ANTENNA MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME

    公开(公告)号:US20200328500A1

    公开(公告)日:2020-10-15

    申请号:US16844706

    申请日:2020-04-09

    摘要: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module includes a first printed circuit board (PCB) stacked at least one layer, and a second PCB disposed on an upper surface of the first PCB and stacked at least one layer. The antenna module further includes a wireless communication chip disposed on an upper surface of the second PCB and controlling an electrical signal for a radio frequency, a first structure disposed on the upper surface of the first PCB and surrounding the upper surface of the first PCB, a first antenna disposed on an inner surface of the first structure to face the first PCB, and a feed line electrically connecting the first antenna and the wireless communication chip.

    ANTENNA STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME

    公开(公告)号:US20230099560A1

    公开(公告)日:2023-03-30

    申请号:US17754893

    申请日:2020-10-14

    摘要: The present disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting higher data transmission rates than a 4th generation (4G) communication system such as long-term evolution (LTE). An antenna module in a wireless communication system includes: a printed circuit board (PCB); a radio frequency integrated circuit (RFIC); and a plurality of antenna elements for emitting a radio frequency (RF) signal, wherein the plurality of antenna elements may be disposed in a first area of a first surface of the PCB, and the RFIC may be disposed in a second area, different from the first area, of the first surface of the PCB.

    ANTENNA MODULE AND DEVICE INCLUDING SAME

    公开(公告)号:US20230019144A1

    公开(公告)日:2023-01-19

    申请号:US17946688

    申请日:2022-09-16

    IPC分类号: H01Q1/22 H01Q1/24 H01Q1/38

    摘要: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system for supporting higher data rates Beyond 4th-Generation (4G) communication system, such as long term evolution (LTE). An antenna device is provided. The antenna device includes a first printed circuit board (PCB), a second PCB for a plurality of antenna elements, and a radio frequency integrated circuit (RFIC) coupled through a first surface of the first PCB. The second PCB may include a radio frequency (RF) routing layer including RF lines for the respective plurality of antenna elements. The first PCB may include a feeding structure for connecting the RF routing layer and the RFIC. The second PCB may be electrically connected to a second surface of the first PCB opposite to the first surface of the first PCB, through a first surface of the second PCB. The second PCB may be coupled to the plurality of antenna elements.

    MODULE COMPRISING ANTENNA AND RF ELEMENT, AND BASE STATION INCLUDING SAME

    公开(公告)号:US20210344120A1

    公开(公告)日:2021-11-04

    申请号:US17373000

    申请日:2021-07-12

    摘要: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.