公开(公告)号：US20200185253A1

公开(公告)日：2020-06-11

申请号：US16704369

申请日：2019-12-05

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/683 ,  H01L23/544 ,  H01L21/78 ,  H01L21/268 ,  C09J7/35 ,  C09J5/06 ,  C09J7/10

Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyester sheet in each region of the polyester sheet corresponding to each device chip, pushing up each device chip from the polyester sheet side to pick up each device chip from the polyester sheet.

公开(公告)号：US20200043789A1

公开(公告)日：2020-02-06

申请号：US16531278

申请日：2019-08-05

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  B23K26/364 ,  B23K26/40 ,  H01L21/304 ,  H01L21/683 ,  C09J7/25

Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of cooling the polyester sheet, pushing up each device chip through the polyester sheet, and then picking up each device chip from the polyester sheet.

公开(公告)号：US20200043772A1

公开(公告)日：2020-02-06

申请号：US16531341

申请日：2019-08-05

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/683 ,  H01L21/78

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of cooling the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and then picking up each device chip from the polyolefin sheet.