probe to the surface of the brittle component at a second location, distinct from the first location, and applying a second force at the second location using the probe to create a second localized tensile band below the surface of the brittle component.