-
公开(公告)号：US20200328500A1
公开(公告)日：2020-10-15
申请号：US16844706
申请日：2020-04-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwanghyun BAEK , Dohyuk HA , Youngju LEE , Jungyub LEE , Juneseok LEE , Jinsu HEO
Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module includes a first printed circuit board (PCB) stacked at least one layer, and a second PCB disposed on an upper surface of the first PCB and stacked at least one layer. The antenna module further includes a wireless communication chip disposed on an upper surface of the second PCB and controlling an electrical signal for a radio frequency, a first structure disposed on the upper surface of the first PCB and surrounding the upper surface of the first PCB, a first antenna disposed on an inner surface of the first structure to face the first PCB, and a feed line electrically connecting the first antenna and the wireless communication chip.
-
公开(公告)号：US20190252757A1
公开(公告)日：2019-08-15
申请号：US16319963
申请日：2017-08-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwanghyun BAEK , Hyunjin KIM , Byungchul KIM , Jungmin PARK , Youngju LEE , Jinsu HEO
CPC classification number: H01Q1/02 , H01Q1/243 , H01Q9/0457 , H01Q13/10 , H01Q21/0025 , H01Q21/064 , H01Q21/065 , H04B1/44 , H04M1/02
Abstract: The present invention relates to an antenna apparatus and an electronic device comprising the same. The antenna apparatus according to one embodiment of the present invention comprises an array antenna formed on a metal case of an electronic device, wherein the array antenna comprises at least two antenna elements, the at least two antenna elements may operate in the same frequency band. According to one embodiment of the present invention, it is possible to provide an antenna apparatus capable of reducing heat generation and increasing the radiation efficiency of an antenna.
-
公开(公告)号：US20250096486A1
公开(公告)日：2025-03-20
申请号：US18964144
申请日：2024-11-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sanghoon PARK , Jungho PARK , Kwanghyun BAEK , Youngju LEE , Jungyub LEE , Juneseok LEE , Dohyuk HA , Jinsu HEO
Abstract: An antenna assembly is provided. The antenna assembly includes a first flexible printed circuit board (FPCB) for multiple first antennas, a second flexible printed circuit board (FPCB) for multiple second antennas, a metal plate including multiple holes, a first adhesive material layer for bonding between the metal plate and the first FPCB, and a second adhesive material layer for bonding between the metal plate and the second FPCB, wherein the metal plate is disposed such that the multiple first antennas are located in the multiple holes, respectively and the multiple second antennas to be located in the multiple holes, respectively.
-
4.发明公开公开(公告)号：US20240006391A1
公开(公告)日：2024-01-04
申请号：US18467062
申请日：2023-09-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sangho LEE , Kihyun KIM , Sangyong PARK , Kwanghyun BAEK , Seungjae BAEK
IPC: H01L25/16 , H01L23/498 , H01L23/00 , H01L23/13 , H05K1/18
CPC classification number: H01L25/16 , H01L23/49833 , H01L24/16 , H01L23/13 , H01L23/49816 , H05K1/181 , H01L2224/16227 , H01L2924/19106 , H05K2201/10098 , H05K2201/10378 , H05K2201/10015 , H05K2201/10515 , H05K2201/10734 , H05K2201/10962 , H05K2201/10704
Abstract: A package device is provided. The package device includes a substrate, a plurality of upper lands disposed on one surface of the substrate, a plurality of upper solder balls disposed on the plurality of upper lands, a die connected to the plurality of upper solder balls, a plurality of lower lands disposed on the other surface of the substrate, a plurality of lower solder balls disposed on some of the plurality of lower lands, and a capacitor connected to the lower lands on which the plurality of lower solder balls are not disposed among the plurality of lower lands, provided on an opposite side of the die, and including a height greater than the height of the plurality of lower solder balls.
-
公开(公告)号：US20230132490A1
公开(公告)日：2023-05-04
申请号：US18147270
申请日：2022-12-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Juneseok LEE , Junsig KUM , Kwanghyun BAEK , Dohyuk HA , Jinsu HEO , Youngju LEE , Jungyub LEE
Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module is provided. The antenna module includes a flexible printed circuit board (FPCB) including a first surface directed in a first direction and a second surface directed in a second direction that forms a predetermined first angle with respect to the first direction, a first antenna deployed on one surface of the first surface, and a second antenna deployed on one surface of the second surface.
