公开(公告)号：US20210036059A1

公开(公告)日：2021-02-04

申请号：US17074848

申请日：2020-10-20

Applicant: Microchip Technology Incorporated

Inventor： Yaojian Leng ,  Justin Sato ,  Bomy Chen

IPC: H01L27/28

Abstract: An integrated circuit (IC) package product, e.g., system-on-chip (SoC) or system-in-package (SiP) product, may include at least one integrated inductor having a core magnetic field (B field) that extends parallel to the substrate major plane of at least one die or chiplet included in or mounted to the product, which may reduce the eddy currents within each die/chiplet substrate, and thereby reduce energy loss of the indictor. The IC package product may include a horizontally-extending IC package substrate, a horizontally-extending die mount base arranged on the IC package substrate, at least one die mounted to the die mount base in a vertical orientation, and an integrated inductor having a B field extending in a vertical direction parallel to the silicon substrate of each vertically-mounted die, thereby providing a reduced substrate loss in the integrated inductor, which provides an increased quality factor (Q) of the inductor.

公开(公告)号：US10818748B2

公开(公告)日：2020-10-27

申请号：US16034394

申请日：2018-07-13

Applicant: Microchip Technology Incorporated

Inventor： Yaojian Leng ,  Bonnie Hamlin ,  Andrew Taylor ,  Janet Vanderiet ,  Justin Sato

IPC: H01L49/02 ,  H01L21/285 ,  H01L21/311

Abstract: A method for manufacturing a thin film resistor (TFR) module includes forming a TFR element over a substrate; annealing the TFR element to reduce the temperature coefficient of resistance (TCR) of the TFR element; and after forming and annealing the TFR element, forming a pair of conductive TFR heads in contact with the TFR element. By forming the TFR element before the TFR heads, the TFR element may be annealed without affecting the TFR heads, and thus may be formed from various materials with different annealing properties, e.g., SiCCr and SiCr. Thus, the TFR element may be annealed to achieve a near 0 ppm TCR, without affecting the later-formed TFR heads. The TFR module may be formed using a damascene CMP approach and using only a single added mask layer. Further, vertically-extending “ridges” at edges of the TFR element may be removed or eliminated to further improve the TCR performance.