公开(公告)号：US12127328B2

公开(公告)日：2024-10-22

申请号：US17747810

申请日：2022-05-18

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Yang Liu ,  Feng Liu ,  Biao Hu ,  Yuxiu Liu

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18 ,  H05K5/02

CPC classification number: H05K1/0203 ,  H05K1/181 ,  H05K5/0247 ,  H05K7/20145 ,  H05K7/2039 ,  H05K7/20445

Abstract: This application relates to the field of electronic device technologies, and provides an electronic component with an enclosure frame, a circuit board with an electronic component, and an electronic device, to effectively protect the circuit board from being corroded, thereby prolonging a service life of the electronic device. This application is applied to a charging pile for charging a new energy electric vehicle. An electronic component with an enclosure frame includes an enclosure frame and an electronic component. The enclosure frame defines a cavity that is closed or that has one open end; when the electronic component with an enclosure frame is connected to a circuit board, the enclosure frame and the circuit board can define a cavity that is closed or that has one open end.

公开(公告)号：US12126147B2

公开(公告)日：2024-10-22

申请号：US17867398

申请日：2022-07-18

Applicant: Server Technology, Inc.

Inventor： Carrel W. Ewing ,  Andrew J. Cleveland ,  James P. Maskaly

IPC: G06F1/18 ,  H01R25/00 ,  H02B1/015 ,  H02B1/06 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K5/00 ,  H05K5/02 ,  H05K13/00

CPC classification number: H02B1/06 ,  G06F1/189 ,  H01R25/006 ,  H02B1/015 ,  H05K1/0262 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/144 ,  H05K5/0026 ,  H05K5/0247 ,  H05K13/00 ,  H05K2201/042 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49139

Abstract: Methods, systems, and apparatuses provide power from multiple input power sources to adjacent outputs efficiently and reliably. Aspects of the disclosure provide a power distribution unit (PDU) that includes a number of power outputs including first and second adjacent power outputs. The PDU includes a printed circuit board having a first conducting layer electrically interconnected to a first power input connection and the first power output, a second conducting layer that is at least partially above the first conducting layer and in facing relationship thereto. The second conducting layer is electrically insulated from the first conducting layer and electrically interconnected with a second power input connection and the second power output, the first and second power outputs thereby connected to different power inputs.

公开(公告)号：US20240334632A1

公开(公告)日：2024-10-03

申请号：US18741059

申请日：2024-06-12

Applicant: Huawei Technologies Co., Ltd.

Inventor： Weigang Xiao ,  Ziguo Ma ,  Kanghua Ou ,  Jun Yu

IPC: H05K5/02 ,  H05K5/00

CPC classification number: H05K5/0247 ,  H05K5/0069 ,  H05K5/0269

Abstract: An expansion card includes a circuit board, a connector component, and a plurality of cables. The connector component includes a first connector and a second connector that are disposed on the circuit board, where the first connector and the second connector are fastened together, and the first connector is configured to be connected to a plug-in card. One end of each of the plurality of cables is separately welded to terminals of the first connector and the second connector, and the other end of the cables is configured to be electrically connected to a first pairing connector and a second pairing connector of a mainboard.

公开(公告)号：US20240334631A1

公开(公告)日：2024-10-03

申请号：US18738605

申请日：2024-06-10

Applicant: Kioxia Corporation

Inventor： Akihisa FUJIMOTO ,  Atsushi KONDO ,  Noriya SAKAMOTO ,  Taku NISHIYAMA ,  Katsuyoshi WATANABE

IPC: H05K5/02 ,  G06F1/18 ,  G06F13/40 ,  G06F13/42 ,  G11C5/04

CPC classification number: H05K5/0247 ,  G06F1/187 ,  G06F13/4068 ,  G06F13/4221 ,  G11C5/04 ,  G06F2213/0026

Abstract: According to one embodiment, a semiconductor memory device includes a housing and terminals. The housing has a first end edge extending in a first direction and a second end edge opposite to the first end edge. The terminals include signal terminals and include first terminals, second terminals, and third terminals. The first terminals are arranged in the first direction at a position close to the first end edge. The second terminals are arranged in the first direction with intervals at a position closer to the first end edge than the second end edge. The first plurality of terminals are closer to the first end edge than the second plurality of terminals are. The third terminals are arranged in the first direction with intervals at a position closer to the second end edge than the first end edge.