-
Patent Agency Ranking
公开(公告)号：US20190334236A1
公开(公告)日：2019-10-31
申请号：US16504920
申请日：2019-07-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunjin KIM , Kwanghyun BAEK , Byungchul KIM , Jungmin PARK , Youngju LEE , Sungchul PARK
Abstract: An electronic device is provided that includes a circuit board received in the electronic device and in which at least one board is layered, a communication module disposed at one surface of the circuit board and electrically connected to the circuit board, an antenna electrically connected to the communication module, and a metal structure whose one surface is separated from the other surface of the circuit board to form a space within the electronic device by enclosing the circuit board and in which at least one aperture is formed at one side thereof.
-
公开(公告)号：US20180062256A1
公开(公告)日：2018-03-01
申请号：US15685363
申请日：2017-08-24
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunjin KIM , Kwanghyun BAEK , Byungchul KIM , Jungmin PARK , Youngju LEE , Sungchul PARK
Abstract: An electronic device is provided that includes a circuit board received in the electronic device and in which at least one board is layered, a communication module disposed at one surface of the circuit board and electrically connected to the circuit board, an antenna electrically connected to the communication module, and a metal structure whose one surface is separated from the other surface of the circuit board to form a space within the electronic device by enclosing the circuit board and in which at least one aperture is formed at one side thereof.
-
公开(公告)号：US20230387598A1
公开(公告)日：2023-11-30
申请号：US18446906
申请日：2023-08-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngsub KIM , Sanghoon PARK , Jungho PARK , Kwanghyun BAEK , Youngju LEE , Jungyub LEE , Juneseok LEE , Dohyuk HA , Jinsu HEO
CPC classification number: H01Q9/0457 , H01Q9/0414 , H01Q21/065
Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a data transmission rate higher than that of a 4th generation (4G) communication system such as long term evolution (LTE). An antenna structure of a wireless communication system is provided. The antenna structure includes a first radiator, a first printed circuit board (PCB) in which the first radiator is arranged, a plurality of second radiators, a second PCB in which the plurality of second radiators are arranged, and a frame structure, wherein the frame structure is arranged such that an air layer is formed between the first PCB and the second PCB, and the plurality of second radiators can include a first metal patch arranged in a region corresponding to the first radiator, and a plurality of second metal patches arranged to be separated from the first metal patch so as to be fed by coupling.
-
公开(公告)号：US20230275361A1
公开(公告)日：2023-08-31
申请号：US18313727
申请日：2023-05-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwanghyun BAEK , Seungtae KO , Kijoon KIM , Juho SON , Sangho LEE , Youngju LEE , Jungyub LEE , Yonghun CHEON , Dohyuk HA
IPC: H01Q21/06 , H01Q1/24 , H01Q1/42 , H04B7/0413 , H05K1/18
CPC classification number: H01Q21/065 , H01Q1/246 , H01Q1/42 , H04B7/0413 , H05K1/181 , H05K9/0049
Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.
-
公开(公告)号：US20230187833A1
公开(公告)日：2023-06-15
申请号：US18164184
申请日：2023-02-03
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwanghyun BAEK , Youngsub KIM , Jinhoon KIM , Chunmyung PARK , Youngju LEE , Juneseok LEE , Wangi CHA , Dohyuk HA
Abstract: An electronic device is provided. The electronic device includes multiple antenna arrays, multiple first printed circuit board (PCB) sets corresponding to the multiple antenna arrays, a second PCB including a power interface, and a grid array configured to couple a first surface of each of first PCBs of the first PCB sets corresponding to an antenna array and a first surface of the second PCB, wherein the size of the first PCB is smaller than that of the second PCB, and a feeding line configured to transfer a signal to an antenna element is formed on at least one of a layer corresponding to the first surface of each of the first PCBs or a layer corresponding to the first surface of the second PCB.
-
-
-
-
-
-
-
-
-
Search Results
33
records
(took 0.019 seconds)
