Method of manufacturing semiconductor memory device
    31.
    发明授权
    Method of manufacturing semiconductor memory device 失效
    制造半导体存储器件的方法

    公开(公告)号:US06383867B1

    公开(公告)日:2002-05-07

    申请号:US09597601

    申请日:2000-06-20

    CPC classification number: H01L28/91 H01L21/3212

    Abstract: A method for forming an inner cylinder type storage electrode of a semiconductor memory device, comprising the steps of: forming a first insulating layer on a substrate; etching the first insulating layer to form a contact hole, thereby exposing a portion of the substrate; forming a conductive film for a storage electrode over the first insulating layer including the contact hole; forming a photosensitive film in a portion of the contact hole over the conductive film; forming a second insulating layer to be completely filled in the contact hole over the photosensitive film; etching the second insulating layer and the conductive film to expose the first insulating layer, thereby forming the storage electrode; and removing the first and second insulating layers and the photosensitive film.

    Abstract translation: 一种用于形成半导体存储器件的内筒型存储电极的方法,包括以下步骤:在衬底上形成第一绝缘层; 蚀刻第一绝缘层以形成接触孔,从而暴露基板的一部分; 在包括所述接触孔的所述第一绝缘层上形成用于存储电极的导电膜; 在导电膜上的接触孔的一部分中形成感光膜; 形成完全填充在感光膜上的接触孔中的第二绝缘层; 蚀刻第二绝缘层和导电膜以暴露第一绝缘层,从而形成存储电极; 以及去除第一和第二绝缘层和感光膜。

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