Fluidic die with nozzle layer electrode for fluid control

    公开(公告)号:US11541658B2

    公开(公告)日:2023-01-03

    申请号:US17251982

    申请日:2019-01-31

    Abstract: One example provides a fluidic die including a semiconductor substrate, and a nozzle layer disposed on the substrate, the nozzle layer having a top surface opposite the substrate and including a nozzle formed therein, the nozzle including a fluid chamber disposed below the top surface and a nozzle orifice extending through the nozzle layer from the top surface to the fluid chamber, the fluid chamber to hold fluid, and the nozzle to eject fluid drops from the fluid chamber via the nozzle orifice. An electrode is disposed in contact with the nozzle layer about a perimeter of the nozzle orifice, the electrode to carry an electrical charge to adjust movement of electrically charged components of the fluid.

    Fluid ejection with micropumps and pressure-difference based fluid flow

    公开(公告)号:US11376862B2

    公开(公告)日:2022-07-05

    申请号:US16603570

    申请日:2018-07-23

    Abstract: The fluid ejection device includes a plurality of nozzles and a plurality of ejection chambers that includes a respective ejection chamber fluidically coupled to a respective nozzle. A plurality of inlet passages are fluidically coupled to the ejection chambers and input fluid to the ejection chambers at a first pressure. A plurality of outlet passages are fluidically coupled to the ejection chambers and output fluid from the ejection chambers at a second pressure that is less than the first pressure. Fluid circulates through the ejection chambers based on the pressure difference between the first and second pressure. The fluid ejection device also includes at least one micropump fluidically coupled to at least one ejection chamber to pump fluid through the at least one ejection chamber.

    Fluidic die with low voltage monitoring circuit including high voltage tolerant transistor

    公开(公告)号:US11325370B2

    公开(公告)日:2022-05-10

    申请号:US16978223

    申请日:2018-05-15

    Abstract: A fluidic die including fluid chambers, each including an electrode exposed to an interior of the fluid chamber and each having a corresponding fluid actuator operating at a first voltage level. Monitoring circuitry, operating at a second voltage level lower than the first voltage level, includes a select transistor and a pulldown transistor for each fluid chamber to selectively couple to the electrode, at least the select transistor being a high voltage tolerant transistor to operate at the second voltage in a normal operating condition and having a breakdown voltage level greater than the first voltage level to prevent a fault current from flowing into the select transistor from the electrode in a fault condition if the fluid actuator short-circuits to the electrode.

    Fluid ejection device circuit
    37.
    发明授权

    公开(公告)号:US10960661B2

    公开(公告)日:2021-03-30

    申请号:US16400071

    申请日:2019-05-01

    Abstract: In some examples, a circuit for a fluid ejection device includes an energy delivery device and a circuit layer. The circuit layer includes first and second activation devices connected to the energy delivery device, the first and second activation devices to activate the energy delivery device, first drive logic coupled to the first activation device, and second drive logic coupled to the second activation device. An interconnect layer couples a same address selection signal to the first drive logic and the second drive logic.

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