公开(公告)号：US20140070148A1

公开(公告)日：2014-03-13

申请号：US14024107

申请日：2013-09-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Suk Jun KIM ,  Keum Hwan PARK ,  Eun Sung LEE ,  Se Yun KIM ,  Jin Man PARK ,  Sang Soo JEE

IPC: H01B1/02

CPC classification number: H01B1/02

Abstract: According to example embodiments, a conductive powder includes a metallic glass and a coating on the surface of the metallic glass. The coating includes a metal. An article may include a sintered product of the conductive powder. A conductive paste may include the conductive powder. An electronic device may include a sintered product of the conductive paste.

Abstract translation: 根据示例性实施例，导电粉末包括金属玻璃和金属玻璃表面上的涂层。 涂层包括金属。 制品可以包括导电粉末的烧结产品。 导电膏可以包括导电粉末。 电子设备可以包括导电浆料的烧结产品。