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公开(公告)号：US07198094B2
公开(公告)日：2007-04-03
申请号：US10600112
申请日：2003-06-20
CPC分类号： H01L23/467 , F28D2021/0029 , F28F3/02 , H01L2924/0002 , H01L2924/00
摘要： A device for removing heat from an electronic component, comprising a heat sink that can be coupled to the electronic component and conduct heat therefrom. A finned appurtenance coupled to the heat sink can transfer the heat into a fluid medium. The fins are oriented at an angle with respect to several flow streams of the fluid medium across the fins. Each flow stream follows a unique direction.
摘要翻译： 一种用于从电子部件移除热量的装置，包括可耦合到电子部件并从其传导热量的散热器。 耦合到散热器的翅片附件可将热量转移到流体介质中。 散热片相对于穿过散热片的流体介质的几个流动流以一定角度定向。 每个流动流都遵循唯一的方向。
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2.发明授权Pivot component coupled with first circuit board for control of relative alignment of first circuit board connection component with second circuit board connection component 有权与第一电路板耦合的枢轴组件，用于控制第一电路板连接部件与第二电路板连接部件的相对对准公开(公告)号：US06896539B2
公开(公告)日：2005-05-24
申请号：US10610144
申请日：2003-06-30
CPC分类号： H05K1/144 , H05K7/1417 , H05K7/142
摘要： A pivot component of an apparatus in one example is coupled with a first circuit board that comprises a first connection component. The pivot component controls a relative alignment of the first connection component with a second connection component of a second circuit board for an engagement of the first connection component with the second connection component.
摘要翻译： 一个示例中的装置的枢轴部件与包括第一连接部件的第一电路板耦合。 枢轴部件控制第一连接部件与第二电路板的第二连接部件的相对对准，用于使第一连接部件与第二连接部件接合。
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公开(公告)号：US06913069B2
公开(公告)日：2005-07-05
申请号：US10641502
申请日：2003-08-14
IPC分类号： F28F3/02 , F28F13/06 , H01L23/467 , F28F7/00
CPC分类号： F28F13/06 , F28F3/02 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： Described are devices for cooling a component, and methods thereof. The device includes a base that can be coupled to the component so that heat is transferred from the component to the base. The device also includes fins coupled to the base. The fins are arranged to funnel air from an air intake end of the device toward a location on the base.
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公开(公告)号：US07145775B2
公开(公告)日：2006-12-05
申请号：US10903000
申请日：2004-07-30
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/427 , H01L2924/0002 , H05K7/20727 , H01L2924/00
摘要： A thermal dissipation apparatus for implementing chassis conducted cooling for a server. The apparatus includes a heat sink having a first surface and a second surface. The first surface is adapted to accept a chip thermal interface for a chip. The second surface is adapted to accept a chassis thermal interface for a chassis surface, wherein the second surface implements a thermal conductive path from the chip to the chassis surface.
摘要翻译： 一种用于为服务器实施底盘传导冷却的散热装置。 该装置包括具有第一表面和第二表面的散热器。 第一表面适于接受用于芯片的芯片热界面。 第二表面适于接受用于底盘表面的底盘热接口，其中第二表面实现从芯片到底盘表面的导热路径。
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公开(公告)号：US06856518B2
公开(公告)日：2005-02-15
申请号：US10619026
申请日：2003-07-14
CPC分类号： G06F1/185 , G06F1/184 , G06F1/186 , H05K7/1418 , H05K7/1429
摘要： An assembly for supporting a short printed circuit card includes a card slot separator disposed in a card bay of a computer system and at least one card support block. The at least one card support block couples to the card slot separator and can be selectively positioned along the card slot separator for reception of an unsupported edge of the short printed circuit card.
摘要翻译： 用于支撑短的印刷电路卡的组件包括设置在计算机系统的卡槽中的卡槽分离器和至少一个卡片支撑块。 所述至少一个卡支撑块耦合到卡槽分离器，并且可以沿着卡插槽分离器选择性地定位以接收短印刷电路卡的未支撑边缘。
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6.发明授权公开(公告)号：US07079390B2
公开(公告)日：2006-07-18
申请号：US10456671
申请日：2003-06-05
IPC分类号： H05K7/20
CPC分类号： H05K7/20572 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for heat dissipation in a chassis housing an electronic system, and a method for implementing the same. The apparatus comprises a heat sink base for collecting thermal heat. The apparatus further comprises a fin thermally coupled to the heat sink base for dissipating the thermal heat. The fin is arranged in the chassis to direct air flow from a first direction, that is originally directed at said fin, to a second direction.