公开(公告)号：US20240333168A1

公开(公告)日：2024-10-03

申请号：US18612636

申请日：2024-03-21

Applicant: STMicroelectronics International N.V.

Inventor： Dario SUTERA

IPC: H02M7/00 ,  H05K5/02

CPC classification number: H02M7/003 ,  H05K5/0247

Abstract: A power module includes an insulating body having a first main face and a second main face; a first contact plate and a second contact plate, respectively protruding through the first main face and through the second main face of the insulating body and accessible from the outside; a first power plate and a second power plate, at least partially embedded in the insulating body and facing each other. Power devices of a first group are accommodated on the first power plate and coupled to the first contact plate. Power devices of a second group are accommodated on the second power plate and coupled to the second contact plate. The first contact plate, the second contact plate, the first power plate and the second power plate, are stacked in a direction perpendicular to the first power plate and the second power plate.

公开(公告)号：US12103406B2

公开(公告)日：2024-10-01

申请号：US18161974

申请日：2023-01-31

Applicant: Delphi Technologies IP Limited

Inventor： Mark Wendell Gose ,  Seyed R. Zarabadi ,  David Paul Buehler ,  Kevin M. Gertiser

IPC: B60L50/51 ,  B60L3/00 ,  B60L15/00 ,  B60L15/08 ,  B60L50/40 ,  B60L50/60 ,  B60L50/64 ,  B60L53/20 ,  B60L53/22 ,  B60L53/62 ,  B60R16/02 ,  G01R15/20 ,  G06F1/08 ,  G06F13/40 ,  H01L21/48 ,  H01L23/00 ,  H01L23/15 ,  H01L23/367 ,  H01L23/373 ,  H01L23/40 ,  H01L23/467 ,  H01L23/473 ,  H01L23/495 ,  H01L23/538 ,  H01L25/00 ,  H01L25/07 ,  H01L29/66 ,  H02J7/00 ,  H02M1/00 ,  H02M1/08 ,  H02M1/084 ,  H02M1/088 ,  H02M1/12 ,  H02M1/32 ,  H02M1/42 ,  H02M1/44 ,  H02M3/335 ,  H02M7/00 ,  H02M7/537 ,  H02M7/5387 ,  H02M7/5395 ,  H02P27/06 ,  H02P27/08 ,  H02P29/024 ,  H02P29/68 ,  H05K1/14 ,  H05K1/18 ,  H05K5/02 ,  H05K7/20 ,  B60L15/20 ,  H03K19/20

CPC classification number: B60L50/60 ,  B60L3/003 ,  B60L15/007 ,  B60L15/08 ,  B60L50/40 ,  B60L50/51 ,  B60L50/64 ,  B60L53/20 ,  B60L53/22 ,  B60L53/62 ,  B60R16/02 ,  G01R15/20 ,  G06F1/08 ,  G06F13/4004 ,  H01L21/4882 ,  H01L23/15 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/467 ,  H01L23/473 ,  H01L23/49562 ,  H01L23/5383 ,  H01L24/32 ,  H01L24/33 ,  H01L25/072 ,  H01L25/50 ,  H01L29/66553 ,  H02J7/0063 ,  H02M1/0009 ,  H02M1/0054 ,  H02M1/08 ,  H02M1/084 ,  H02M1/088 ,  H02M1/123 ,  H02M1/32 ,  H02M1/322 ,  H02M1/327 ,  H02M1/4258 ,  H02M1/44 ,  H02M3/33523 ,  H02M7/003 ,  H02M7/537 ,  H02M7/5387 ,  H02M7/53871 ,  H02M7/53875 ,  H02M7/5395 ,  H02P27/06 ,  H02P27/08 ,  H02P27/085 ,  H02P29/024 ,  H02P29/027 ,  H02P29/68 ,  H05K1/145 ,  H05K1/181 ,  H05K1/182 ,  H05K5/0247 ,  H05K7/20154 ,  H05K7/2049 ,  H05K7/20854 ,  H05K7/209 ,  H05K7/20927 ,  B60L15/20 ,  B60L2210/30 ,  B60L2210/40 ,  B60L2210/42 ,  B60L2210/44 ,  B60L2240/36 ,  G06F2213/40 ,  H01L2023/405 ,  H01L2023/4087 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H02J2207/20 ,  H02P2207/05 ,  H03K19/20 ,  H05K2201/042 ,  H05K2201/10166

Abstract: A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a first power module including: a first connection; a second connection; a first power switch including a first gate terminal, the first power switch configured to control a first flow of current between the first connection and the second connection based on a first signal to the first gate terminal; and a first point-of-use controller configured to provide the first signal to the first gate terminal to control the first power switch.

