公开(公告)号：US20210088872A1

公开(公告)日：2021-03-25

申请号：US17024960

申请日：2020-09-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Min Sang KIM ,  Yoon Seok KO ,  Boreum JEONG ,  Sang Soo JEE

IPC: G02F1/361 ,  C08K5/23 ,  C08L33/10 ,  G02F1/1516

Abstract: A composition for preparing a nonlinear optic material including an organic chromophore that is polarized by an electric field, a precursor that can form an inorganic material polymer by a sol-gel reaction, and a compatibilizer that can bind to both the organic chromophore and the inorganic material polymer, wherein the organic chromophore includes a functional group at a terminal end that can bind to both the inorganic material polymer and the compatibilizer, a nonlinear optic material prepared from the composition, a method of preparing the nonlinear optic material, and an electro-optic device including the nonlinear optic material are disclosed.

公开(公告)号：US20200332063A1

公开(公告)日：2020-10-22

申请号：US16919353

申请日：2020-07-02

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Hyunjeong JEON ,  Sang Soo JEE ,  Kyeong-sik JU

IPC: C08G73/14 ,  C09D179/08 ,  C08J5/18 ,  C08G73/10 ,  C08G18/60 ,  C08G18/76 ,  C08G18/73 ,  C08G18/64 ,  C08G18/75 ,  G02F1/1333

Abstract: A poly(amide-imide) copolymer including an amide structural unit having an amide bond in a polymer main chain and an imide structural unit having an imide bond in a polymer main chain, wherein at least one imide structural unit includes a moiety cross-linked to an adjacent polymer main chain through an amide bond.

公开(公告)号：US20190077917A1

公开(公告)日：2019-03-14

申请号：US16126270

申请日：2018-09-10

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Boreum JEONG ,  Sang Soo JEE ,  Won Suk CHANG ,  Kyeong-sik JU ,  Chanjae AHN ,  A Ra JO ,  Sungwon CHOI

IPC: C08G73/14 ,  C08J5/18 ,  G02B1/14

Abstract: A poly(amide-imide) copolymer that is a reaction product of a substituted or unsubstituted aromatic diamine having a maximum absorption wavelength in a range from 500 nanometers (nm) to 650 nm in a visible light region, a diamine represented by Chemical Formula 1, a dicarbonyl compound represented by Chemical Formula 2, and a tetracarboxylic acid dianhydride represented by Chemical Formula 3: wherein, in Chemical Formulae 1 to 3, A, R3, R10, R12, R13, X, n7 and n8 are the same as defined in the specification.

公开(公告)号：US20160264819A1

公开(公告)日：2016-09-15

申请号：US15056273

申请日：2016-02-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Soo JEE ,  Min Sang KIM ,  Hyunjeong JEON ,  Hongkyoon CHOI ,  Byunghee SOHN

IPC: C09D179/08 ,  B05D1/26

CPC classification number: C09D179/08 ,  B05D1/26 ,  B05D1/265 ,  C08G73/1042 ,  C08G73/1067 ,  C08K3/36

Abstract: A slot extrusion coating method includes: preparing a composition including a condensation polymerization product of a diamine and a mixture of an acid dianhydride or an acid dianhydride and a reactive carbonyl compound, an imidized product thereof, or a mixture thereof, wherein the composition has a viscoelasticity having a tan δ of less than about 96 at a strain of about 1 percent and an angular frequency of more than about 0 to less than about 10 radians per second, and coating the composition on a substrate using a slit coater.

Abstract translation: 狭缝挤出涂布方法包括：制备包含二胺与酸二酐或酸二酐与反应性羰基化合物的混合物的缩聚产物，其酰亚胺化产物或其混合物的组合物，其中组合物具有 在大约1％的应变和大于约0至小于约10弧度/秒的角频率下具有小于约96的tanδ的粘弹性，并使用狭缝涂布机将该组合物涂覆在基底上。

公开(公告)号：US20140000694A1

公开(公告)日：2014-01-02

申请号：US13904618

申请日：2013-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Soo JEE ,  Suk Jun KIM ,  Eun Sung LEE ,  Se Yun KIM ,  Jin Man PARK

IPC: H01L31/0224

CPC classification number: H01L31/0224 ,  H01B1/22 ,  H01L31/022425 ,  Y02E10/50

Abstract: A conductive paste may include a conductive powder, metallic glass, a metal precursor including an element forming a solid solution with the metallic glass, and an organic vehicle, and an electronic device and a solar cell may include an electrode formed using the conductive paste.