摘要翻译： 一种用于在容纳电子系统的底盘中散热的装置及其实现方法。 该装置包括用于收集热量的散热器基座。 该装置还包括热耦合到散热器基座以散热的热量的翅片。 翅片布置在底盘中以将来自第一方向的空气流从原来指向所述翅片引导到第二方向。
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7.发明授权Card guide that comprises card guide portions that serve to guide a circuit board into a chassis 失效卡引导件，其包括用于将电路板引导到底盘中的卡引导部分公开(公告)号：US06940727B2
公开(公告)日：2005-09-06
申请号：US10681841
申请日：2003-10-08
IPC分类号： H05K7/14
CPC分类号： H05K7/1418 , Y10T29/49128
摘要： A card guide of an apparatus in one example comprises a plurality of card guide portions that serve to guide a circuit board into a chassis. The plurality of card guide portions comprise a first card guide portion and a second card guide portion. The first card guide portion serves to guide the circuit board substantially along a first direction during engagement of the circuit board with the first card guide portion. The second card guide portion serves to guide the circuit board substantially along a second direction that is nonlinear with the first direction during engagement of the circuit board with the second card guide portion.
摘要翻译： 一个示例中的装置的卡引导件包括用于将电路板引导到底盘中的多个卡引导部分。 多个卡引导部分包括第一卡引导部分和第二卡引导部分。 第一卡引导部分用于在电路板与第一卡引导部分接合期间基本上沿着第一方向引导电路板。 第二卡引导部分用于在电路板与第二卡引导部分接合期间基本上沿着与第一方向非线性的第二方向引导电路板。
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公开(公告)号：US06798661B1
公开(公告)日：2004-09-28
申请号：US10434762
申请日：2003-05-08
IPC分类号： H05K720
CPC分类号： H01L23/467 , H01L23/427 , H01L2924/0002 , H05K7/20727 , H01L2924/00
摘要： A thermal dissipation apparatus for implementing chassis conducted cooling for a server. The apparatus includes a heat sink having a first surface and a second surface. The first surface is adapted to accept a chip thermal interface for a chip. The second surface is adapted to accept a chassis thermal interface for a chassis surface, wherein the second surface implements a thermal conductive path from the chip to the chassis surface.
摘要翻译： 一种用于为服务器实施底盘传导冷却的散热装置。 该装置包括具有第一表面和第二表面的散热器。 第一表面适于接受用于芯片的芯片热界面。 第二表面适于接受用于底盘表面的底盘热接口，其中第二表面实现从芯片到底盘表面的导热路径。
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公开(公告)号：US07082032B1
公开(公告)日：2006-07-25
申请号：US10648532
申请日：2003-08-25
IPC分类号： H05K7/20
CPC分类号： H01L23/367 , G06F1/185 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation apparatus comprising a base and a plurality of fins connected to the base and extending out from the base at a non-orthogonal angle to the base.
摘要翻译： 一种散热装置，包括基座和连接到基座的多个翼片，并且以与基座不正交的角度从基座延伸出来。
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公开(公告)号：US06676417B1
公开(公告)日：2004-01-13
申请号：US10308533
申请日：2002-12-03
IPC分类号： H01R1200
CPC分类号： H01R12/774 , H01R12/7005 , H01R12/79 , H01R13/629 , H01R13/639
摘要： Systems for electrically interconnecting components are provided. One such system comprises: a flex cable having a first end and a second end; a first connector attached to and electrically communicating with the first end of the flex cable; a second connector attached to and electrically communicating with the second end of the flex cable; and a first retention member extending outwardly from the flex cable.
摘要翻译： 提供用于电互连部件的系统。 一种这样的系统包括：柔性电缆，其具有第一端和第二端; 连接到柔性电缆的第一端并与之电连通的第一连接器; 连接到柔性电缆的第二端并与之电气连通的第二连接器; 以及从柔性电缆向外延伸的第一保持构件。
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