公开(公告)号：US20240322656A1

公开(公告)日：2024-09-26

申请号：US18209322

申请日：2023-06-13

Applicant: MAHLE International GmbH

Inventor： Janko Cotar Mlakar

IPC: H02K11/26 ,  H05K5/02 ,  H05K5/03

CPC classification number: H02K11/26 ,  H05K5/0247 ,  H05K5/03

Abstract: A diode carrier arrangement for an electric machine is disclosed. The diode carrier arrangement includes diodes, a rail arrangement including metal rails, a metal plate, and an enclosure. The enclosure and a first metal rail delimit a first diode receptacle for receiving a diode, and the enclosure and the metal plate delimit a second diode receptacle for receiving a diode. The diodes are clamped in the respective diode receptacles via the enclosure onto the first metal rail and the metal plate.

公开(公告)号：US12089355B2

公开(公告)日：2024-09-10

申请号：US18329977

申请日：2023-06-06

Applicant: Steiner Enterprises

Inventor： Thomas P. Hicks ,  Donald E. DeWitt ,  Joshua E. DeWitt ,  Jonathan Brock ,  Bradd Giggy

IPC: H05K5/00 ,  B60R16/023 ,  H02G5/06 ,  H05K5/02

CPC classification number: H05K5/0247 ,  B60R16/0238 ,  H02G5/06

Abstract: A modular electrical distribution system for an RV comprises a water-tight housing for mounting to the RV with a plurality of water-tight openings for receiving electrical cables or wires from a towing vehicle and/or auxiliary electrical devices. The system includes a power-in assembly, a trailer connection assembly and a breaker assembly that can be tailored to the particular electrical distribution needs of the RV. The trailer connection assembly includes a plurality of electrical terminals for engagement to wires connected to electrical components of the towing vehicle, such as brake lights, turn signal lights, etc. The breaker assembly includes a plurality of circuit breakers or fuses connected to the power-in assembly and to a plurality of corresponding output bars with output terminals to connect to the cables/wires for the auxiliary electrical devices. The system can include an auxiliary circuit for connection to an auxiliary power source, such as a solar panel array.

公开(公告)号：US20240292556A1

公开(公告)日：2024-08-29

申请号：US18569272

申请日：2022-07-12

Applicant: VITESCO TECHNOLOGIES GMBH

Inventor： Bertrand PERILLAT ,  Pascal PERROT

IPC: H05K5/02

CPC classification number: H05K5/0247

Abstract: A protective housing fitted on board an automotive vehicle includes: a main housing space with a main cavity to receive a printed circuit, an upper opening for the insertion of the printed circuit into the main cavity, and at least one lateral groove, which includes two lateral slots each extending from an upper edge of the main housing space, and together forming a passage between the inside and outside of the main housing space; for each lateral groove, a respective retaining element, insertable into the lateral groove to locally close the passage between the inside and outside of the main housing space, so that in use, it comes to bear against a bundle of electrical wires emerging from the main cavity via the two lateral slots; and at each lateral groove, the two lateral slots each have a width substantially equal to the diameter of the electrical wires.

公开(公告)号：US12069813B2

公开(公告)日：2024-08-20

申请号：US17048856

申请日：2018-05-14

Applicant: Mitsubishi Electric Corporation

Inventor： Katsuhiko Omae ,  Takashi Nagao

IPC: H05K5/00 ,  B62D5/04 ,  H01R12/72 ,  H05K1/18 ,  H05K5/02 ,  H05K5/04 ,  H05K9/00

CPC classification number: H05K5/0069 ,  B62D5/0403 ,  H01R12/724 ,  H05K1/181 ,  H05K5/0247 ,  H05K5/04 ,  H05K9/0007 ,  H05K2201/1006

Abstract: The electronic device includes: a substrate having an electronic circuit formed therein; a housing for housing the substrate; and a connector disposed on the substrate and serving as an interface between outside and inside of the housing. The substrate has a main circuit pattern portion that forms a main circuit and a frame ground pattern portion that forms a frame ground. The main circuit pattern portion and the frame ground pattern portion are disposed so as not to overlap each other on the substrate and in the substrate. A terminal of the connector is disposed in the frame ground pattern portion.