公开(公告)号：US11107702B2

公开(公告)日：2021-08-31

申请号：US16924600

申请日：2020-07-09

Applicant: Samtec, Inc.

Inventor： Fred Koelling ,  Alan D. Nolet ,  Daniel Long

IPC: H01L21/48 ,  H01L23/498 ,  B22F7/08 ,  B22F3/15 ,  B22F1/02 ,  H01L23/15

Abstract: A method to reduce the number and type of processing steps to achieve conductive lines in the planes of a substrate concurrently interconnecting conductor through the substrate, by forming structures in the planes of a substrate. These structures may include interconnect lines, bond pads, and other structures, and improve the performance of subsequent unique processing while simultaneously reducing the manufacturing complexity to reduce time and cost. These structures are formed by selective etching using chemical mechanical polishing, and then completed using a single fill step with a conductive material.

公开(公告)号：US11089716B2

公开(公告)日：2021-08-10

申请号：US15929123

申请日：2019-04-11

Applicant: Samtec, Inc.

Inventor： Thomas A. Hall, III ,  Kevin R. Meredith

IPC: H05K7/20 ,  G02B6/42

Abstract: A transceiver assembly includes a cage and a heatsink. The cage includes first and second spaced apart walls and a third wall that spans the first and second walls. The third wall defines an opening, and the third wall includes two spring arms that each extend into the opening. The heatsink includes a heatsink body including a first surface and a protrusion that extends from the first surface of the heatsink body and a pair of spring-arm receivers positioned on the first surface of the heatsink body. Each of the pair of spring-arm engagement portions is configured to engage with a corresponding one of the two spring arms of the cage when the heatsink is attached to the cage.

公开(公告)号：USD926705S1

公开(公告)日：2021-08-03

申请号：US29773721

申请日：2021-03-11

Applicant: Samtec, Inc.

Designer： Randall E. Musser ,  Jonathan E. Buck

公开(公告)号：US11056838B2

公开(公告)日：2021-07-06

申请号：US16629308

申请日：2018-08-22

Applicant: Samtec, Inc.

Inventor： Gary E. Biddle

IPC: H01R13/6583 ,  H05K1/18

Abstract: A receptacle includes a cage, a bezel opening in the cage, and at least one bezel clip mounted adjacent to the bezel opening. The at least one bezel clip includes first bezel fingers and second bezel fingers. The first bezel fingers are located along an inner surface of the cage. The second bezel fingers include outer fingers located along an outer surface of the cage and inner fingers located along the inner surface of the cage. The inner and outer fingers of the second bezel fingers are defined by the second bezel fingers passing through a through hole in the cage.

公开(公告)号：US20210151934A1

公开(公告)日：2021-05-20

申请号：US16632720

申请日：2018-07-20

Applicant: SAMTEC, INC.

Inventor： Chadrick Paul FAITH

IPC: H01R13/627 ,  H01R13/506 ,  H01R12/72

Abstract: A first electrical connector includes a first latch that is configured to releasably engage a second latch of a second electrical connector when the first and second electrical connectors are mated to each other. The first latch can include an attachment portion that attaches to the connector housing of the first electrical connector, and an engagement portion that is movable with respect to the attachment portion between an engaged position and a disengaged position.

公开(公告)号：US20210151914A1

公开(公告)日：2021-05-20

申请号：US17126117

申请日：2020-12-18

Applicant: Samtec, Inc.

Inventor： Jonathan Earl Buck ,  Keith Guetig

IPC: H01R12/59 ,  H01R12/70 ,  H01R12/71 ,  H01R12/85 ,  H01R13/6471 ,  H01R43/20

Abstract: An electrical connector includes electrical contacts that are configured to be mounted to an electrical cable, and mating ends that are configured to be surface mounted to a contact pad of an underlying substrate, such that the mating ends flex and apply a pressure against the contact pad.

公开(公告)号：US10892585B2

公开(公告)日：2021-01-12

申请号：US16345316

申请日：2017-10-26

Applicant: SAMTEC INC.

Inventor： Jignesh Shah ,  Jean Karlo Williams Barnett ,  Eric Zbinden

IPC: H01R13/631 ,  H01R13/627 ,  G02B6/42 ,  H01R12/71

Abstract: An interconnect module, such as a transceiver is configured to mate with a host module that includes first and second electrical connectors. The interconnect module includes first and second pluralities of lands that are spaced from each other. The interconnect module can be mated with the host module such that the first lands mate with the first electrical connector, and the second lands mate with the second electrical connector. As the interconnect module is mated with the host module, the first lands can pass over mating regions of the electrical contacts of the second electrical connector without wiping against the mating regions. The interconnect module can be used in both front panel mount and mid board mount applications.

公开(公告)号：US10751079B2

公开(公告)日：2020-08-25

申请号：US16276708

申请日：2019-02-15

Applicant: Ethicon LLC ,  SAMTEC INC.

Inventor： Eric Roberson ,  James E. Borgelt ,  Douglas E. McCartin

IPC: A61N7/02 ,  A61B17/32 ,  A61B90/00 ,  A61B17/00 ,  A61B18/00

Abstract: A surgical instrument for use during a surgical procedure includes an instrument body, an ultrasonic transducer assembly extending along a longitudinal axis, a power cord, and a transducer slip joint. The ultrasonic transducer assembly is rotatably mounted within the instrument body about the longitudinal axis and defines a first outer profile. The power cord projects from the instrument body to provide electrical power to the ultrasonic transducer assembly for operating an acoustic waveguide. The transducer slip joint is positioned between the power cord and the ultrasonic transducer assembly and electrically and mechanically connects the power cord to the ultrasonic transducer assembly. The ultrasonic transducer assembly selectively rotates relative to the power cord for inhibiting the power cord from winding upon rotation of the ultrasonic transducer assembly. The transducer slip joint also defines a second outer profile that fits within the first outer profile of the ultrasonic transducer assembly.

公开(公告)号：US10593562B2

公开(公告)日：2020-03-17

申请号：US15861518

申请日：2018-01-03

Applicant: SAMTEC, INC.

Inventor： Fred Koelling ,  Alan P. Nolet ,  Daniel Long

IPC: H01L21/48 ,  H01L23/498 ,  B22F7/08 ,  B22F3/15 ,  B22F1/02 ,  H01L23/15

Abstract: A method to reduce the number and type of processing steps to achieve conductive lines in the planes of a substrate concurrently interconnecting conductor through the substrate, by forming structures in the planes of a substrate. These structures may include interconnect lines, bond pads, and other structures, and improve the performance of subsequent unique processing while simultaneously reducing the manufacturing complexity to reduce time and cost. These structures are formed by selective etching using chemical mechanical polishing, and then completed using a single fill step with a conductive material.

公开(公告)号：USD877700S1

公开(公告)日：2020-03-10

申请号：US29610936

申请日：2017-07-17

Applicant: Samtec, Inc.

Designer： Jonathan E. Buck ,  John A. Mongold