Abstract:
A heat dissipation structure of an intelligent power module includes a chassis base, a drive circuit board arranged on the chassis base, an intelligent power module arranged at a side of the drive circuit board, the intelligent power module comprising a plurality of circuit devices, a first heat dissipater having one surface contacting a surface of the intelligent power module, the first heat dissipater being adapted to dissipate heat generated by operation of the plurality of circuit devices, and a second heat dissipater having one side arranged in contact with another surface of the first heat dissipater and another side arranged to contact a surface of the chassis base.
Abstract:
A plasma display apparatus includes a Plasma Display Panel (PDP), a chassis base, a driver IC package, and cover plates. The chassis base has one side to which the PDP is attached and another side on which a Printed circuit Board Assembly (PBA) is mounted. The driver IC package is electrically connected to electrodes of the PDP and the PBA and has driver ICs for selectively supplying a voltage to the electrodes of the PDP mounted therein in response to a control signal of the PBA. The cover plates are disposed outside of the driver IC package, and they compress and fix the driver IC package to the chassis base. The cover plates have receiving holes for receiving the driver ICs of the driver IC package.
Abstract:
A heat dissipating structure of an integrated circuit chip of a plasma display module and a plasma display module including the same are disclosed. In one embodiment, the heat dissipating structure includes: a chassis including a chassis base and a chassis bending portion in which at least one protruding portion is formed and the integrated circuit chip which is mounted on the cassis bending portion and connected to a signal transmitting member. According to one embodiment of the present invention, since the protruding portion is formed in the chassis bending portion on which the integrated circuit chip is formed, the convective heat transfer efficiency is increased and the heat dissipating performance of the integrated circuit chip is improved
Abstract:
A display module having an improved heatsink effect may include a display panel reproducing an image, a chassis supporting the display panel, a driving circuit board disposed on a surface of the chassis opposite to the display panel to generate an electrical signal for driving the display panel, the driving circuit board including at least one heat emissive circuit element, a first heatsink disposed on the heat emissive circuit element and a second heatsink disposed on the chassis. The first heatsink and the second heatsink may be thermally connected by a foldable connecting member.
Abstract:
A plasma display module includes a plasma display panel for displaying a visible image, a chassis supporting the plasma display panel and having at least one hole therein, and at least one heat dissipating fan disposed to face the at least one hole.
Abstract:
A plasma display device for efficiently dissipating heat from a driver IC packaged in a form of a tape carrier package. The device includes a plasma display panel, a printed circuit board assembly, a chassis base having one surface attached to the plasma display panel and another surface adapted to mount the printed circuit board assembly thereon, a TCP (tape carrier package) adapted to electrically connect the printed circuit board assembly to an electrode leading out from the plasma display panel, a driver IC (integrated circuit) arranged on the TCP, the driver IC being adapted to generate and selectively apply a pulse to the electrode leading out from the plasma display panel, a chassis bed arranged at an edge of the chassis base, the chassis bed being adapted to support one side of the driver IC on the TCP, a cover plate adapted to cover another side of the driver IC on the TCP, the cover plate being further adapted to be opposingly arranged at the chassis bed and a heat sink arranged at an outer surface of the cover plate and arranged lengthwise with the cover plate, the heat sink comprising vertical and horizontal air passages.
Abstract:
A plasma display device includes a plasma display panel and a chassis base for supporting the plasma display panel, the chassis base having an edge. A printed circuit board assembly is on the chassis base, a flexible printed circuit electrically connects electrodes of the plasma display panel to the printed circuit board assembly and a driver integrated circuit is on the flexible printed circuit. A cover plate covers the flexible printed circuit and the driver integrated circuit and is mounted on the chassis base and a connector combines the edge of the chassis base to the cover plate to prevent relative movement between the chassis base and the cover plate.
Abstract:
A plasma display apparatus including: a plasma display panel; a non-conductive chassis disposed on a rear portion of the plasma display panel to support the plasma display panel; a circuit unit disposed on a rear portion of the chassis to drive the plasma display panel; and a conductive member disposed between the plasma display panel and the chassis, having at least a part that is slit and protruded toward the chassis. In addition, the circuit unit includes a grounding portion having a grounding voltage and the grounding portion is electrically connected to the protruding portion of the conductive member.
Abstract:
A plasma display device for efficiently dissipating heat from a driver IC packaged in a form of a tape carrier package. The device includes a plasma display panel, a printed circuit board assembly, a chassis base having one surface attached to the plasma display panel and another surface adapted to mount the printed circuit board assembly thereon, a TCP (tape carrier package) adapted to electrically connect the printed circuit board assembly to an electrode leading out from the plasma display panel, a driver IC (integrated circuit) arranged on the TCP, the driver IC being adapted to generate and selectively apply a pulse to the electrode leading out from the plasma display panel, a chassis bed arranged at an edge of the chassis base, the chassis bed being adapted to support one side of the driver IC on the TCP, a cover plate adapted to cover another side of the driver IC on the TCP, the cover plate being further adapted to be opposingly arranged at the chassis bed and a heat sink arranged at an outer surface of the cover plate and arranged lengthwise with the cover plate, the heat sink comprising vertical and horizontal air passages.
Abstract:
A heat dissipating structure for an IC chip of a plasma display module, and a plasma display module having the same with improved heat dissipating performance of the IC chip while preventing the spread of foreign matter emanating from the heat-dissipating sheet. The structure includes a chassis including a chassis bending part and a chassis base, the IC chip contacting the chassis bending part and connected to a signal transmitting member, a cover plate arranged on the chassis bending part and facing the IC chip, a chip heat-dissipating sheet arranged between the IC chip and the cover plate, the chip-heat dissipating sheet made out of graphite and a thermally conductive member also arranged between the IC chip and the cover plate, the thermally conductive member adapted to contact and cover the chip heat-dissipating sheet.