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31.发明授权Method and apparatus for attaching heat sink to a component with a flexible leaf spring mount 失效用于将散热器连接到具有柔性板簧安装件的部件上的方法和装置公开(公告)号：US07102889B1
公开(公告)日：2006-09-05
申请号：US10950859
申请日：2004-09-27
申请人： Stephan Karl Barsun
发明人： Stephan Karl Barsun
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/308 , H01L2924/00
摘要： The apparatus and method may have the following: a spring element that pivots about a pivot axis; a flexible mount coupled to the spring element such that the pivot axis of the spring element is constrained; and at least one portion of the spring element contacting a heat sink, the spring element in combination with the flexible mount deforming to apply a controlled load to the heat sink.
摘要翻译： 该装置和方法可以具有如下：围绕枢转轴线枢转的弹簧元件; 耦合到弹簧元件的柔性安装座，使得弹簧元件的枢转轴线受到约束; 并且所述弹簧元件的至少一部分接触散热器，所述弹簧元件与所述柔性安装座组合变形，以将控制的负载施加到所述散热器。
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公开(公告)号：US07101211B2
公开(公告)日：2006-09-05
申请号：US10832673
申请日：2004-04-27
IPC分类号： H01R13/625
CPC分类号： H01R12/7076 , H01R31/06
摘要： A shroud for interacting with a circuit component defining a component surface having an array of pins extending from the component surface. The shroud includes a planar member defining an array of apertures complimenting the array of the pins. The planar member is configured to interact with the circuit component to maintain uniform contact between the pins and a corresponding socket.
摘要翻译： 用于与限定具有从部件表面延伸的销阵列的部件表面的电路部件相互作用的护罩。 护罩包括限定孔的阵列的平面构件，所述孔的阵列与销的阵列相匹配。 平面构件被配置为与电路部件相互作用以保持销和相应插座之间的均匀接触。
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33.发明授权公开(公告)号：US07079390B2
公开(公告)日：2006-07-18
申请号：US10456671
申请日：2003-06-05
IPC分类号： H05K7/20
CPC分类号： H05K7/20572 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for heat dissipation in a chassis housing an electronic system, and a method for implementing the same. The apparatus comprises a heat sink base for collecting thermal heat. The apparatus further comprises a fin thermally coupled to the heat sink base for dissipating the thermal heat. The fin is arranged in the chassis to direct air flow from a first direction, that is originally directed at said fin, to a second direction.
摘要翻译： 一种用于在容纳电子系统的底盘中散热的装置及其实现方法。 该装置包括用于收集热量的散热器基座。 该装置还包括热耦合到散热器基座以散热的热量的翅片。 翅片布置在底盘中以将来自第一方向的空气流从原来指向所述翅片引导到第二方向。
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34.发明授权Card guide that comprises card guide portions that serve to guide a circuit board into a chassis 失效卡引导件，其包括用于将电路板引导到底盘中的卡引导部分公开(公告)号：US06940727B2
公开(公告)日：2005-09-06
申请号：US10681841
申请日：2003-10-08
IPC分类号： H05K7/14
CPC分类号： H05K7/1418 , Y10T29/49128
摘要： A card guide of an apparatus in one example comprises a plurality of card guide portions that serve to guide a circuit board into a chassis. The plurality of card guide portions comprise a first card guide portion and a second card guide portion. The first card guide portion serves to guide the circuit board substantially along a first direction during engagement of the circuit board with the first card guide portion. The second card guide portion serves to guide the circuit board substantially along a second direction that is nonlinear with the first direction during engagement of the circuit board with the second card guide portion.
摘要翻译： 一个示例中的装置的卡引导件包括用于将电路板引导到底盘中的多个卡引导部分。 多个卡引导部分包括第一卡引导部分和第二卡引导部分。 第一卡引导部分用于在电路板与第一卡引导部分接合期间基本上沿着第一方向引导电路板。 第二卡引导部分用于在电路板与第二卡引导部分接合期间基本上沿着与第一方向非线性的第二方向引导电路板。
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公开(公告)号：US06798661B1
公开(公告)日：2004-09-28
申请号：US10434762
申请日：2003-05-08
IPC分类号： H05K720
CPC分类号： H01L23/467 , H01L23/427 , H01L2924/0002 , H05K7/20727 , H01L2924/00
摘要： A thermal dissipation apparatus for implementing chassis conducted cooling for a server. The apparatus includes a heat sink having a first surface and a second surface. The first surface is adapted to accept a chip thermal interface for a chip. The second surface is adapted to accept a chassis thermal interface for a chassis surface, wherein the second surface implements a thermal conductive path from the chip to the chassis surface.