Abstract translation: 导电性糊剂可以包括导电性粉末，金属玻璃，包含与金属玻璃形成固溶体的元素的金属前体以及有机载体，电子器件和太阳能电池可以包括使用导电性糊剂形成的电极。

公开(公告)号：US20250011624A1

公开(公告)日：2025-01-09

申请号：US18761170

申请日：2024-07-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyune Jea LEE ,  Sang Soo JEE ,  Kee Chang LEE ,  Jung Hoon LEE

IPC: C09G1/02 ,  H01L21/321

Abstract: A polishing slurry and a method of manufacturing a semiconductor device using the polishing slurry. The polishing slurry includes plate-shaped particles having a Mohs hardness of less than or equal to about 5, and a spherical abrasive. The plate-shaped particles have a thermal conductivity in a dimensional direction of greater than or equal to about 10 W/mK, and the plate-shaped particles have a larger average particle size than the spherical abrasive. Also, the plate-shaped particles and the spherical abrasive are not chemically bonded to the other.

公开(公告)号：US20240247170A1

公开(公告)日：2024-07-25

申请号：US18409085

申请日：2024-01-10

Applicant: Samsung Electronics Co., Ltd. ,  POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION

Inventor： Yoon Seok KO ,  Dong Pyo KIM ,  Sang Soo JEE ,  Se Jun YIM

IPC: C09G1/16

CPC classification number: C09G1/16

Abstract: Provided are a polymer nanoparticle, a method of preparing the polymer nanoparticle, and a polishing slurry including the polymer nanoparticle are provided, where the polymer nanoparticle including a mixture of a hydrophobic polymer and a copolymer including both hydrophobic and hydrophilic groups, the hydrophilic group of the copolymer is disposed on an outer surface of the polymer nanoparticle.

公开(公告)号：US20180113350A1

公开(公告)日：2018-04-26

申请号：US15789695

申请日：2017-10-20

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Sang Soo JEE ,  Sun Jin SONG ,  Chanjae AHN ,  Sungwon CHOI

IPC: G02F1/1333 ,  C08G73/14 ,  C08K5/5419 ,  C08L79/08

CPC classification number: G02F1/133305 ,  C08G73/14 ,  C08J7/047 ,  C08J2379/08 ,  C08J2483/06 ,  C08K5/5419 ,  C08L79/08 ,  C09D183/06

Abstract: A flexible plastic substrate includes a film including a poly(amide-imide) copolymer; and a hard coating layer disposed on a first surface of the film, wherein the hard coating layer includes a crosslinked siloxane copolymer, and wherein the flexible plastic substrate has pencil hardness of greater than or equal to 2H under a vertical load of 1 kilogram according to ASTM D3363, a total light transmittance of greater than or equal to about 89% in a wavelength region of 350 nanometers to 750 nanometers.

公开(公告)号：US20170121460A1

公开(公告)日：2017-05-04

申请号：US15341318

申请日：2016-11-02

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Samsung SDI Co., Ltd.

Inventor： Sung Woo HONG ,  Chanjae AHN ,  Hyunjeong JEON ,  Sang Soo JEE ,  Hongkyoon CHOI ,  Byunghee SOHN ,  Sungwon CHOI

IPC: C08G73/14

CPC classification number: C08G73/14 ,  C08G73/1028 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1067

Abstract: A poly(imide-amide) copolymer, which is a product of a reaction between a diamine including an amide structural unit-containing oligomer represented by Chemical Formula 1 and a dianhydride represented by Chemical Formula 3: wherein, groups and variables in Chemical Formulae 1 and 3 are the same as described in the specification.

公开(公告)号：US20160280857A1

公开(公告)日：2016-09-29

申请号：US15081468

申请日：2016-03-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjeong JEON ,  Min Sang KIM ,  Sang Soo JEE ,  Byunghee SOHN

IPC: C08G73/10

CPC classification number: C08G73/106 ,  C08G73/10 ,  C08G73/1007 ,  C08G73/1017 ,  C08G73/1039 ,  C08G73/1067 ,  C08G73/14 ,  C08G77/455 ,  C08G77/80 ,  C08L79/08 ,  C08L83/04

Abstract: A composition including a polyamic acid modified with an alkoxysilane group; and an oligo silica compound, wherein the polyamic acid modified with an alkoxysilane group includes a reaction product of (i) a condensation reaction product of an acid anhydride and a diamine, and (ii) a reactive organosilane compound, wherein the oligo silica compound includes a condensation reaction product of an organosilane diol and a an alkoxysilane compound, wherein an amount of silicon atoms in the composition is less than or equal to about 15 wt % based on a total weight of solid contents in the composition.