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    PHOTONIC INTEGRATED CIRCUIT PLATFORM AND OPTICAL PHASE ARRAY DEVICE USING THE SAME
    31.
    发明申请
    PHOTONIC INTEGRATED CIRCUIT PLATFORM AND OPTICAL PHASE ARRAY DEVICE USING THE SAME 有权

    公开(公告)号：US20210364695A1

    公开(公告)日：2021-11-25

    申请号：US17023631

    申请日：2020-09-17

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Dongjae SHIN ,  Dongsik SHIM ,  Eunkyung LEE ,  Changbum LEE ,  Bongyong JANG

    IPC: G02B6/12 ,  G02B6/136 ,  G02B6/125

    Abstract: A photonic integrated circuit platform includes a substrate, a first oxide layer disposed on the substrate and including an insulating transparent oxide, and a first optical element layer disposed on the first oxide layer and including a semiconductor material. The photonic integrated circuit platform further includes a second optical element layer disposed on the first optical element layer and including an insulating material different from the insulating transparent oxide of the first oxide layer, the second optical element layer further including a compound semiconductor material different from the semiconductor material of the first optical element layer, a second oxide layer disposed on the second optical element layer and including an insulating transparent oxide, and a plurality of optical elements formed by patterning the first optical element layer or the second optical element layer.

    THERMOELECTRIC DEVICE
    32.
    发明申请
    THERMOELECTRIC DEVICE 审中-公开
    热电装置

    公开(公告)号：US20160149106A1

    公开(公告)日：2016-05-26

    申请号：US14701121

    申请日：2015-04-30

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Wooram HONG ,  Eunkyung LEE ,  Byounglyong CHOI

    IPC: H01L35/30

    CPC classification number: H01L35/30

    Abstract: A thermoelectric device including a heat supplier, a thermoelectric element disposed on the heat supplier, and a heat exchanger disposed opposite to the heat supplier, where the thermoelectric element is disposed between the heat supplier and the heat exchanger. In the thermoelectric device, the heat exchanger include a medium adsorptive part defined on a surface thereof, and the medium adsorptive part is exposed outside to contact with a first medium of the air and has an adsorptive property for a second medium including a fluid and different from the first medium.

    Abstract translation: 包括热供应器，设置在供热器上的热电元件和与供热器相对设置的热交换器的热电装置，其中热电元件设置在供热器和热交换器之间。 在热电装置中，热交换器包括在其表面上限定的介质吸附部，介质吸附部暴露在外部与第一空气介质接触，并且对于包含流体和不同的第二介质具有吸附性 从第一媒体。

    WEARABLE DEVICE HAVING THERMOELECTRIC GENERATOR
    33.
    发明申请
    WEARABLE DEVICE HAVING THERMOELECTRIC GENERATOR 审中-公开
    具有热电发生器的耐磨装置

    公开(公告)号：US20160118566A1

    公开(公告)日：2016-04-28

    申请号：US14822554

    申请日：2015-08-10

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Eunkyung LEE ,  Byounglyong CHOI ,  Wooram HONG ,  Junghan KIM ,  Dohun CHA

    IPC: H01L35/30

    CPC classification number: H01L35/30

    Abstract: Provided are wearable devices including a thermoelectric generator. The wearable devices include a main body that has at least one opening and a thermoelectric generator that is seated in the opening. The devices include a pair of terminals that are electrically connected to an adjacent thermoelectric generator or a charge unit disposed on the main body, and a supporting member that is situated on a lower part of the thermoelectric generator and contacts the skin of a user, such that the thermoelectric generator includes a high temperature unit and a low temperature unit facing each other, and the high temperature unit is situated on the supporting member and the low temperature unit is disposed to face an outside environment.

    Abstract translation: 提供了包括热电发电机的可穿戴设备。 可穿戴装置包括具有至少一个开口的主体和位于开口中的热电发电机。 这些装置包括电连接到相邻的热电发电机或设置在主体上的充电单元的一对端子，以及位于热电发电机的下部并与使用者的皮肤接触的支撑构件， 热电发电机包括彼此相对的高温单元和低温单元，高温单元位于支撑构件上，并且低温单元设置成面向外部环境。

    PHOTONIC INTEGRATED CIRCUIT PLATFORM AND OPTICAL PHASE ARRAY DEVICE USING THE SAME
    39.
    发明公开
    PHOTONIC INTEGRATED CIRCUIT PLATFORM AND OPTICAL PHASE ARRAY DEVICE USING THE SAME 审中-公开

    公开(公告)号：US20240094461A1

    公开(公告)日：2024-03-21

    申请号：US18517599

    申请日：2023-11-22

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Dongjae SHIN ,  Dongsik SHIM ,  Eunkyung LEE ,  Changbum LEE ,  Bongyong JANG

    IPC: G02B6/12 ,  G02B6/125 ,  G02B6/136

    CPC classification number: G02B6/12004 ,  G02B6/12007 ,  G02B6/125 ,  G02B6/136 ,  G02B6/29301

    Abstract: A photonic integrated circuit platform includes a substrate, a first oxide layer disposed on the substrate and including an insulating transparent oxide, and a first optical element layer disposed on the first oxide layer and including a semiconductor material. The photonic integrated circuit platform further includes a second optical element layer disposed on the first optical element layer and including an insulating material different from the insulating transparent oxide of the first oxide layer, the second optical element layer further including a compound semiconductor material different from the semiconductor material of the first optical element layer, a second oxide layer disposed on the second optical element layer and including an insulating transparent oxide, and a plurality of optical elements formed by patterning the first optical element layer or the second optical element layer.

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