摘要翻译： 一种用于为服务器实施底盘传导冷却的散热装置。 该装置包括具有第一表面和第二表面的散热器。 第一表面适于接受用于芯片的芯片热界面。 第二表面适于接受用于底盘表面的底盘热接口，其中第二表面实现从芯片到底盘表面的导热路径。
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公开(公告)号：US06767220B2
公开(公告)日：2004-07-27
申请号：US10671647
申请日：2003-09-25
IPC分类号： H01R1200
CPC分类号： H01R12/774 , H01R12/7005 , H01R12/79 , H01R13/629 , H01R13/639
摘要： System for electrically interconnecting components are provided. One such system comprises: a flex cable having a first end and a second end; a first connector attached to a electrically communicating with the first end of the flex cable; a second connector attached to and electrically communicating with the second end of the flex cable; and a first retention member extending outwardly from the flex cable.
摘要翻译： 提供用于电互连部件的系统。 一种这样的系统包括：柔性电缆，其具有第一端和第二端; 连接到与柔性电缆的第一端电连通的第一连接器; 连接到柔性电缆的第二端并与之电气连通的第二连接器; 以及从柔性电缆向外延伸的第一保持构件。
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公开(公告)号：US06658700B2
公开(公告)日：2003-12-09
申请号：US10053008
申请日：2001-11-02
IPC分类号： E05D502
CPC分类号： H05K5/0226 , E05D3/022 , E05D5/023 , E05Y2900/208 , E05Y2900/606 , G06F1/181 , Y10T16/554
摘要： A hinged-bezel system for use with electronic devices housed in equipment enclosures. The system, comprising a comb, a clamp plate, and a hinged bezel, extends the pivot of a hinge outward from the face of a equipment enclosure to allow full access to components within the equipment enclosure, through the front face of the equipment enclosure, without removing the hinged bezel. Additionally, the system allows the electronic device to be fully anchored to the equipment enclosure. The comb, mounted to the front face of the equipment enclosure, securely fastens to the clamp plate, which is attached to the front sidewall of the electronic device along with the hinged bezel.
摘要翻译： 一个铰链式挡板系统，用于安装在设备外壳中的电子设备。 包括梳子，夹板和铰链边框的系统将铰链的枢轴从设备外壳的表面向外延伸，以允许通过设备外壳的前表面完全访问设备外壳内的部件， 而不需要拆下铰链的挡板。 此外，该系统允许电子设备完全锚定到设备外壳。 安装到设备外壳前表面上的梳子牢固地固定在夹板上，夹板与铰接的表圈一起安装在电子设备的前侧壁上。
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公开(公告)号：US06608766B2
公开(公告)日：2003-08-19
申请号：US10052804
申请日：2001-11-02
IPC分类号： H05K900
CPC分类号： G06F1/182 , H05K9/0073
摘要： A bezel that includes a number of unitary EMI-shield-and-snap-retention features molded onto an inner surface of a bezel. The EMI-shield-and-snap-retention features partially fasten an EMI shield to the bezel, while also fastening the bezel to a snap attached to an equipment enclosure. Each feature contains two flanged and tapered guide strips flanking one or more ramp-shaped pieces. As the EMI shield is placed flat along the interior of the bezel, the flanged sections of the guide strips lie over top of the EMI shield, pressing the EMI shield against the interior of the bezel. As the bezel closes against the equipment enclosure, the tapered sections of the guide strips guide the snap up the ramp-shaped pieces. The snap gains tension ascending the ramp-shaped pieces. When the snap crests the ramps, tension is released in the snap, causing the convex tip of the snap to stay secured to the ramp-shaped pieces.
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