Abstract:
A wireless device including a receiver circuit coupled to a radio frequency receiver node, a frequency selective attenuator including an inductor and a first capacitor coupled in series to the radio frequency receiver node, and a second capacitor coupled in parallel with the first capacitor. The first capacitor has a first capacitance based on a blocker frequency and the second capacitor has a second capacitance that linearizes the frequency selective attenuator. A method of linearizing a frequency selective attenuator including detecting presence of a blocker signal, activating and programming a capacitor of the frequency selective attenuator to reduce a strength of the blocker signal, determining a frequency difference between the blocker signal and a receive frequency, and coupling a second capacitor to the frequency selective attenuator to linearize the frequency selective attenuator when the frequency difference is no more than an attenuation threshold.
Abstract:
A crystal driver integrated circuit with external oscillation signal amplitude control including an amplifier core, an input pin and an output pin, an adjustable capacitor, and a controller. The controller operates the amplifier core in any one of multiple operating modes including an oscillator mode and a bypass mode. During the bypass mode, the controller disables the amplifier core and adjusts the adjustable capacitor so that an amplitude of an oscillation signal received via the input pin from an external oscillator has a target amplitude. The external oscillation signal may be capacitively coupled for capacitive voltage division or directly coupled for impedance attenuation. An available voltage may be provided as a source voltage to the external oscillator via the output pin. An internal voltage regulator and/or switch may be included to re-provision the output pin to provide the source voltage during the bypass mode.
Abstract:
In one form, a multi-chip module for a multi-mode receiver includes an MCM substrate and first and second demodulator die. The MCM substrate has first and second satellite input ports, first and second terrestrial/cable input ports, and first and second transport stream ports. The first demodulator die has a satellite port coupled to the first satellite input port of the MCM substrate, a terrestrial/cable port coupled to the first terrestrial/cable input port of the MCM substrate, and first and second transport stream ports coupled to the first and second transport stream ports of the MCM substrate. The second demodulator die has a satellite port coupled to the second satellite input port of the MCM substrate, a terrestrial/cable port coupled to the second terrestrial/cable input port of the MCM substrate, and first and second transport stream ports coupled to the first and second transport stream ports of the MCM substrate.
Abstract:
Die-to-die communication links for receiver integrated circuit dies within multi-die systems and related methods are disclosed for radio frequency (RF) receivers. The disclosed embodiments provide die-to-die communication links that allow for direct communication of operating parameters between receiver integrated circuit dies and other integrated circuit dies within a multi-die system so that the operation of receive path circuitry can be adjusted without requiring intervention from an external host processor integrated circuit. A variety of operating parameter information can be communicated through the die-to-die communication links so that the integrated circuit dies can quickly adjust to changing signal conditions without requiring intervention by the external host processor integrated circuit.