公开(公告)号：US11201202B2

公开(公告)日：2021-12-14

申请号：US16681290

申请日：2019-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunhye Kim ,  Doyoung Kwag ,  Sangmoo Park ,  Minsub Oh ,  Yoonsuk Lee

IPC: H01L27/32

Abstract: A display module and a large format display apparatus incorporating the display module are provided. The display module includes a thin film transistor substrate, light emitting diodes arranged on one surface of the thin film transistor substrate, and side wirings formed on each of a first edge of the thin film transistor substrate and a second edge of the thin film transistor substrate that is adjacent to the first edge, to electrically couple components on the one surface of the thin film transistor substrate with components on an opposite surface of the one surface respectively.

公开(公告)号：US11152245B2

公开(公告)日：2021-10-19

申请号：US16682111

申请日：2019-11-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangmoo Park ,  Doyoung Kwag ,  Eunhye Kim ,  Minsub Oh ,  Yoonsuk Lee

IPC: H01L21/683 ,  H01L21/67 ,  H01L33/62

Abstract: A micro LED transfer device is provided. The micro LED transfer device includes a transfer part configured to arrange a first substrate wherein a plurality of LEDs are disposed on a lower surface relative to an upper surface of a second substrate; a memory storing characteristic information of each of the plurality of LEDs; a laser light source configured to irradiate laser light; a mask comprising a plurality of shutters configured to selectively open and close a plurality of openings of the mask, the mask being interposed between the first substrate and the laser light source; and a processor configured to identify an LED from among the plurality of LEDs to be arranged on the second substrate based on the stored characteristic information, and control the mask such that a shutter from among the plurality of shutters that corresponds to the LED is opened.

公开(公告)号：US11063026B2

公开(公告)日：2021-07-13

申请号：US16808558

申请日：2020-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunhye Kim ,  Doyoung Kwag ,  Byungchul Kim ,  Sangmoo Park ,  Minsub Oh ,  Dongyeob Lee ,  Yoonsuk Lee

IPC: H01L25/075 ,  H01L33/62

Abstract: A method of manufacturing a display module is provided. The method may include providing a substrate including a pixel region on which a plurality of electrodes are disposed and a peripheral region that is a region other than the pixel region on the substrate; forming an adhesive layer on the pixel region of the substrate; transferring a plurality of micro light emitting diodes (LEDs) onto the adhesive layer; pre-curing the adhesive layer to shift the adhesive layer on the pixel region to the peripheral region; and bonding the plurality of micro LEDs to the plurality of electrodes.