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31.
公开(公告)号:US20200218027A1
公开(公告)日:2020-07-09
申请号:US16390134
申请日:2019-04-22
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: SHIN-WEN CHEN , JIAN-CHAO SONG , SHENG-JIE DING , JING-WEI LI
Abstract: A photosensitive chip includes a photosensitive region, a non-photosensitive region and an adhesive layer. The non-photosensitive region protrudes from a periphery of the photosensitive region to surround the photosensitive region. The adhesive layer covers the non-photosensitive region to absorb light and reduce an intensity of light reflected from the adhesive layer. The disclosure also provides a lens module having the photosensitive chip, and an electronic device having the lens module.
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公开(公告)号:US20200186684A1
公开(公告)日:2020-06-11
申请号:US16547841
申请日:2019-08-22
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: SHIN-WEN CHEN , SHENG-JIE DING , JING-WEI LI , JIAN-CHAO SONG
Abstract: A circuit board assembly for a twin-camera module to avoid any heat-induced misalignments in manufacture is disclosed, to improve the production yield of the camera module. The circuit board assembly comprises at least two daughter boards and at least one first flexible printed circuit board. Each of the flexible printed circuit boards connects to adjacent two of the daughter boards. The disclosure also provides the twin-camera module comprising the circuit board assembly, and an electronic device comprising the camera module.
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公开(公告)号:US20200014893A1
公开(公告)日:2020-01-09
申请号:US16051125
申请日:2018-07-31
Inventor: JING-WEI LI , SHENG-JIE DING , JIAN-CHAO SONG , SHIN-WEN CHEN
Abstract: An optical projection module with improved heat dissipation efficiency includes a circuit board, a semiconductor substrate mounted on a surface of the circuit board, and a light source and an optical member mounted on a surface of the semiconductor substrate opposite from the circuit board. A hollow area is defined in the circuit board and in the semiconductor substrate to draw heat directly away from the light source and thus avoid physical distortion of the hardware which would otherwise reduce the quality of light beams emitted.
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公开(公告)号:US20190170994A1
公开(公告)日:2019-06-06
申请号:US15856081
申请日:2017-12-28
Inventor: KUN LI , SHIN-WEN CHEN , JING-WEI LI , SHENG-JIE DING
CPC classification number: G02B21/361 , G02B7/006 , G02B7/08 , G02B21/0008 , G02B21/02 , G02B21/362
Abstract: A camera module which collects incoming dirt and dust so as to prevent the accumulation of same on an optical element of the image-capturing process includes a microscope base and an optical filter unit. The microscope base includes a supporting portion. A first gap is formed in the supporting portion. The optical filter unit filter and adhesive layer formed on the optical filter. The optical filter is bonded on the supporting portion by the adhesive layer. The optical filter comprises a filter area in the optical filter. A surface of the adhesive layer facing away from the optical filter is adhesive. A second gap is formed in the adhesive layer. The filter area is exposed from the second gap. Parts of the adhesive layer and the filter area are exposed from the first gap.
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公开(公告)号:US20230126847A1
公开(公告)日:2023-04-27
申请号:US17562303
申请日:2021-12-27
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: JIAN-CHAO SONG , JING-WEI LI , SHIN-WEN CHEN , YU-SHUAI LI
Abstract: A lens module includes a circuit board and a photosensitive chip. The first rigid portion includes a first through hole. The lens module further includes a metal board. The metal board includes a metal body and a convex box located on one of the surfaces of the metal body. The circuit board is mounted on a surface of the metal board. The convex box is received in the first through hole. The photosensitive chip is mounted on the convex box. The disclosure also provides an electronic device having the lens module.
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36.
公开(公告)号:US20230065258A1
公开(公告)日:2023-03-02
申请号:US17719515
申请日:2022-04-13
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: YU-SHUAI LI , SHIN-WEN CHEN , JING-WEI LI , JIAN-CHAO SONG
Abstract: A lens base with improved strength and reduced size includes a bracket and a lens holder connected to the bracket. The bracket includes a cover plate and a side plate, the side plate connects to the cover plate to form a receiving groove, the cover plate defines a first aperture, the first aperture penetrates the cover plate. The lens holder faces away from the receiving groove, the lens holder defines a second aperture, the second aperture faces the first aperture.
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公开(公告)号:US20220247900A1
公开(公告)日:2022-08-04
申请号:US17515694
申请日:2021-11-01
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: SHIN-WEN CHEN , SHENG-JIE DING , JING-WEI LI , JIAN-CHAO SONG
Abstract: A camera module includes a supporting seat, a filter, and a lens assembly. The supporting seat defines a window passing through the supporting seat. An annular flange extending from an inner wall of the window towards the central axis of the window. The filter is fixed on the annular flange. The lens assembly is fixed on the supporting seat. The lens assembly includes a lens holder and a lens disposed in the lens holder. A surface of the supporting seat facing the lens assembly is recessed to form at least two receiving slots surrounding the window. A buffer layer is disposed in each of the at least two receiving slots. An orthogonal projection of the lens on a plane of the buffer layer at least partially overlaps with the buffer layer, and lens is spaced apart from the filter.
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38.
公开(公告)号:US20220006929A1
公开(公告)日:2022-01-06
申请号:US17366373
申请日:2021-07-02
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: JING-WEI LI , SHENG-JIE DING , JIAN-CHAO SONG , YU-SHUAI LI
Abstract: A camera module miniaturized in both width and length includes a baseplate, a lens assembly, and a bracket. The bracket includes a support plate and a support member disposed on the support plate. The support plate includes a first surface facing away from the baseplate and a second surface facing the baseplate. The support plate defines a first opening penetrating the first surface and the second surface. The lens assembly is disposed on the first surface and completely covers the first opening. The support member is located between the support plate and the baseplate. The support member includes a first support portion and a plurality of second support portions arranged at intervals, the first support portion is disposed on the second surface and surrounds the peripheral edge of the first opening. Each second support portion extends outwards from an outer surface of the first support portion.
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公开(公告)号:US20210318510A1
公开(公告)日:2021-10-14
申请号:US16860910
申请日:2020-04-28
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: JIAN-CHAO SONG , SHENG-JIE DING , SHIN-WEN CHEN , JING-WEI LI
Abstract: A lens module includes a substrate, a base mounted on the substrate, a lens holder mounted on the base, and a lens mounted in the lens holder. The base is made of metal material by die casting, and an outer surface of the base is darkened by oxidation treatment. The disclosure also provides an electronic device having the lens module.
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公开(公告)号:US20210168939A1
公开(公告)日:2021-06-03
申请号:US16860459
申请日:2020-04-28
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: JING-WEI LI , SHIN-WEN CHEN , DING-NAN HUANG , SHENG-JIE DING , JIAN-CHAO SONG
Abstract: A lens module includes a circuit board, a base mounted on the circuit board, and at least one electronic component mounted on the circuit board. The base comprises a first surface and a second surface facing away from the first surface. The second surface is mounted on the circuit board. The base further comprises at least one first hole passing through the first surface and the second surface. The at least one electronic component is received in the at least one first hole. The lens module further comprises a filling layer in each of the at least one first hole and located on a side of the at least one electronic component facing away from the circuit board. The disclosure also provides an electronic device having the lens module.
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