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100 条记录 (耗时 0.024 秒)

    HEAT DISSIPATION DEVICE HAVING A VENTILATING DUCT
    31.
    发明申请
    HEAT DISSIPATION DEVICE HAVING A VENTILATING DUCT 失效
    具有通风管道的散热装置

    公开(公告)号：US20070153476A1

    公开(公告)日：2007-07-05

    申请号：US11306449

    申请日：2005-12-29

    申请人： Bo-Yong Yang ,  Shih-Hsun Wung ,  Chun-Chi Chen

    发明人： Bo-Yong Yang ,  Shih-Hsun Wung ,  Chun-Chi Chen

    IPC分类号： H05K7/20

    CPC分类号： H01L23/467 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipation device includes a heat sink (20) having a plurality of fins (26), a fan duct (50), a fan (70) and a mounting bracket (60) for mounting the fan duct and the fan to the heat sink. The fan duct is mounted to a front side of the heat sink, and includes an inlet, an enlarged outlet covering the front side of the heat sink and at least two channels (56). The fan duct is capable of expanding an airflow generated by the fan by the enlarged outlet and dividing the airflow by the at least two channels into at least two sub-airflows. Thus, the fan can blow the airflow through all of the fins to thereby promote a heat dissipating efficiency of the heat dissipation device.

    摘要翻译： 散热装置包括具有多个散热片（26）的散热片（20），风扇导管（50），风扇（70）和安装支架（60），用于将风扇导管和风扇安装在热 水槽。 风扇管道安装在散热器的前侧，并且包括入口，覆盖散热器前侧的扩大出口和至少两个通道（56）。 风扇导管能够通过扩大的出口扩大由风扇产生的气流，并将气流除以至少两个通道至少两个副气流。 因此，风扇可以吹动通过所有散热片的气流，从而提高散热装置的散热效率。

    COMPUTER SYSTEM WITH COOLING DEVICE FOR CPU
    32.
    发明申请
    COMPUTER SYSTEM WITH COOLING DEVICE FOR CPU 失效
    具有CPU冷却装置的计算机系统

    公开(公告)号：US20070121296A1

    公开(公告)日：2007-05-31

    申请号：US11164534

    申请日：2005-11-29

    申请人： Shih-Hsun Wung ,  Chun-Chi Chen ,  Bao-Chun Chen

    发明人： Shih-Hsun Wung ,  Chun-Chi Chen ,  Bao-Chun Chen

    IPC分类号： H05K7/20

    CPC分类号： G06F1/20 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A computer system includes a casing, a motherboard, a CPU mounted on the motherboard and a cooling device. The casing includes a pair of parallel panels. Air inlets and air outlets are respectively defined in the parallel panels and oriented toward each other. The motherboard is parallelly positioned between the parallel panels. The cooling device has a base portion contacting the CPU, a heat dissipation portion defining a plurality of channels communicating with the air outlets, at least one heat pipe thermally connecting the heat dissipation portion to the base portion, and a fan communicating with the air inlets and the channels.

    摘要翻译： 计算机系统包括壳体，母板，安装在母板上的CPU和冷却装置。 壳体包括一对平行板。 空气入口和出气口分别定义在平行面板中并相互朝向。 主板平行地位于平行板之间。 冷却装置具有接触CPU的基部，限定与空气出口连通的多个通道的散热部，至少一个将散热部热连接到基部的热管，以及与空气入口连通的风扇 和频道。

    Heat dissipation device having a ventilating duct
    33.
    发明授权
    Heat dissipation device having a ventilating duct 失效
    散热装置具有通风管道

    公开(公告)号：US07251136B2

    公开(公告)日：2007-07-31

    申请号：US11306449

    申请日：2005-12-29

    申请人： Bo-Yong Yang ,  Shih-Hsun Wung ,  Chun-Chi Chen

    发明人： Bo-Yong Yang ,  Shih-Hsun Wung ,  Chun-Chi Chen

    IPC分类号： H05K7/20

    CPC分类号： H01L23/467 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipation device includes a heat sink (20) having a plurality of fins (26), a fan duct (50), a fan (70) and a mounting bracket (60) for mounting the fan duct and the fan to the heat sink. The fan duct is mounted to a front side of the heat sink, and includes an inlet, an enlarged outlet covering the front side of the heat sink and at least two channels (56). The fan duct is capable of expanding an airflow generated by the fan by the enlarged outlet and dividing the airflow by the at least two channels into at least two sub-airflows. Thus, the fan can blow the airflow through all of the fins to thereby promote a heat dissipating efficiency of the heat dissipation device.

