公开(公告)号：US20190334236A1

公开(公告)日：2019-10-31

申请号：US16504920

申请日：2019-07-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunjin KIM ,  Kwanghyun BAEK ,  Byungchul KIM ,  Jungmin PARK ,  Youngju LEE ,  Sungchul PARK

IPC: H01Q1/52 ,  H01Q21/24 ,  H01Q13/08 ,  H01Q1/24 ,  H01Q13/02

Abstract: An electronic device is provided that includes a circuit board received in the electronic device and in which at least one board is layered, a communication module disposed at one surface of the circuit board and electrically connected to the circuit board, an antenna electrically connected to the communication module, and a metal structure whose one surface is separated from the other surface of the circuit board to form a space within the electronic device by enclosing the circuit board and in which at least one aperture is formed at one side thereof.

公开(公告)号：US20180062256A1

公开(公告)日：2018-03-01

申请号：US15685363

申请日：2017-08-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunjin KIM ,  Kwanghyun BAEK ,  Byungchul KIM ,  Jungmin PARK ,  Youngju LEE ,  Sungchul PARK

IPC: H01Q1/52 ,  H01Q13/02 ,  H01Q1/24

CPC classification number: H01Q1/525 ,  H01P5/107 ,  H01Q1/243 ,  H01Q13/02 ,  H01Q13/085 ,  H01Q21/24

Abstract: An electronic device is provided that includes a circuit board received in the electronic device and in which at least one board is layered, a communication module disposed at one surface of the circuit board and electrically connected to the circuit board, an antenna electrically connected to the communication module, and a metal structure whose one surface is separated from the other surface of the circuit board to form a space within the electronic device by enclosing the circuit board and in which at least one aperture is formed at one side thereof.