    摘要翻译： 散热装置包括具有多个散热片（26）的散热片（20），风扇导管（50），风扇（70）和安装支架（60），用于将风扇导管和风扇安装在热 水槽。 风扇管道安装在散热器的前侧，并且包括入口，覆盖散热器前侧的扩大出口和至少两个通道（56）。 风扇导管能够通过扩大的出口扩大由风扇产生的气流，并将气流除以至少两个通道至少两个副气流。 因此，风扇可以吹动通过所有散热片的气流，从而提高散热装置的散热效率。

    Computer system with cooling device for CPU
    34.
    发明授权
    Computer system with cooling device for CPU 失效
    具有CPU冷却装置的计算机系统

    公开(公告)号：US07286357B2

    公开(公告)日：2007-10-23

    申请号：US11164534

    申请日：2005-11-29

    申请人： Shih-Hsun Wung ,  Chun-Chi Chen ,  Bao-Chun Chen

    发明人： Shih-Hsun Wung ,  Chun-Chi Chen ,  Bao-Chun Chen

    IPC分类号： H05K7/20

    CPC分类号： G06F1/20 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A computer system includes a casing, a motherboard, a CPU mounted on the motherboard and a cooling device. The casing includes a pair of parallel panels. Air inlets and air outlets are respectively defined in the parallel panels and oriented toward each other. The motherboard is parallelly positioned between the parallel panels. The cooling device has a base portion contacting the CPU, a heat dissipation portion defining a plurality of channels communicating with the air outlets, at least one heat pipe thermally connecting the heat dissipation portion to the base portion, and a fan communicating with the air inlets and the channels.

    摘要翻译： 计算机系统包括壳体，母板，安装在母板上的CPU和冷却装置。 壳体包括一对平行板。 空气入口和出气口分别定义在平行面板上并相互朝向。 主板平行地位于平行板之间。 冷却装置具有接触CPU的基部，限定与空气出口连通的多个通道的散热部，至少一个将散热部热连接到基部的热管，以及与空气入口连通的风扇 和频道。

    LED lamp
    37.
    发明授权
    LED lamp 失效
    点灯

    公开(公告)号：US08052298B2

    公开(公告)日：2011-11-08

    申请号：US12329609

    申请日：2008-12-07

    申请人： Shih-Hsun Wung ,  Yong-Dong Chen ,  Wen Xu ,  Ye-Ke Xie

    发明人： Shih-Hsun Wung ,  Yong-Dong Chen ,  Wen Xu ,  Ye-Ke Xie

    IPC分类号： F21S4/00

    CPC分类号： F21V29/20 ,  F21K9/00 ,  F21S2/005 ,  F21V15/01 ,  F21V19/003 ,  F21V29/74 ,  F21V29/763 ,  F21Y2103/10 ,  F21Y2115/10

    摘要： An LED lamp includes a housing, a heat sink received in the housing, a plurality of LED modules thermally attached to the heat sink and a plurality of wire clips spanning over the heat sink and securing the heat sink on the housing. The heat sink includes a base and a plurality of fins extending from the base. Each of the clips includes a pivoting portion pivotally mounted on the housing, two locking portions located opposite to the pivoting portion and detachably engaging with the housing, and two pressing portions respectively interconnecting the pivoting portion with the two locking portions and abutting against the base.

    摘要翻译： LED灯包括壳体，容纳在壳体中的散热器，多个LED模块，其热连接到散热器，以及多个线夹跨过散热器并将散热器固定在壳体上。 散热器包括基部和从基部延伸的多个翅片。 每个夹子包括枢转地安装在壳体上的枢转部分，与枢转部分相对并且可拆卸地与壳体接合的两个锁定部分，以及两个分别将枢转部分与两个锁定部分相互连接并抵靠基部的按压部分。

    LED lamp assembly
    38.
    发明授权
    LED lamp assembly 失效
    LED灯组件

    公开(公告)号：US07810957B2

    公开(公告)日：2010-10-12

    申请号：US12054341

    申请日：2008-03-24

    申请人： Jun-Hua Zeng ,  Yong-Dong Chen ,  Shih-Hsun Wung

    发明人： Jun-Hua Zeng ,  Yong-Dong Chen ,  Shih-Hsun Wung

    IPC分类号： F21V29/00

    CPC分类号： F21V29/004 ,  F21S8/088 ,  F21V21/30 ,  F21V29/773 ,  F21Y2105/10 ,  F21Y2115/10

    摘要： An LED lamp assembly includes an LED lamp and a supporting member supporting the LED lamp. The LED lamp includes a plurality of LED modules and a heat sink supporting and cooling the LED modules. The supporting member includes a pair of supporting arms supporting the LED lamp and pivotably engaging with the heat sink of the LED lamp. The heat sink is rotatable relative to the supporting arms of the supporting member to vary an illumination angle of the LED lamp assembly.

    摘要翻译： LED灯组件包括LED灯和支撑LED灯的支撑件。 LED灯包括多个LED模块和支持并冷却LED模块的散热器。 支撑构件包括支撑LED灯并与LED灯的散热器可枢转地接合的一对支撑臂。 散热器可相对于支撑构件的支撑臂旋转，以改变LED灯组件的照明角度。